SEKISUI High Resolution 3D Printer (Inkjet) Materials

High aspect barrier rib
forming materials

Materials for forming barrier ribs on substrates

Adhesive materials

Adhesive materials for mounting parts and creating air cavities

Advantages of Sekisui 3D inkjet materials

Photoactivity and viscosity adjustable to the limit

General inkjet ink, when ejected from an inkjet head, lands on the substrate and spreads in a wet state. Sekisui 3D mounting materials, on the other hand, adjust the photoactivity and viscosity of high-viscosity materials to the utmost limit, which is difficult to adjust with general industrial inkjet devices, while maintaining excellent inkjet ejection. This allows for the application of high-resolution patterns with minimal spreading and less wetting upon landing. As a result, thin and high application, which is difficult with other methods such as dispensing, can be achieved.

Printing examples

High-resolution printing is possible in any desired area in any desired shape.

Printing is possible in various sizes and shapes including cylinder and vertical plate shapes. Different applications are available. Please feel free to contact us for more details.

Cylinder shape
Vertical pillar- and plate- shape

High aspect barrier rib forming material

Features of a structure in which barrier ribs are formed between LED chips with our 3D mounting material (Barrier rib forming material)

High brightness/High contrast

This material can be applied only between LED chips, not on them, so that barrier ribs will be formed to avoid a mixture of colors. making it possible to realize high brightness and high contrast.

Features of a structure created when our 3D mounting material (Barrier rib forming material) is applied to DAMs

Smaller substrates

The Sekisui inkjet material can be coated thinly on DAMs, thus realizing smaller substrates.

Improved production efficiency

The Sekisui inkjet material enables the thinning of DAMs, allowing for high-density mounting of substrates and achieving improved quality and increased production efficiency. Thinner DAMs can be produced than those produced by the dispenser.

Features of a structure created using the 3D mounting material (Barrier rib forming material) is used on a coil insulation film

Increase the power efficiency of a coil

Coil density can be increased by thinning the copper (Cu) insulation film, thereby improving the power efficiency of the coil.

Lower production costs

There is no need for exposure and development processes, which allows for process simplification and cost reduction through material reduction. This barrier rid forming material is applicable to coils for wireless power supply systems.
Reducing the number of materials used can also lead to a reduced environmental impact of phtolithography.

Adhesive materials

Feature of the structure created using the 3D mounting material

Thinner camera modules and lower costs

This adhesive can be finely applied, which allows for no glass holding unit, thinner camera modules, and lower costs.
Adhesion to narrow bezels, which is difficult with dispensers, becomes possible, allowing the mounting of more components and contributing to multifunctionality.

Features of the structure created using the 3D mounting material (Adhesive)

Thinner packages

The 3D mounting material (Adhesive) eliminates the need for film used for forming an air cavity, making packages thinner.

Simplified processes

Process reduction can be achieved through the formation of an air cavity during the assembly. The material can be used for MEMS electronic components that require an air cavity.

Material for forming an air cavity in MEMS
(designed for lid attachment)

Feature of the structure created using the 3D mounting material (Adhesive)

Thinner packages

The adhesives can be finely applied, allowing for smaller and thinner packages.

Features of the structure created using the 3D mounting material (Adhesive)

vs. film ： Thinner /　vs. non-conductive paste (NCP) : Excellent flatness and efficiency in the use of materials

The thin-film application of the 3D mounting material (Adhesive) to the substrate can realize good metal-to-metal bonding.

What is inkjet ?

Features of inkjet

Inkjet is generally used to print by ejecting microdroplets, each of which has a diameter of 20μm, of photocurable ink from the nozzle of an inkjet head, with the following features.

1On-demand printing

Printable in any shape, such as circles and straight lines, on the desired places : No need for processes such as etching, making it possible to reduce processing processes

2Non-contact printing

Printable on uneven surfaces of the substrates

3No need for screen masks

Printable with reduced materials

What are Sekisui high-resolution 3D mounting materials ?

Generally, mounting means attaching parts (or components) to a substrate. With our 3D mounting materials, parts of various shapes can be attached to substances through a variety of application methods such as super high aspect 3D application and ultrathin-film application methods. We mainly offer two types of 3D mounting materials.

Process flow & Usage example
Download Documents