Product List

Microsphere(Micropearl Series)

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Brief Material Category Product Feature
Uniform Resin Particle for GAP Control Microsphere Micropearl SP,GS Uniform particle size distribution,coefficient of variation (Cv) ≤ 7%, uniform gap control. Abundant particle size lineup from 2µm to 600µm. Product Information
Resin Core Conductive Particle Microsphere Micropearl AU Various types of metal layers can be formed uniformly on plastic particles with a uniform particle size distribution. Product Information

UV Curing Adhesive(Photolec Series)

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Brief Material Category Product Feature
Sealant for ODF UV Curing Adhesive Photolec S UV + heat curing adhesive with high adhesive strength and low moisture permeability . Black type with high light shielding is also available. Product Information
UV curing adhesive for fixation of optical components,protection of semiconductor parts and others. UV Curing Adhesive Photolec A A highly transparent and excellent UV curing adhesive even under oxygen environment. Few impurities, halogen-free. Product Information
Low Moisture Permeable Adhesive for Metal Bonding and Sealing Agent for OLED Device UV Curing Adhesive Photolec E After UV irradiation, post-curing type and immediate curing type are available. Low outgas, low moisture permeability. Product Information
UV (B Stage) + Moisture Curing Adhesive for Replacing Tape UV Curing Adhesive Photolec B Easy workability (corresponding to curved surfaces and fine lines), curing light shielding parts, high adhesion of different materials, stress relaxation (flexibility after curing, thickness retention). Product Information

Assembly Material

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Brief Material Category Product Feature
Solder Anisotropic Conductive Paste Assembly Material SACP Metal joining is possible at low temperature and low pressure. Low profile connection (less than 0.1mm thickness), fine pitch connection (150um). Product Information
Reflow Curing Solder Anisotropic Conductive Paste for Replacing Connector and ACF Assembly Material SAP Can be assembled only by heating. Solder particles self-aggregate on electrodes and form metal bonds. Product Information
Resin Core Solder Ball for Replacing Solder Paste Assembly Material Micropearl SOL Accurate gap control is possible with a flexible and uniform size resin core. Ensures high connection reliability, standoff and flatness. Product Information

Foam Tape

Brief Material Category Product Feature
Functional Foam Tape for Waterproofing and Shock Absorption Foam Tape #5200 Combination of foam and adhesive with excellent stress relaxation. High impact resistance, high step followability (waterproof, dustproof), high adhesive reliability. Product Information

Tape

Brief Material Category Product Feature
Double-sided Tape for Fixing LCD Parts Tape #3800 PET-based double-sided tape with high adhesion performance to various adherends. Product Information
Double-faced Tape for Fixing Polishing Pads Tape Double-faced Tape for Fixing Polishing Pads Mainly used for fixing polishing cloth in the polishing process of the electronic device manufacturing process. Maximum 2450mm width, double separator compatible, high chemical resistance. Product Information
Conductive Tape Tape #7800 Adhesive tape with excellent conductivity, heat dissipation, adhesive strength, bending resistance, and thinness. Suitable for grounding / shielding / heat dissipation of electronic devices. Product Information
Protective Tape for Optical Use Tape #6700/#6800 Produced in a clean environment with strong adhesion with little adherend contamination such as glue residue. Product Information
Highly Clear Double-faced Tape Tape HSV/SSV Baseless, no need for UV irradiation after bonding, extremely high transparency. Maintains high optical properties with foaming resistance, whitening resistance, and long-term reliability. Product Information
Photomask Protection Film in PCB Manufacuture Process Tape Tackwell Solvent Resistance and High Durability Product Information

Release Film

Brief Material Category Product Feature
Release Film for FPC Manufacutre Release Film Low Outgas Release Film Release film with high conformability and low outgas. Product Information

Removable UV Tape(SELFA Series)

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Brief Material Category Product Feature
High Heat Resistance, High Adhesion, Easy Removable UV Tape for Semiconductor Process Removable UV Tape SELFA HS UV release tape which combines strong adhesion and low residue. Device protection, high heat resistance, high chemical resistance during various PKG manufacturing heat processes. Product Information
Double-Sided Heat-Resistant, High-adhesion, Easy-Release UV Tape for Wafer Support Systems Removable UV Tape SELFA HW UV release tape that combines strong adhesion and low residue. First and only tape-type glass support methods whicn can be peeled without damage due to gas generation mechanism. Product Information
Self-peeling UV Tape for Wafer Backside Protection During Plating Process Removable UV Tape SELFA MP UV release tape that combines strong adhesion and low residue. It can be separated from the adherend by generating gas after UV irradiation. Product Information
High Adhesion Easy Peel UV Ttape for Temporary Bonding Process Removable UV Tape SELFA SE UV release tape that combines strong adhesion and low residue. Parts can be temporarily fixed in environments up to 150 ° C, and peeling is possible after UV irradiation. Product Information

Foam

Brief Material Category Product Feature
Waterproof, Anti-vibration, Shock Absorbing Thin Foam Foam XLIM Ultra-thin, high-performance foam that combines high sealing properties and high shock absorption. Product Information

Resist Ink

Brief Material Category Product Feature
White Solder Resist for LED Substrate Resist Ink White Solder Resist White Solder Resist. High reflectivity, high heat resistance yellowing, high reliability. Product Information

Heat Release Related Products
(Heat Release Related Series)

