Heat conductive paste

This is the heat conductive paste with high thermal conductivity and fast curability.

NT series

This is the solventless type thermal conductive paste with high fluidity, applicable to overmold thermal-radiating device without bubbles, by its excellent heat release property and reliability. It is a fluid type applicable to flexible substrate.

Application examples

It is possible to easily manage temperature of components, by applying NT series over thermal radiating components and curing in oven.

Verification of heat dissipation effect by thermography

Properties of NT series

Physical Property Conventional Type High heat release type Remarks
Stage M.P. Under development  
Before curing Viscosity (Pa・s) 65 75 Type B,10rpm,at 25℃
Thixotropic index 1.8 2.1 Type B,1rpm/10rpm,at 25℃
Gelling time (sec) 120 120 150℃ Hot Plate
Tack-free time (sec) 300 300 150℃ Hot Plate
Ash content(%) 86.2 87.2 -
After curing color Brown Brown -
Volume
resistivity (Ω・cm)
3×1010 5×1010 IPC-TM-650 TM.2.5.17.1
Thermal
conductivity (W/m・K)
2.5 3.5 ASTM E 1461
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