Semiconductor-related materials
SEMICONDUCTOR

We provide products such as tape, film, resin, and micro-particles for semiconductor wafer manufacturing and packaging.

Next-generation display-related materials
NEXT-GENERATION DISPLAY

We provide sealing materials and shock-absorbing materials for displays such as OLED and μLED.

AR/VR related materials
AR / VR

We provide products for heterogeneous bonding, shock absorption , waterproofing, heat dissipation, anisotropic conductivity, etc.
that are required for wearable devices such as AR/VR.

PICK UP Products

Next-generation display

Continuously evolving display with higher image quality and performance
Sekisui Chemical Electronics materials will contribute to solving issues that arise with this evolution

LED encapsulation material &
UTG protective resin
Photolec New

Solventless and UV + heat curable
High surface smoothness, high transparency, bending resistance, impact resistance, shatterproof

UV delayed curing Low moisture permeable adhesive,
Photolec E

After UV irradiation, post-curing type and immediate curing type are available.
Low outgas, low moisture permeability.

Build Up Film

Achieves Low Insertion Loss, High Dielectric Reliability and Finer Line and Space Manufactureability by Sekisui Build Up Film

Transparent & Flexible Radio Wave Reflection Film

Innovative thin transparent and flexible film that can be attached to the any surface and can reflect radio waves in the Sub6 - mm wave - THz range

SELFA

Enabling new semiconductor process by incorporating proprietary heat resistance and debonding technology

High Resolution 3D Printer(Inkjet) Materials: High resolution additive manufacturing with anywhere any shape (lines/circles etc.) printing.

Double-sided tape for fluorine-containing resins adhesion: Enabling fluorine-containing resins to adhere strongly by a special adhesive inspired by adhesion mechanism in the natural world

Thermal conductive materials: Silicone - Non silicone, Sheet / Pods / Paste / Grease, etc. unique line up for TIMs

TOPICS

An award ceremony for our developed product "Temporary Fixing Tape Heat-Resistant SELFA" was held.

The award ceremony for the "Temporary Fixing Tape Heat-Resistant SELFA," which won the Best Paper Award in 2022 at "IMPACT," Taiwan's largest international conference on semiconductor packaging and PCBs, took place during the following year's conference on October 24, 2023.

Paper Title :
A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity

Award-winning authors: Izumi Okamura, Ryoichi Watanabe, Toshio Takahashi, and four others.
(Members of the Research & Development Institute of the High Performance Plastics Company)

For more details

Nov.17, 2023

We will exhibit at Advanced Packaging and Chiplet Summit

Tokyo Big Sight (East Exhibition Hall) Dec 13 to 15, 2023 (10:00 am–5:00 pm JST)

For top players in semiconductor packaging and PCB mounting
Join APCS to partake in advancing the semiconductor packaging technology and uncovering growth opportunities

1.Heat-curing resin for SAC solder connection<EPOXY FLUX (Under development) >
2.Transport container<Clean Container series>
3.Super Thermal-Conductive Pads<MANION Series>
4.High Adhesion-easy Removable UV Tape<SELFA series>
Sekisui Chemical Exhibit Area　East Exhibition Hall 1333

Nov. 2, 2023

Transparent & Flexible Radio Wave Reflection Film(Under development)

Demonstration of radio wave reflection by using the local 5G system at Tokyo Metropolitan University (July/2023)

Confirmed improvement connectivity and eliminating blind spots by using radio wave reflection film at Tokyo Metropolitan University Minami-Osawa Campus outdoor area which has Japan's one of the largest local 5G system

For more details

Oct.15, 2023