Anisotropic Conductive Paste for reflow soldering

1. Characteristic

  • Low-temperature, pressure-free reflowing is available
  • Underfill function already installed
  • More applicable for fine pitch design than solder paste.
  • Applicable for a lot of variety of electrodes (AU, Ag, Cu, etc.)

2. Application example

Screen Print Mount & Reflow X-ray
LED
Connecter

Recommendation

  • Parts without warpage
  • Parts or area that should be avoided to be heat-pressed
  • Where electrodes are lined on one axis

3. Summary

SAP(Epoxy resin + solder particles + flux + curing agent)

SAP(Epoxy resin + solder particles + flux + curing agent) SAP(Epoxy resin + solder particles + flux + curing agent)02

Assembly Behavior of SAP