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Micropearl SOL?Plastic Core Solder Ball?
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Solder ball for mounting with soft and uniformly-sized
plastic core.
Improving reliability of SMT with underfill-less
and good rework ability for better yield
Index
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Feature
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Uniformly-sized plastic core produced
by Sekisui unique technology
- becomes buffer for stress of
solder ball
- enable to control accurate gap
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Composition and Lineup
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Copper and solder coated on high-heat
resistance plastic Variety lineup meets your requirement
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Reliability Data
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Drop Test and Thermal Cycle Test
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Other Properties
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Same as solderball for performance
of mechanical strength and elrctricity/heat property
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Mounting Properties
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General ball placement machine available
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Recommended Use
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Reduction in size and weight and High
Density of your package and module are enable.
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Feature >> more
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Excellent reliability
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By
stress relaxation of plastic core, the stress doesn't
concentrate on the solder joint.
In a temperature
cycle and drop test, SOL gets a high evaluation result.
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Gap holding ability
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It
doesn't occur to transform bolow the core size.SOL holds
ideally gap between board and package.
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Holding transmission lines
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Because
SOL doesn't transform below own core size,the transmission
line is not out of order from a design value.
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Application >>more
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WLCSP
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- Underfill less
- High Reliability?TCT,
Drop?
- Example: Mobile, Digital Camera
Analog
IC
(Heated
Power Supply, Amplifier)
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Ceramic BGA
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CTE:Ceramic<<Glass
Epoxy > Big Stress!
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- High Connection Reliability
(Dissolving
mismatch of materials)
- ?Example: Communication module
Module
for Industrial use
MCU,CPU
Multi chip module?
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Mounting both sides / POP
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- Keeping Stand-off Height
- Control Circuit Length
(Stabilization
of electric property)
- Example: Mobile
Wireless LAN Module
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Micropearl SOL