Product Information List
Brief Material Category Product Feature
Resin Substrate, Insulation Heat Release Sheet with Copper Heat Release Related Products Heat Release Fin P-fin/N-fin A heat release material with excellent heat dissipation and insulation properties. Excellent heat resistance, high adhesion, and high reliability. Product Information
Heat Conductive Paste for Cooling Driver IC Heat Release Related Products Heat Conductive Paste NT / NP High heat conduction, good molding properties. Excellent flexibility and applicable to flexible substrates. Product Information
Thermocuring Heat Release Sheet Heat Release Related Products Thermal Release & Insulation Sheet KNDJ / SH / LM B-stage thermcuring epoxy resin sheet with excellent thermal conductivity, insulation, and pattern followability. Product Information
Silicone-free Thermal Conductive Grease Heat Release Related Products Silicone-free Thermal Conductive Grease GA Grease Type, Silicone Free. Product Information
Room Temperature Curing Type Two-liquid Silicone Thermal Conductive Heat Release Related Products Thermal Conductive Grease CGW Room temperature curing type two-liquid silicone grease, solventless type, high thixotropy. Product Information
Low Siloxane Silicone Thermal Conductive Sheet Heat Release Related Products Silicone Thermal Conductive Sheet PT Low siloxane silicone sheet type. Temperature durability, electrical insulation, high heat conductivity. Product Information
Super Flexible Thermal Conductive Sheet Heat Release Related Products FEATHER Super flexible sheet type. High followability to irregular surface, high cushioning. Product Information
High Thermal Conductive Sheet Heat Release Related Products High Heat Conductive Sheet PT High heat conduction sheet type. High conductivity while maintaining adhesion and flexibility. Product Information
Silicone-free Thermal Conductive Sheet Heat Release Related Products Silicone-free Thermal Conductive Sheet SF Sheet type, silicone free. Electrical insulation, flexibility, flame retardant. Product Information

Inkjet Materials

Brief Material Category Product Feature
Ink for Coating / Adhesive Applications Inkjet Materials High Resolution 3D Printer (Inkjet) Material Printing size control ability in drop-on-demand. Product Information

Interlayer Insulating Film

Brief Material Category Product Feature
Interlayer Insulating Film for Making Build-up Boards Interlayer Insulating Film Heat-curing Build Up Film NX/NQ Low transmission loss, high insulation reliability. Product Information

Polyvinyl Acetal Resin

Brief Material Category Product Feature
Binder Resin Polyvinyl Acetal Resin S-LEC B,K Tough, high flexibility, high adhesiveness, crosslinkability, compatibility. Easy to dissolve in various solvents including alcohol. Product Information
Paste Resin Polyvinyl Acetal Resin S-LEC SV Excellent rheological properties, high adhesion, high sheet strength, high flexibility. Product Information

Rubber Connector

Brief Material Category Product Feature
Electrical Connection, Holder Integrated Connector Rubber Connector Microphone Holder Connector Holder and connector are integrated. Easy assembly and solderless connection. Product Information
Rubber Connector for Electrical Connection and Grounding (Adhesive Fixing) Rubber Connector Adhesive (PSA) Dot Connector Rubber connector with integrated insulating and conductive parts. Easy mounting due to adhesiveness (PSA: Pressure-Sensitive-Adhesive). Product Information
Rubber Connector for Electrical Connection and Grounding (Solder Mounting) Rubber Connector Board Mount (SMT) Dot Connector Rubber connector with integrated insulating and conductive parts, mounted by reflow. Easy mounting due to adhesiveness (SMT: Surface-Mount-Technology). Product Information
Electrical Connection, Flexible Rubber Connector (Waterproof and Resin Integrated) Rubber Connector Other Connectors (Waterproof and Resin Integrated) Rubber connector that can integrate the insulating part and the conductive part. Flexibility that allows flexible design (complex shape, protruding conductive parts). Product Information

Waterproof / Moisture Proof / Vibration Proof

Brief Material Category Product Feature
Waterproof and Moisture-proof Sealing Applications Waterproof / Moisture Proof / Vibration Proof Waterproof GEL PantelGEL Low-hardness, high-strength silicone GEL material with excellent waterproof, dustproof and cushioning properties. Insert molding with regular resin, metal, and film is possible. Product Information
Sealing Material with Waterproof and Moisture-proof Waterproof / Moisture Proof / Vibration Proof UV Curable Moisture Proof Sealant ACG high flexibility, high elasticity, easy peeling. Product Information
Thermoplastic Elastomer for High Vibration and Shock Absorption Waterproof / Moisture Proof / Vibration Proof EXAGEL Highly flexible, flame-retardant UL94 certified. Product Information
Thermocuring Rubber for Vibration and Shock Absorption Waterproof / Moisture Proof / Vibration Proof G-Polstar Wide hardness and damping variation is avaiable. Flame-retardant UL94. Product Information

Band Material

Brief Material Category Product Feature
Rubber Band for Wearable Device Band Material Rubber Band for Wearable Device Rubber / elastomer formula with emphasis on touch and reliability. Compression molding of rubber and insert molding with resin and metal are possible. Product Information

Electromagnetic Wave Absorption

Brief Material Category Product Feature
Electromagnetic Wave Absorbing Sheet Electromagnetic Wave Absorption EM Wave Absorbing Sheet Pμ-SV Achieves excellent EM wave absorption effect from 10MHz to several GHz. Product Information

Heat Release and Electromagnetic Wave Absorption

Brief Material Category Product Feature
Heat Release Electromagnetic Wave Absorbing Sheet Heat Release and Electromagnetic Wave Absorption Heat Release & EEM Wave Absorbing Sheet Pμ Provides excellent electromagnetic wave absorption while maintaining the flexibility and thermal conductivity of the heat release sheet. Product Information