Coating / Adhesive Material

SEKISUI High Resolution 3D Printer (Inkjet) Materials

What is 3D Printer (Inkjet) ?

Fine particle of materials jetted from numerous nozzles in printer head.

Inkjet based additive manufacturing with high resolution enable any types of structures (circles, lines etc.) printed anywhere.

Two ink types are available

Various sizes / shapes can be printed depending on your requirements.
Please contact us for more details.

Coating Material

Application Example

High-Aspect Ratio Microstructures

Glass Wafer
(Width:77um, Height:700um)

1.Underfill Dam

BGA Substrate
Width:100um
Height:20um

2.Pillar for CMOS

Glass wafer
Width:300um
Height:40um

3.Solder Mask

Substrate
Opening:150um
Height:20um

Process Flow

Other applications are possible depending on your requirements.
Please contact us for more details.

Adhesive Material

Application Example

Gap Fill / Encapsulation

1. For Die Attach

2. For FOD (Film On Die) structure

  Film Dispense SEKISUI
3D Printer
Flexible
Structure
Patterns
×
Thickness
Stability
×
Gap Filling
Property
×

Process Flow

Other applications are possible depending on your requirements.
Please contact us for more details.

  • Heat release Fin

    This is the heat release com-
    ponent integrated with metal. It shows high heat releasing / insulation performance.
  • Heat conductive paste

    This is the heat conductive paste with high thermal conductivity.
     
  • Heat release sheet

    This is the thermosetting type epoxy resin sheet with excellent thermal conductivity.
  • White solder resist

    This is the white solder resist for LED printing circuit board.