Solder Anisotropic Conductive Paste

Anisotripic Conductive Paste can achieve metal connection with low pressure, low temp. bonding process

Solder Anisotropic Conductive Paste

1. Characteristic

  • Low-profile connection(less than 0.1mmt)
  • Low pressure bonding(1/2ACF)
  • Fine pitch(150um)(1/2 Connector)
  • Achieve voidless connection
  • Available for Au, Cu electrode
  • High-speed transmission(USB 3.0)

2. Applications

Connector substitute
Connector substitute
Camera module connection
Camera module connection

3. Reliability

Conditions Results
Adhesive strength 90°peel 20N/cm
Thermal shock -40/85℃ 1000cycle
Moisture resistance 85℃85% 1000h
Electrical insulation 85℃85%15V 1000h
Assembly conditions Temp.：140℃ Pressure：0.8MPa Time：10 second
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