高性能塑膠、下一代顯示器等的積水化學TOPICS一覽。

We will exhibit at Advanced Packaging and Chiplet Summit

Tokyo Big Sight (East Exhibition Hall)
Dec 11 to 13, 2024 (10:00 am–5:00 pm JST)

For top players in semiconductor packaging and PCB mounting
Join APCS to partake in advancing the semiconductor packaging technology and uncovering growth opportunities

Exhibit Products：

High Adhesion-easy Removable UV Tape SELFA™
Clean Container series
High-viscosity inkjet ink
EPOXY FLUX (Under development)
Adhesive (PSA) Dot Connector

Sekisui Chemical Exhibit Area East Exhibition Hall 3452

We provide advanced high-performance materials that help solve social issues.
Please stop by our booth.

2024.11.12

Participation in International Conference 3DIC 2024 (Academic Presentation & Booth Exhibition)
(IEEE International 3D Systems Integration Conference 2024)

Date: September 25-27, 2024 (Wed-Fri)

Venue: September 25, 2024 at Hotel Metropolitan Sendai
September 26-27, 2024 at Sendai Kokusai Hotel

Official Website: https://3dic-conf.org/

Our Schedule
■ Session Presentation

Title: "A Temporary Bonding De-Bonding Tape with High Thermal Resistance, Easy Peeling and Excellent TTV for 3DIC"
Presentation Date & Time: September 26, 10:45 AM - 11:05 AM

※3DIC_Program_Schedule : For more details

■ Booth Exhibition