Sekisui's heat release technology
Introduction of Sekisui's materials/processing/evaluation technologies
Application examples of our products
Downsizing/ faster processing speed/ higher power of electronic components requires thermal countermeasure for products in various fields, such as mobile instrument, automotive devices, and inverter component. Sekisui Chemical Co., Ltd. provides unique epoxy-based thermal conductive insulation materials in various forms according to specific needs, and we receive high evaluations for our products from the markets.
Special processing method / check / inspection
Ultra high precision punching process
Punching process, utilizing equipment with image recognition system, enables ultra-high-precision processing of materials.
Punching process without shear droop
It is possible to perform punching process without shear droop in cross section by special punching process technology.
Patterning process of thick copper
It is possible to apply pattern process on thick copper form with more than 1mm thickness.
Fully-automatic warpage detection evaluation
We introduced fully-automatic warpage detector in our own design.
Evaluation / Simulation technology
For developing better performance heat release materials and products, Sekisui Chemical has various kinds of evaluation instruments.
Sekisui Chemical has thermal characteristic evaluation / simulation insturuments of various kinds of devices,
By a combination of thermal characteristic evaluation and simulation of our actual products in production, we continue to make effort in order to offer more effective solutions for heat release technology.