Solder Anisotropic Conductive Paste
- Top Page
- Mounting material
- Solder Anisotropic Conductive Paste
Anisotripic Conductive Paste can achieve metal connection with low pressure, low temp. bonding process
![Solder Anisotropic Conductive Paste](./images/pic_u19_01.jpg)
1. Characteristic
- Low-profile connection(less than 0.1mmt)
- Low pressure bonding(1/2ACF)
- Fine pitch(150um)(1/2 Connector)
- Achieve voidless connection
- Available for Au, Cu electrode
- High-speed transmission(USB 3.0)
2. Applications
![Connector substitute](./images/pic_u19_02.png)
![Camera module connection](./images/pic_u19_03.png)
![](./images/pic_u19_04.jpg)
3. Reliability
Conditions | Results | |
---|---|---|
Adhesive strength | 90°peel | 20N/cm |
Thermal shock | -40/85℃ | 1000cycle |
Moisture resistance | 85℃85% | 1000h |
Electrical insulation | 85℃85%15V | 1000h |
Assembly conditions | Temp.:140℃ Pressure:0.8MPa Time:10 second |
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