We provide products such as tape, film, resin, and micro-particles for semiconductor wafer manufacturing and packaging.
Next-generation display-related materials
We provide sealing materials and shock-absorbing materials for displays such as OLED and μLED.
AR/VR related materials
AR / VR
We provide products for heterogeneous bonding, shock absorption , waterproofing, heat dissipation, anisotropic conductivity, etc.
that are required for wearable devices such as AR/VR.
PICK UP Products
Continuously evolving display with higher image quality and performance
Sekisui Chemical Electronics materials will contribute to solving issues that arise with this evolution
LED encapsulation material &
UTG protective resin
Solventless and UV + heat curable
High surface smoothness, high transparency, bending resistance, impact resistance, shatterproof
UV delayed curing Low moisture permeable adhesive,
After UV irradiation, post-curing type and immediate curing type are available.
Low outgas, low moisture permeability.
Build Up Film
Achieves Low Insertion Loss, High Dielectric Reliability and Finer Line and Space Manufactureability by Sekisui Build Up Film
Transparent & Flexible Radio Wave Reflection Film
Innovative thin transparent and flexible film that can be attached to the any surface and can reflect radio waves in the Sub6 - mm wave - THz range
Enabling new semiconductor process by incorporating proprietary heat resistance and debonding technology
The award ceremony for the "Temporary Fixing Tape Heat-Resistant SELFA," which won the Best Paper Award in 2022 at "IMPACT," Taiwan's largest international conference on semiconductor packaging and PCBs, took place during the following year's conference on October 24, 2023.
- Award-winning authors
- Izumi Okamura, Ryoichi Watanabe, Toshio Takahashi, and four others.
(Members of the Research & Development Institute of the High Performance Plastics Company)
Tokyo Big Sight (East Exhibition Hall) Dec 13 to 15, 2023 (10:00 am–5:00 pm JST)
For top players in semiconductor packaging and PCB mounting
Join APCS to partake in advancing the semiconductor packaging technology and uncovering growth opportunities
1.Heat-curing resin for SAC solder connection<EPOXY FLUX (Under development) >
2.Transport container<Clean Container series>
3.Super Thermal-Conductive Pads<MANION Series>
4.High Adhesion-easy Removable UV Tape<SELFA series>
Sekisui Chemical Exhibit Area East Exhibition Hall 1333
Nov. 2, 2023
Transparent & Flexible Radio Wave Reflection Film(Under development)
Confirmed improvement connectivity and eliminating blind spots by using radio wave reflection film at Tokyo Metropolitan University Minami-Osawa Campus outdoor area which has Japan's one of the largest local 5G system
- Sep. 6 (Wed) – Sep. 8 (Fri), 2023
- Taipei Nangang Exhibition Center Halls 1 & 2
Our Exhibition Booth : 4th Floor Hall 1
For more information, click here.
Main Products to be Exhibited:
1.Heat-curing resin for SAC solder connection <EPOXY FLUX>
2.Transport container <Clean Container series>
3.Super Thermal-Conductive Pads <MANION Series>
4.High Adhesion-easy Removable UV Tape <SELFA series>
5.For FC-BGA substrates <SEKISUI Build up Film>
"Innovation for the earth." We transform the electronics industry through material velopment with sustainability as our core value.