Semiconductor-related materials
SEMICONDUCTOR

We provide products such as tape, film, resin, and micro-particles for semiconductor wafer manufacturing and packaging.

Next-generation display-related materials
NEXT-GENERATION DISPLAY

We provide sealing materials and shock-absorbing materials for displays such as OLED and μLED.

AR/VR related materials
AR / VR

We provide products for heterogeneous bonding, shock absorption , waterproofing, heat dissipation, anisotropic conductivity, etc.
that are required for wearable devices such as AR/VR.

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Semiconductor Production Process

We offer a wide range of highly reliable products that can be used in wafer/chip manufacturing, package substrate manufacturing, and semiconductor back-end processes

SELFA™

Realizing a new semiconductor process with UV tape that combines heat resistance and easy peelability.

Release Film for Heat Press Process

Heat-resistant, flexible,
low-contamination release film for heat press surface protection and buffering.

Transparent & Flexible Radio Wave Reflection Film

Innovative thin transparent and flexible film that can be attached to the any surface and can reflect radio waves in the 2GHz-sub6 - mm wave - 150GHz range.

High-viscosity inkjet ink

High resolution additive manufacturing with anywhere any shape (lines/circles etc.) printing.

Next-generation display

Continuously evolving display with higher image quality and performance.Sekisui Chemical Electronics materials will contribute to solving issues that arise with this evolution

Build Up Film

Achieves Low Insertion Loss, High Dielectric Reliability and Finer Line and Space Manufactureability by Sekisui Build Up Film

Sustainability Products

We provide a wide range of functional chemicals that contribute to reducing environmental impact and conserving resources and energy.

Double-sided tape for fluorine-containing resins adhesion: Enabling fluorine-containing resins to adhere strongly by a special adhesive inspired by adhesion mechanism in the natural world

Thermal conductive materials: Silicone - Non silicone, Sheet / Pods / Paste / Grease, etc. unique line up for TIMs

Glossary: Easy-to-understand explanations of useful terms in the electronics industry.

SEKISUIProduct Development Story

Continuing to support the evolution
of semiconductor processes with
innovative technology for
'adhesion and peeling'—
SELFA™

LEARN MORE

Former Director of the Research & Development Institute (retired in 2019),
High Performance Plastics Company
Current Representative of Science Lab Ishizue

Akira Nakasuga

Chief Engineer, Electronics Materials Development Center
Research & Development Institute
High Performance Plastics Company

Toshio Takahashi

TOPICS

We will exhibit at Advanced Packaging and Chiplet Summit

Tokyo Big Sight (East Exhibition Hall)
Dec 11 to 13, 2024 (10:00 am–5:00 pm JST)

For top players in semiconductor packaging and PCB mounting
Join APCS to partake in advancing the semiconductor packaging technology and uncovering growth opportunities

Exhibit Products：

High Adhesion-easy Removable UV Tape SELFA™
Clean Container series
High-viscosity inkjet ink
EPOXY FLUX (Under development)
Adhesive (PSA) Dot Connector

Sekisui Chemical Exhibit Area East Exhibition Hall 3452

We provide advanced high-performance materials that help solve social issues.
Please stop by our booth.

Nov.12, 2024

Participation in International Conference 3DIC 2024 (Academic Presentation & Booth Exhibition)
(IEEE International 3D Systems Integration Conference 2024)

Date: September 25-27, 2024 (Wed-Fri)

Venue: September 25, 2024 at Hotel Metropolitan Sendai
September 26-27, 2024 at Sendai Kokusai Hotel

Official Website: https://3dic-conf.org/

Our Schedule
■ Session Presentation

Title: "A Temporary Bonding De-Bonding Tape with High Thermal Resistance, Easy Peeling and Excellent TTV for 3DIC"
Presentation Date & Time: September 26, 10:45 AM - 11:05 AM

※3DIC_Program_Schedule : For more details

■ Booth Exhibition

Exhibition Period: September 26, 2024 - September 27, 2024

Venue: Sendai Kokusai Hotel

Booth Number: #12

Sep.2, 2024

TIM technology of Sekisui Chemical will not lose in the "battle against thermal conductivity“

We made a presentation at the EMKxNEPCON KOREA conferenceheld from April 24th to April 26th.
A pre-interview video is available on YouTube of the Korean media, THE ELEC.

Presentation title :
[TIM technology for thermal management of high-performance SoC packages]

YouTube : https://youtu.be/T4inPqeHGPE?si=goJ0A8s_KZ5HJQxv

Note) Video language : Korean (please use YouTube automatic translation function)

Performer information : DoKyoon Kim / Semiconductor Materials Sales Office Product Marketing Manager

Jun.7, 2024

TOPICS List