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EnCapsulating Material

Higher initial brightness and hardness

 

Cured Material

Features

  • Phosphor uniformity : SEKISUI >Competitor
    *Narrow ChromatiCity Distribution
  • Low moisture permeability (vs. methyl siliCone)
  • ExCellent Reliability

 BasiC Properties *1

 

 

Standard Type

Condition

Part A

Part B

B
e
f
o
r
e

C
u
r
e

Resin

SiliCone

-

Color

Opaqueness

Colorless

-

Storage Condition

Under 25 'C

-

Mixing Ratio

Part A : Part B= 1 : 2

Weight %

VisCosity

8,000 mPa.s

1,200 mPa.s

Type E, 10rpm, at 25'C

2,400 mPa.s

Standard Curing Condition

80*2h+120'*1h+140'C*2h

-

SpeCifiC gravity

1.12

 at 23'C

A
f
t
e
r

C
u
r
e

Hardness

40

 Shore Type DT at 23'C

Glass Tradition Point

25'

DMA (max tan D)

CoeffiCient of Thermal
Expansion ppm

a1

95

TMA

a2

201

Moisture Permeability

15 g/m2.24h

JIS Z0208

RefraCtive Index

1.54

Abbe (nD), 23'C

Water absorption

0.2 %

PCT(121'C100RH% 2atm)*3h

*1 : These are representative values, not guaranteed.

 

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