Product List
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- Product List
Microsphere
… Sustainability Products
| Product | Feature | |
|---|---|---|
| [Micropearl™ SP/GS] Uniform resin particles |
Uniform particle size distribution, coefficient of variation (Cv) ≦ 7%, uniform gap control. Abundant particle size lineup from 2μm to 600μm. | Product Information |
| [Micropearl™ AU] Plastic core Metal coating Particles |
Available to coat evenly with different type of metals onto plastic particles. Our technology can control hardness of particles and repulsive force. | Product Information |
| [Micropearl™ EX] Particles with high size accuracy |
Uniform partical size distributions that are able to maintain tighter particle size control. Excellent voltage, heat and chemical resistance. | Product Information |
| [Micropearl™ EXH] Hard plastic material uniformed resin particles for gap control |
Compared to silica particles, this particles are stable with sizes reduction and damage to the substrate. High hardness prevent settlement in the resin caused by heat. | Product Information |
| [Micropearl™ EZ] Low recovery rate and soft resin particles for gap control |
It is an acrylic co-polymer particle that is very soft and it can absorb vibration and noise. Also it reduces the damage to the substrate. Due to the lower spring back (recovery rate) of the particle, it can be used for softer substrates. | Product Information |
| [Micropearl™ SLC] (under development): Silicone type particles |
Silicon polymer based particle. It absorbs vibrations and noise. Lower spring back (recovery rate) of the particles, it can be used for softer substrates. | Product Information |
| [Micropearl™ KB] black uniform resin Particles for gap control |
Divinylbenzene co-polymer particles with black pigment dispersed. Excellent blackness and light shielding properties, and resistance to exudative. | Product Information |
| GAP control adhesive containing uniform particles | Thermosetting adhesive containing ultra high precision spacer particles. The thickness of the adhesive can be precisely controlled. | Product Information |
UV Curing Adhesive
… Sustainability Products
| Product | Feature | Adherent body | Curing conditions | |
|---|---|---|---|---|
| Sealant for ODF [Photolec™ S] |
UV + heat curing adhesive with high adhesive strength and low moisture permeability. Black type with high light shielding is also available. | Glass, Polyimide | UV (3,000mJ / cm2) + Heat (120℃ × 60min) | Product Information |
| UV-curing adhesives [Photolec™ A] |
A highly transparent and excellent UV curing adhesive even under oxygen environment. Few impurities, halogen-free. | Glass | 1,500mJ / cm2 or more | Product Information |
| UV delayed curing Low moisture permeable adhesive [Photolec™ E] |
After UV irradiation, post-curing type and immediate curing type are available. Low outgas, low moisture permeability. | Alkali free glass | UV delay + heat (UV 1,500mJ / cm2 + 60～100℃ × 30min) | Product Information |
| UV (B stage) + Moisture Curing Adhesive [Photolec™ B] |
Easy workability (corresponding to curved surfaces and fine lines), curing light shielding parts, high adhesion of different materials, stress relaxation (flexibility after curing, thickness retention). | Glass, Plastic, AL, SUS | UV + Moisture | Product Information |
| LED encapsulation material & UTG protective resin [Photolec™ New] |
UV-curable μLED chip protection resin with inkjet applicability & Greatly improves pen drop resistance simply by coating. | Glass | UV, UV + Heat | Product Information |
| GAP control adhesive containing uniform particles | Thermosetting adhesive containing ultra high precision spacer particles. The thickness of the adhesive can be precisely controlled. | Ferrite core, Iron, SUS | 150℃ × 30min or more | Product Information |
| Anisotropic Conductive Paste For RFID | low temperture/short time curing for chip assembly in RFID inlay production. | PET | 140℃10sec. 170℃3sec. |
Product Information |
Assembly Material
| Product | Feature | Adherent body | Curing conditions | |
|---|---|---|---|---|
| Solder Anisotropic Conductive Paste | Metal joining is possible at low temperature and low pressure. Low profile connection (less than 0. 1mm thickness), fine pitch connection (150um). | PI, RF4 | 140℃ / 10s / Pressure 1 to 3 Mpa | Product Information |
| Anisotropic Conductive Paste For RFID | low temperture/short time curing for chip assembly in RFID inlay production. | PET | 140℃10sec. 170℃3sec. |
Product Information |
Foam Tape
| Product | Feature | |
|---|---|---|
| Functional Foam Tape [5200 Series] |
Combination of foam and adhesive with excellent stress relaxation. High impact resistance, high step followability (waterproof, dustproof), high adhesive reliability. | Product Information |
| Flexible Foam Tape | Foam substrate double-coated adhesive tape for fixing components that enables device recycling through reworkability. Suitable for fixing display panel and chassis. | Product Information |
