Semiconductor-related materials

We provide products such as tape, film, resin, and micro-particles for semiconductor wafer manufacturing and packaging.

Next-generation display-related materials

We provide sealing materials and shock-absorbing materials for displays such as OLED and μLED.

AR/VR related materials

We provide products for heterogeneous bonding, shock absorption , waterproofing, heat dissipation, anisotropic conductivity, etc.
that are required for wearable devices such as AR/VR.


An award ceremony for our developed product "Temporary Fixing Tape Heat-Resistant SELFA" was held.

The award ceremony for the "Temporary Fixing Tape Heat-Resistant SELFA," which won the Best Paper Award in 2022 at "IMPACT," Taiwan's largest international conference on semiconductor packaging and PCBs, took place during the following year's conference on October 24, 2023.

Paper Title :
A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity

Award-winning authors
Izumi Okamura, Ryoichi Watanabe, Toshio Takahashi, and four others.
(Members of the Research & Development Institute of the High Performance Plastics Company)

For more details

Nov.17, 2023

We will exhibit at Advanced Packaging and Chiplet Summit

Tokyo Big Sight (East Exhibition Hall) Dec 13 to 15, 2023 (10:00 am–5:00 pm JST)

For top players in semiconductor packaging and PCB mounting
Join APCS to partake in advancing the semiconductor packaging technology and uncovering growth opportunities

1.Heat-curing resin for SAC solder connection<EPOXY FLUX (Under development) >
2.Transport container<Clean Container series>
3.Super Thermal-Conductive Pads<MANION Series>
4.High Adhesion-easy Removable UV Tape<SELFA series>
Sekisui Chemical Exhibit Area East Exhibition Hall 1333

Nov. 2, 2023

Transparent & Flexible Radio Wave Reflection Film(Under development)

Demonstration of radio wave reflection by using the local 5G system at Tokyo Metropolitan University (July/2023)

Confirmed improvement connectivity and eliminating blind spots by using radio wave reflection film at Tokyo Metropolitan University Minami-Osawa Campus outdoor area which has Japan's one of the largest local 5G system

For more details

Oct.15, 2023


Exhibit Information


Sep. 6 (Wed) – Sep. 8 (Fri), 2023
Taipei Nangang Exhibition Center Halls 1 & 2
Our Exhibition Booth : 4th Floor Hall 1
For more information, click here.

Main Products to be Exhibited:
1.Heat-curing resin for SAC solder connection <EPOXY FLUX>
2.Transport container <Clean Container series>
3.Super Thermal-Conductive Pads <MANION Series>
4.High Adhesion-easy Removable UV Tape <SELFA series>
5.For FC-BGA substrates <SEKISUI Build up Film>

Aug.28, 2023


"Innovation for the earth." We transform the electronics industry through material velopment with sustainability as our core value.