Semiconductor-related materials

We provide products such as tape, film, resin, and micro-particles for semiconductor wafer manufacturing and packaging.

Next-generation display-related materials

We provide sealing materials and shock-absorbing materials for displays such as OLED and μLED.

AR/VR related materials

We provide products for heterogeneous bonding, shock absorption , waterproofing, heat dissipation, anisotropic conductivity, etc.
that are required for wearable devices such as AR/VR.


High Resolution 3D Printer(Inkjet) Materials
High resolution additive manufacturing with anywhere any shape (lines/circles etc.) printing.
Double-sided tape for
fluorine-containing resins adhesion
Enabling fluorine-containing resins to adhere strongly by a special adhesive inspired by adhesion mechanism in the natural world
Thermal conductive materials
Silicone - Non silicone, Sheet / Pods / Paste / Grease, etc. unique line up for TIMs


Sekisui Chemical to exhibit at The 2024 IEEE 74th Electronic Components and Technology Conference(ECTC)

Sekisui Chemical to exhibit at The 2024 IEEE 74th Electronic Components and Technology Conference(ECTC)

May 28 (Tue) - May 31 (Fri), 2024
Gaylord Rockies Resort & Convention Center,(Denver, Colorado, USA)
Sekisui Chemical Exhibit Area #634

Exhibit Products :

Program URL :

May.20, 2024

Transparent & Flexible Radio Wave Reflection Film(Under development)

2nd Demonstration Experiment of on Radio Wave Reflection Utilizing Local 5G Environment of Tokyo Metropolitan University

We measured how our radio wave reflection films of various shapes affected radio waves in the outdoor areas of Tokyo Metropolitan University's Minami-Osawa Campus, which has one of the largest local 5G environments in Japan.

Regardless of the film shape, the film improves the radio wave environment and eliminates the need for position adjustment for proper radio wave reflection when used on a flat plate as well as careful selection of installation location, enabling easy work.

For more details

Feb.1, 2024

An award ceremony for our developed product "Temporary Fixing Tape Heat-Resistant SELFA" was held.

The award ceremony for the "Temporary Fixing Tape Heat-Resistant SELFA," which won the Best Paper Award in 2022 at "IMPACT," Taiwan's largest international conference on semiconductor packaging and PCBs, took place during the following year's conference on October 24, 2023.

Paper Title :
A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity

Award-winning authors
Izumi Okamura, Ryoichi Watanabe, Toshio Takahashi, and four others.
(Members of the Research & Development Institute of the High Performance Plastics Company)

For more details

Nov.17, 2023

We will exhibit at Advanced Packaging and Chiplet Summit

Tokyo Big Sight (East Exhibition Hall) Dec 13 to 15, 2023 (10:00 am–5:00 pm JST)

For top players in semiconductor packaging and PCB mounting
Join APCS to partake in advancing the semiconductor packaging technology and uncovering growth opportunities

1.Heat-curing resin for SAC solder connection<EPOXY FLUX (Under development) >
2.Transport container<Clean Container series>
3.Super Thermal-Conductive Pads<MANION Series>
4.High Adhesion-easy Removable UV Tape<SELFA series>
Sekisui Chemical Exhibit Area East Exhibition Hall 1333

Nov. 2, 2023


"Innovation for the earth." We transform the electronics industry through material velopment with sustainability as our core value.