Tape
| Product | Feature | |
|---|---|---|
| Double-faced Adhesive Tape for Fixing of LCD Components [3800 Series] |
PET-based double-sided tape with high adhesion performance to various adherends. | Product Information |
| Double-faced Tape for Fixing Polishing Pads for LCD Glass Substrate, CMP, and HDD Substrate | Highly chemical-resistant tape with no adhesive residue when peeled off. Used for fixing polishing pad in the polishing process for electronic devices. Max. width 2450mm, suitable for CMP process. | Product Information |
| Conductive Tape [7800 series] |
Adhesive tape with excellent conductivity, heat dissipation, adhesive strength, bending resistance, and thinness. Suitable for grounding/shielding/heat dissipation of electronic devices. | Product Information |
| Protective Tape for Optical Use [6700/6800/6900Series] |
Strong adhesive protection tape that can adhere to various shaped surfaces including brightness enhancement film (BEF). Features minimal contamination of the adherend, such as tape residue. | Product Information |
| Photo mask protection film [TACKWELL™] |
Highly durable, chemical-resistant tape with excellent optical properties produced in a clean environment, suitable as protective tape for photomasks used in PCB production. | Product Information |
| Masking tape for semiconductor package substrates | Tape with excellent adhesion, optical properties and easy peeling, produced in a clean environment. Suitable as a protective tape for solder resist on package substrates. | Product Information |
| Double-sided tape for fluorine-containing resins adhesion(Developments) | Double-coated adhesive tape with a proprietary compound developed based on secretions produced by mussels, which enables strong adhesion to fluorine and polyolefin resins and other hard-to-bond substrates. | Product Information |
Release Film
| Product | Feature | |
|---|---|---|
| Release Film for Heat Press Process [Low Outgas Release Film] |
Release film exhibiting excellent heat resistance, flexibility, and low-contamination properties. Suitable for surface protection and buffering in heat press processes for manufacturing FPCs, semiconductor molds, next-generation displays etc. | Product Information |
Removable UV Tape
| Product | Feature | |
|---|---|---|
| Single-sided Heat Resistance UV Tape [SELFA™ HS] |
UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Protects device surfaces and suppresses warpage in various PKG manufacturing processes. | Product Information |
| Double-sided Heat Resistance UV Tape [SELFA™ HW] |
UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Glass support system maintains device flatness during the process and ensures safe handling. | Product Information |
| Single-sided Chemical-resistant Self-releasable UV Tape [SELFA™ MP] |
UV release tape that combines strong chemical resistance and low residue; UV irradiation causes gas generation, which reduces device damage and allows easy peeling. | Product Information |
Film
| Product | Feature | |
|---|---|---|
| Masking tape for semiconductor package substrates | Tape with excellent adhesion, optical properties and easy peeling, produced in a clean environment. Suitable as a protective tape for solder resist on package substrates. | Product Information |
| Interlayer Insulating Film for Making Build-up Boards [Heat-curing Build Up Film NX/NQ] |
Low transmission loss, high insulation reliability. | Product Information |
| For 5G/6G [Transparent & Flexible Radio Wave Reflection Film] |
Innovative thin transparent and flexible film that can be attached to the any surface and can reflect radio waves in the 2GHz-sub6 - mm wave - 150GHz range. | Product Information |
Foam
| Product | Feature | |
|---|---|---|
| Waterproof, Anti-vibration, Shock Absorbing Thin Foam [XLIM™] |
Ultra-thin, high-performance foam that combines high sealing properties and high shock absorption. | Product Information |
Heat Release Related Products
| Product | Feature | |
|---|---|---|
| Thermal conductive insulating sheet [Insulated Metal Substrate 「NF-type」] |
A heat release material with excellent heat dissipation and insulation properties. Excellent heat resistance, high adhesion, and high reliability. | Product Information |
| 1-Part Heat-Curable Grease [Adhesive thermal conductive grease] |
High heat conduction, good molding properties. Excellent flexibility and applicable to flexible substrates. | Product Information |
| 1-Part Silicone-free Thermal Conductive Grease [GA Series] |
Grease Type, Silicone Free. | Product Information |
| 2-Part Thermal Conductive Gap Filler [CGW™Series] |
Room temperature curing type two-liquid silicone grease, solventless type, high thixotropy. | Product Information |
| Thermal-Conductive Pads [TIMLIGHT™ Series] |
Low siloxane silicone sheet type. Temperature durability, electrical insulation, high heat conductivity. | Product Information |
| Thermal-Conductive Pads [TIMLIGHT™ Soft Series] |
Super flexible sheet type. High followability to irregular surface, high cushioning. | Product Information |
