Heat release fin

This is the heat release component with high heat releasing / insulation performance, applicable to various types of power semiconductor devices. "Excellent thermal resistance" and "high reliability" enable to replace ceramic substrate. We provide this product in various sizes / forms according to specific purpose.

N-Fin series

This is the B-stage state copper-clad thermal conductive sheet, with excellent heat releasing /adhesive / insulation properties, applicable to devices such as Transfer mold type power semiconductor devices.

Distinctive feature 1

Application to wide range of materials
It is possible to combine with various kinds of materials / thickness, for its excellent sheet and adhesion properties. Please consult us for unification with work pieces in different forms, with uneven or rough surface conditions.

Distinctive feature 2

Stable adhesive property
It has a very high degree of smooth and flat adhesive surface, allowing temporary attachment to working material in typical condition.

Distinctive feature 3

Special processing technology/ quality management technology
We conduct processing with steady performance, by the quality management technology based on our experience developed in our long history.

P-Fin Series

This is the pattern forming type heat release component, with excellent heat releasing / insulation properties and reliability, and applicable to devices such as Transfer mold type or Case type power semiconductor devices.

Distinctive feature 1

Thermal resistance of this product is equal to or less than that of ceramic substrate, by its high thermal conductivity and insulation properties.

Distinctive feature 2

This product shows equal to or more than that of ceramic substrate for reliability, by its high adhesion and thermal resistance properties.

Distinctive feature 3

It is possible to provide punching process according to the needs of customers, such as punching process of super-thick copper form over 1mm thickness, without any flash in end faces by special punching process technology.

Distinctive feature 4

We produce minute simulation models from thermal characteristic evaluation of a module in order to provide best possible materials and products.

T-Fin Series

This is the ultra-thin, B-stage type copper clad thermal conductive sheet, applicable to semi-conductor or other small components as thermal interface material (TIM) applied in-between their layered elements.

Distinctive feature 1

High level processing technology
We promote stable adhesion of work pieces by utilizing special processing method to manage the occurrence of flash.

Distinctive feature 2

Adhesion to various materials
This product retains high degree of adhesiveness to various types of metals and others.

Metallic materials N/cm2 Note
Al > 100 Die shear test
Cu > 100
Ni > 100
Si > 100

Distinctive feature 3

Retaining thinness of film while maintaining high heat dissipation performance
It is possible to produce low thermal resistant device components by retaining thinness of film while maintaining high heat dissipation performance.