Heat release sheet

This is the thermosetting type epoxy resin sheet with excellent thermal conductivity and insulation properties. It has a high adhesive property to metal, providing excellent reliability without special preliminary treatment such as anodizing treatment. In addition, 1~3W/m*K grade sheet works well for embedding, and highly applicable for substrate inside of device components or others.

KNDJ, SH series

This is the B-stage state thermosetting type epoxy resin sheet filled with thermal conductive filler in high density.

Product lineup

Purpose Grade Thermal conductivity Form of samples Standard thickness(μm)
LED KNDJ002(Middle) 1.5 W/m・K Sheet / RCC /
Fin / MCCL
80
Power Module KNDJ001(High) 2.5 W/m・K Sheet / RCC /
Fin / MCCL
80
SH006(Super High) 5.5 W/m・K Sheet / RCC /
Fin / MCCL
80

Application examples

This product is highly applicable to multilayer / metal core substrates for its excellent pattern followability and ease of embedding.

  • Heat release Fin

    This is the heat release com-
    ponent integrated with metal. It shows high heat releasing / insulation performance.
  • Heat conductive paste

    This is the heat conductive paste with high thermal conductivity.
     
  • White solder resist

    This is the white solder resist for LED printing circuit board.
  • Coating / Adhesive Material

    High resolution additive manufacturing with anywhere any shape (lines/circles etc.) printing.