Semiconductor-related materials
SEMICONDUCTOR

We provide products such as tape, film, resin, and micro-particles for semiconductor wafer manufacturing and packaging.

Next-generation display-related materials
NEXT-GENERATION DISPLAY

We provide sealing materials and shock-absorbing materials for displays such as OLED and μLED.

AR/VR related materials
AR / VR

We provide products for heterogeneous bonding, shock absorption , waterproofing, heat dissipation, anisotropic conductivity, etc.
that are required for wearable devices such as AR/VR.

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Expansion of functions Search by Issue or Need

Easier to search. In "Search by Issue or Need," we propose electronic materials that meet your concerns.

Next-generation display

Continuously evolving display with higher image quality and performance
Sekisui Chemical Electronics materials will contribute to solving issues that arise with this evolution

Sustainability Products

We provide a wide range of functional chemicals that contribute to reducing environmental impact and conserving resources and energy.

Clean bottle

Particle control and carefully selected low-elution-grade raw materials are used in many high-purity chemicals, as well as in medicine, cosmetics, and fragrances.

POLYELEC®

Excellent basic properties of polyolefin materials, as well as sheet materials for the electronics field, which have added functionality through proprietary blending technologies.

Build Up Film

Achieves Low Insertion Loss, High Dielectric Reliability and Finer Line and Space Manufactureability by Sekisui Build Up Film

Transparent & Flexible Radio Wave Reflection Film

Innovative thin transparent and flexible film that can be attached to the any surface and can reflect radio waves in the 2GHz-sub6 - mm wave - 150GHz range

SELFA

Enabling new semiconductor process by incorporating proprietary heat resistance and debonding technology

High-viscosity inkjet ink: High resolution additive manufacturing with anywhere any shape (lines/circles etc.) printing.

Double-sided tape for fluorine-containing resins adhesion: Enabling fluorine-containing resins to adhere strongly by a special adhesive inspired by adhesion mechanism in the natural world

Thermal conductive materials: Silicone - Non silicone, Sheet / Pods / Paste / Grease, etc. unique line up for TIMs

TOPICS

TIM technology of Sekisui Chemical will not lose in the "battle against thermal conductivity“

We made a presentation at the EMKxNEPCON KOREA conferenceheld from April 24th to April 26th.
A pre-interview video is available on YouTube of the Korean media, THE ELEC.

Presentation title :
[TIM technology for thermal management of high-performance SoC packages]

YouTube : https://youtu.be/T4inPqeHGPE?si=goJ0A8s_KZ5HJQxv

Note) Video language : Korean (please use YouTube automatic translation function)

Performer information : DoKyoon Kim / Semiconductor Materials Sales Office Product Marketing Manager

Jun.7, 2024

Sekisui Chemical to exhibit at The 2024 IEEE 74th Electronic Components and Technology Conference(ECTC)

Date: May 28 (Tue) - May 31 (Fri), 2024

Venue: Gaylord Rockies Resort & Convention Center,（Denver, Colorado, USA）
Sekisui Chemical Exhibit Area ＃634

Exhibit Products :

Build Up Film
Temporary Bonding Film
Thermal Interface Materials
High-viscosity inkjet ink
Sputtered Selfa
Themal Build up Film
Heat-curing resin for SAC solder connection Epoxy flux
Clean Container

Program URL : https://bit.ly/4dIyeC6

May.20, 2024

An award ceremony for our developed product "Temporary Fixing Tape Heat-Resistant SELFA" was held.

The award ceremony for the "Temporary Fixing Tape Heat-Resistant SELFA," which won the Best Paper Award in 2022 at "IMPACT," Taiwan's largest international conference on semiconductor packaging and PCBs, took place during the following year's conference on October 24, 2023.

Paper Title :
A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity

Award-winning authors: Izumi Okamura, Ryoichi Watanabe, Toshio Takahashi, and four others.
(Members of the Research & Development Institute of the High Performance Plastics Company)

For more details

Nov.17, 2023

TOPICS List