Heat conductive paste
This is the heat conductive paste with high thermal conductivity and fast curability.
This is the solventless type thermal conductive paste with high fluidity, applicable to overmold thermal-radiating device without bubbles, by its excellent heat release property and reliability. It is a fluid type applicable to flexible substrate.
It is possible to easily manage temperature of components, by applying NT series over thermal radiating components and curing in oven.
Verification of heat dissipation effect by thermography
Properties of NT series
|Physical Property||Conventional Type||High heat release type||Remarks|
|Before curing||Viscosity (Pa・s)||65||75||Type B,10rpm,at 25℃|
|Thixotropic index||1.8||2.1||Type B,1rpm/10rpm,at 25℃|
|Gelling time (sec)||120||120||150℃ Hot Plate|
|Tack-free time (sec)||300||300||150℃ Hot Plate|
|2.5||3.5||ASTM E 1461|