Semiconductor-related materials
SEMICONDUCTOR

We provide products such as tape, film, resin, and micro-particles for semiconductor wafer manufacturing and packaging.

Next-generation display-related materials
NEXT-GENERATION DISPLAY

We provide sealing materials and shock-absorbing materials for displays such as OLED and μLED.

AR/VR related materials
AR / VR

We provide products for heterogeneous bonding, shock absorption , waterproofing, heat dissipation, anisotropic conductivity, etc.
that are required for wearable devices such as AR/VR.

PICK UP

Semiconductor Production Process

We offer a wide range of highly reliable products that can be used in wafer/chip manufacturing, package substrate manufacturing, and semiconductor back-end processes

Microsphere (Micropearl™)

High-performance filler with uniformity, flexibility, and excellent dispersibility

Release Film for Heat Press Process

Heat-resistant, flexible,
low-contamination release film for heat press surface protection and buffering.

Transparent & Flexible Radio Wave Reflection Film

Innovative thin transparent and flexible film that can be attached to the any surface and can reflect radio waves in the 2GHz-sub6 - mm wave - 150GHz range.

SELFA™

Realizing a new semiconductor process with UV tape that combines heat resistance and easy peelability.

Next-generation display

Continuously evolving display with higher image quality and performance.Sekisui Chemical Electronics materials will contribute to solving issues that arise with this evolution

High-viscosity inkjet ink

High resolution additive manufacturing with anywhere any shape (lines/circles etc.) printing.

Sustainability Products

We provide a wide range of functional chemicals that contribute to reducing environmental impact and conserving resources and energy.

Double-sided tape for fluorine-containing resins adhesion: Enabling fluorine-containing resins to adhere strongly by a special adhesive inspired by adhesion mechanism in the natural world

Thermal conductive materials: Silicone - Non silicone, Sheet / Pods / Paste / Grease, etc. unique line up for TIMs

Glossary: Easy-to-understand explanations of useful terms in the electronics industry.

SEKISUIProduct Development Story

Continuing to support the evolution
of semiconductor processes with
innovative technology for
'adhesion and peeling'—
SELFA™

LEARN MORE

Former Director of the Research & Development Institute (retired in 2019),
High Performance Plastics Company
Current Representative of Science Lab Ishizue

Akira Nakasuga

Chief Engineer, Electronics Materials Development Center
Research & Development Institute
High Performance Plastics Company

Toshio Takahashi

TOPICS

We will exhibit at Advanced Packaging and Chiplet Summit

Tokyo Big Sight (East Exhibition Hall)
Dec 11 to 13, 2024 (10:00 am–5:00 pm JST)

For top players in semiconductor packaging and PCB mounting
Join APCS to partake in advancing the semiconductor packaging technology and uncovering growth opportunities

Exhibit Products：

High Adhesion-easy Removable UV Tape SELFA™
Clean Container series
High-viscosity inkjet ink
EPOXY FLUX (Under development)
Adhesive (PSA) Dot Connector

Sekisui Chemical Exhibit Area East Exhibition Hall 3452

We provide advanced high-performance materials that help solve social issues.
Please stop by our booth.

Nov.12, 2024

Participation in International Conference 3DIC 2024 (Academic Presentation & Booth Exhibition)
(IEEE International 3D Systems Integration Conference 2024)

Date: September 25-27, 2024 (Wed-Fri)

Venue: September 25, 2024 at Hotel Metropolitan Sendai
September 26-27, 2024 at Sendai Kokusai Hotel

Official Website: https://3dic-conf.org/

Our Schedule
■ Session Presentation

Title: "A Temporary Bonding De-Bonding Tape with High Thermal Resistance, Easy Peeling and Excellent TTV for 3DIC"
Presentation Date & Time: September 26, 10:45 AM - 11:05 AM

※3DIC_Program_Schedule : For more details

■ Booth Exhibition

Exhibition Period: September 26, 2024 - September 27, 2024

Venue: Sendai Kokusai Hotel

Booth Number: #12

Sep.2, 2024

TIM technology of Sekisui Chemical will not lose in the "battle against thermal conductivity“

We made a presentation at the EMKxNEPCON KOREA conferenceheld from April 24th to April 26th.
A pre-interview video is available on YouTube of the Korean media, THE ELEC.

Presentation title :
[TIM technology for thermal management of high-performance SoC packages]

YouTube : https://youtu.be/T4inPqeHGPE?si=goJ0A8s_KZ5HJQxv

Note) Video language : Korean (please use YouTube automatic translation function)

Performer information : DoKyoon Kim / Semiconductor Materials Sales Office Product Marketing Manager

Jun.7, 2024

TOPICS List