Semiconductor Production Process

BG is an abbreviation of back grind. It is in the late-stage processes of semiconductor production and is a process that grinds a wafer thinly from its backside after circuit patterns have been formed on the wafer surface in the early-stage processes. BG tape used in this process is an essential material, and not only tape but wax and adhesive are also used. Recently, many features such as heat and chemical resistance are required for BG tape as the semiconductor processes have become increasingly complex.

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A type of IC chip packaging method. The electrodes pins do not protrude around the package, making it ideal for product miniaturization. It uses a grid layout for the external connection terminals on the ball-shaped terminals, with solder balls used for the ball-shaped terminals. The pin-type version is called PGA (Pin Grid Array).

BU film is used as an insulating material for semiconductor package substrates that connect semiconductor chips to motherboards and is used for forming fine wiring. As electronic devices require finer wiring and faster communication, this film needs to minimize transmission loss. Additionally, as devices become thinner, it also needs to prevent the warping of the thinned substrates.

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An insulating material used to form sharp dams on substrate islands for chip mounting or around the periphery of mounted CSP/BGA packages. Its purpose is to control the flow of die attach paste during chip bonding and manage the filling area for underfill. This material has excellent moldability and is a high-reliability solution for reducing package warpage.

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Dicing is an important and essential process in the late-stage processes of semiconductor production. It is a process that cuts a wafer—on which circuits have been formed—and separates it into individual chips. Dicing methods include blade, laser, and plasma dicing. Blade dicing is widely used, but laser or plasma dicing is sometimes chosen to reduce mechanical damage to the chips, to accommodate very small chips, and in consideration for the environment.

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Dry etching is a method that removes unnecessary parts physically or chemically using ions in plasma or using reactive gas in a dry way. Generally, dry etching often refers to reactive ion etching, or RIE. Since dry etching allows highly precise shape control and does not require waste liquid treatment, it is used in many production processes.

Fan-out packaging refers to wiring on a larger area than the silicon chip. Fan-out wafer-level packaging (FOWLP), which uses this technology, allows high density wiring while minimizing package thickness by placing many I/O pins in a space around the chip on a redistribution layer (RDL) instead of a conventional plastic substrate to feature higher performance and a thinner shape. In addition, its structure allows multiple silicon chips to be placed.

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FC-BGA is a high-density semiconductor package substrate for high-speed LSI (Large Scale Integration) devices that uses ball-shaped terminals known as bumps to attach and encapsulate a chip on an ultra-thin substrate. It offers fast data processing capabilities and excellent heat dissipation, and is commonly used in computers, servers, and networking equipment.

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A filler is a material that is used to fill in space or cavity, referring to small particles or powders added to materials. By compounding fillers with various functions, such as thermal and electrical conductivity, into resins, the filler-composite materials surpasses the functionality of the resin alone. The materials are used in a wide range of applications, from smartphone to airplanes, for their heat resistance and high strength.

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Flux is a chemical agent used for the soldering process in semiconductor production. It removes oxides and foreign substances on metal surfaces to improve solder wettability. Due to the increasing need for reducing processes in recent years, high performance flux materials are also attracting attention.

A substrate in which conductive metals such as copper foil are laminated to a base film like polyimide to form electrical circuits. It is also called as a "Flexible Printed Circuit (FPC) board," it is extremely thin and lightweight. Unlike rigid substrates, it is also highly flexible and bendable, making it suitable for use in bending parts, three-dimensional configurations, and slight gaps in electronic equipment. With an increasing demand for smaller, lighter, and thinner devices, FPCs are used in a wide range of electronic devices such as smartphones and LCD televisions.

Glass Wafer Support System (GWSS) is a temporary bonding and debonding (TBDB) material proposed by SEKISUI CHEMICAL to solve issues such as cracking and chipping of ultrathin semiconductors when transported and warpage of ultrathin wafers. The removable UV tape SELFA—which releases itself by UV irradiation and developed by SEKISUI CHEMICAL—is used to realize GWSS. For leading-edge semiconductors where the TBDB application is in great demand, research and development efforts are being made continuously to further improve performance such as heat and chemical resistance.

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High Bandwidth Memory (HBM) is a memory standard defined by JEDEC that uses Through-Silicon Via (TSV) technology for die stacking. HBM is a type of DRAM (Dynamic Random Access Memory) designed to transfer large amounts of data at once, offering 10 to 100 times the data transfer speed compared to traditional DRAM used in PCs. It is utilized in applications such as GPUs (Graphics Processing Units), HPC (High-Performance Computing), and AI (Artificial Intelligence) for tasks like image processing and machine learning due to its high data transfer rates.

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Molding is a semiconductor process that uses materials such as thermosetting resin to enclose chips after the bonding process to protect the chips from the effects of factors such as external impact, temperature changes, and humidity. There are two types of molding: transfer molding that injects and feeds resin, and compression molding that dips an object into melted resin to shape it.

Package on Package (PoP) is an assembling method that stacks a semiconductor package on another semiconductor package. This is a technology that allows higher performance and smaller/thinner shapes by stacking semiconductor packages to make full use of the limited space. This technology is rapidly evolving recently as it provides another advantage of faster operation by allowing two packages exchanging data to be closely placed. It is mainly used for mobile devices and consumer electronics.

TIM (Thermal Interface Material) is a type of thermal conductive material designed to efficiently transfer heat from electronic devices to cooling systems. By providing effective thermal management, TIM ensures that semiconductor devices operate reliably and perform optimally.

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Through-silicon via (TSV) is an electrode made of a through via filled with copper and is formed on silicon interposers and semiconductor chips. With the TSV structure, chips can be stacked to minimize the mounting footprint and wiring and reduce their sizes, increase performance, and save power.

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A liquid thermoset resin used for encapsulating integrated circuits. It acts as an adhesive to protect solder joints, which connect electronic components to printed circuit boards, from cracking due to impacts or heat. Underfill is required to have properties such as impact resistance and reworkability.

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A wafer is a material used in semiconductor device manufacturing. It is a disk-shaped substrate made by thinly slicing a cylindrical ingot made of a material such as highly controlled, single-crystal silicon.