| Super Thermal-Conductive Pads [MANION™ Series] |
A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. | Product Information |
| Heat Release Electromagnetic Wave Absorbing Sheet [Heat Release & EEM Wave Absorbing Sheet Pμ] |
Provides excellent electromagnetic wave absorption while maintaining the flexibility and thermal conductivity of the heat release sheet. | Product Information |
Inkjet Materials
… Sustainability Products
| Product | Feature | |
|---|---|---|
| Pattern formation of exterior peripheries/Usage for package miniaturization [High-viscosity inkjet ink] |
Proprietary high-functionality materials, designed uniquely from adhesives to barrier rid forming materials. Freely controllable ink application shapes. Optimizing printing processes with our one-stop development. | Product Information |
Polyvinyl Acetal Resin
| Product | Feature | |
|---|---|---|
| Binder Resin [S-LEC™ B, K] |
Tough, high flexibility, high adhesiveness, crosslinkability, compatibility. Easy to dissolve in various solvents including alcohol. | Product Information |
| Paste Resin [S-LEC™ SV] |
Excellent rheological properties, high adhesion, high sheet strength, high flexibility. | Product Information |
Molded Product
| Product | Feature | |
|---|---|---|
| Electrical Connection, Holder Integrated Connector [Microphone Holder Connector] |
Holder and connector are integrated. Easy assembly and solderless connection. | Product Information |
| Rubber Connector for Electrical Connection and Grounding (Adhesive Fixing) [Adhesive (PSA) Dot Connector] |
Rubber connector with integrated insulating and conductive parts. Easy mounting due to adhesiveness (PSA: Pressure-Sensitive-Adhesive). | Product Information |
| Rubber Connector for Electrical Connection and Grounding (Solder Mounting) [Board Mount (SMT) Dot Connector] |
Rubber connector with integrated insulating and conductive parts, mounted by reflow. Easy mounting due to adhesiveness (SMT: Surface-Mount-Technology). | Product Information |
| Electrical Connection, Flexible Rubber Connector [Waterproof and Resin Integrated] |
Rubber connector that can integrate the insulating part and the conductive part. Flexibility that allows flexible design (complex shape, protruding conductive parts). | Product Information |
| Waterproof and Moisture-proof Sealing Applications [PantelGEL] |
Low-hardness, high-strength silicone GEL material with excellent waterproof, dustproof and cushioning properties. Insert molding with regular resin, metal, and film is possible. | Product Information |
| Thermoplastic Elastomer for High Vibration and Shock Absorption [EXAGEL™] |
Highly flexible, flame-retardant UL94 certified. | Product Information |
Sheet
| Product | Feature | |
|---|---|---|
| Insulating sheet [POLYELEC™ functional scroll sheet] |
A wide range of variations are available to suit your application. Excellent electrically insulating properties and can be used for LiB insulating layers, etc. | Product Information |
| For transportation materials such as semiconductors, various electronic boards, precision parts, etc. [POLYELEC™ EFTLON™SK] |
Low-foamed polyethylene has excellent cushioning properties. Excellent ion cleanliness does not adversely affect metal such as lead frame. Thickness from 0.5mm to 4mm is available for a variety of electronic components. | Product Information |
| For conveying materials such as precision parts, connectors, and small electronic materials [POLYELEC™ Carrier Tape] |
Because of the plastic material, there is no fear of paper dust and dust generation. Light, with moderate rigidity and workability. | Product Information |
| Special embossed polypropylene sheets for printed circuit board transportation materials and protective agents [POLYELEC™ Circuit Board] |
Because of the plastic material, there is no fear of paper dust and dust generation. Light, with moderate rigidity and workability. Cleanable and repeatable. | Product Information |
| Persistent antistatic sheet [POLYELEC™ CPO] |
The temperature dependence is small, and the characteristics persist even in low temperature environments. Our unique technological strengths have enabled us to combine eco-friendly products. | Product Information |
| For various insulation materials, flame retardant [POLYELEC™ PN / PNN flame retardant sheet] |
A lineup of flame retardant grades.(UL94-VTM-0, V-0, HB depending on thickness) Excellent electrical insulation. Excellent secondary workability, especially hinge characteristics. 10 substances subject to RoHS2 Directive are not used. | Product Information |
Container
| Product | Feature | |
|---|---|---|
| Clean bottle | SEKISUI's clean containers are available from R&D usage to mass production usage. All products are made from the same clean raw materials, and the dissolution of components into the contents is minimized. We also offer a wide range of sizes from small (100mL) to large (200L), and can provide UN standard compliant products. | Product Information |
