Product List

Microsphere

… Sustainability Products

Product Feature
[Micropearl SP/GS]
Uniform resin particles
Uniform particle size distribution, coefficient of variation (Cv) ≦ 7%, uniform gap control. Abundant particle size lineup from 2μm to 600μm. Product
Information
[Micropearl AU]
Plastic core Metal coating Particles
Available to coat evenly with diferent type of metals onto plastic particles. Our technology can control hardness of particles and repulsive force. Product
Information
[Micropearl EX]
Particles with high size accuracy
Uniform partical size distributions that are able to maintain tighter particle size control. Excellent voltage, heat and chemical resistance. Product
Information
[Micropearl EXH]
Hard plastic material uniformed resin particles for gap control
Compared to silica particles, this particles are stable with sizes reduction and damage to the substrate. High hardness prevent settlement in the resin caused by heat. Product
Information
[Micropearl EZ]
Low recovery rate and soft resin particles for gap control
It is an acrylic co-polymer particle that is very soft and it can absorb vibration and noise. Also it reduces the damage to the substrate. Due to the lower spring back (recovery rate) of the particle, it can be used for softer substrates. Product
Information
[Micropearl SLC]
(under development): Silicone type particles
Silicon polymer based particle. It absorbs vibrations and noise. Lower spring back (recovery rate) of the particles, it can be used for softer substrates. Product
Information
[Micropearl KB]
black uniform resin Particles for gap control
Divinylbenzene co-polymer particles with black pigment dispersed. Excellent blackness and light shielding properties, and resistance to exudative. Product
Information
GAP control adhesive containing uniform particles Thermosetting adhesive containing ultra high precision spacer particles. The thickness of the adhesive can be precisely controlled. Product
Information

UV Curing Adhesive

… Sustainability Products

Product Feature Adherent body Curing conditions
Sealant for ODF
[Photolec S]
UV + heat curing adhesive with high adhesive strength and low moisture permeability. Black type with high light shielding is also available. Glass, Polyimide UV (3,000mJ / cm2) + Heat (120℃ × 60min) Product
Information
UV-curing adhesives
[Photolec A]
A highly transparent and excellent UV curing adhesive even under oxygen environment. Few impurities, halogen-free. Glass 1,500mJ / cm2 or more Product
Information
UV delayed curing Low moisture permeable adhesive
[Photolec E]
After UV irradiation, post-curing type and immediate curing type are available. Low outgas, low moisture permeability. Alkali free glass UV delay + heat (UV 1,500mJ / cm2 + 60~100℃ × 30min) Product
Information
UV (B stage) + Moisture Curing Adhesive
[Photolec B]
Easy workability (corresponding to curved surfaces and fine lines), curing light shielding parts, high adhesion of different materials, stress relaxation (flexibility after curing, thickness retention). Glass, Plastic, AL, SUS UV + Moisture Product
Information
LED encapsulation material & UTG protective resin
[Photolec New]
UV-curable μLED chip protection resin with inkjet applicability & Greatly improves pen drop resistance simply by coating. Glass UV, UV + Heat Product
Information
GAP control adhesive containing uniform particles Thermosetting adhesive containing ultra high precision spacer particles. The thickness of the adhesive can be precisely controlled. Ferrite core, Iron, SUS 150℃ × 30min or more Product
Information
Anisotropic Conductive Paste For RFID low temperture/short time curing for chip assembly in RFID inlay production. PET 140℃10sec.
170℃3sec.
Product
Information

Assembly Material

Product Feature Adherent body Curing conditions
Solder Anisotropic Conductive Paste Metal joining is possible at low temperature and low pressure. Low profile connection (less than 0. 1mm thickness), fine pitch connection (150um). PI, RF4 140℃ / 10s / Pressure 1 to 3 Mpa Product
Information
Anisotropic Conductive Paste For RFID low temperture/short time curing for chip assembly in RFID inlay production. PET 140℃10sec.
170℃3sec.
Product
Information

Foam Tape

Product Feature
Functional Foam Tape
[5200 Series]
Combination of foam and adhesive with excellent stress relaxation. High impact resistance, high step followability (waterproof, dustproof), high adhesive reliability. Product
Information
Flexible Foam Tape Foam substrate double-coated adhesive tape for fixing components that enables device recycling through reworkability. Suitable for fixing display panel and chassis. Product
Information

Tape

Product Feature
Double-faced Adhesive Tape for Fixing of LCD Components
[3800 Series]
PET-based double-sided tape with high adhesion performance to various adherends. Product
Information
Double-faced Tape for Fixing Polishing Pads for LCD Glass Substrate, CMP, and HDD Substrate Highly chemical-resistant tape with no adhesive residue when peeled off. Used for fixing polishing pad in the polishing process for electronic devices. Max. width 2450mm, suitable for CMP process. Product
Information
Conductive Tape
[7800 series]
Adhesive tape with excellent conductivity, heat dissipation, adhesive strength, bending resistance, and thinness. Suitable for grounding/shielding/heat dissipation of electronic devices. Product
Information
Protective Tape for Optical Use
[6700/6800/6900Series]
Strong adhesive protection tape that can adhere to various shaped surfaces including brightness enhancement film (BEF). Features minimal contamination of the adherend, such as tape residue. Product
Information
Photo mask protection film
[TACKWELL]
Highly durable, chemical-resistant tape with excellent optical properties produced in a clean environment, suitable as protective tape for photomasks used in PCB production. Product
Information
Masking tape for semiconductor package substrates Tape with excellent adhesion, optical properties and easy peeling, produced in a clean environment. Suitable as a protective tape for solder resist on package substrates. Product
Information
Double-sided tape for fluorine-containing resins adhesion(Developments) Double-coated adhesive tape with a proprietary compound developed based on secretions produced by mussels, which enables strong adhesion to fluorine and polyolefin resins and other hard-to-bond substrates. Product
Information

Release Film

Product Feature
Low Outgas Release Film Release film with low outgassing and excellent embedding property in high temperature heat press process at around 190℃. Suitable for manufacturing process of FPC, rigid flexible circuit board, etc. Product
Information

Removable UV Tape

Product Feature
High Heat Resistance, High Adhesion, Easy Removable UV Tape for Semiconductor Process
[SELFA HS]
UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Protects device surfaces and suppresses warpage in various PKG manufacturing processes. Product
Information
Double-Sided Heat-Resistant, High-adhesion, Easy-Release UV Tape for Wafer Support Systems
[SELFA HW]
UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Glass support system maintains device flatness during the process and ensures safe handling. Product
Information
Self-releasable Protective Tape in UBM Process
[SELFA-MP]
UV release tape that combines strong chemical resistance and low residue; UV irradiation causes gas generation, which reduces device damage and allows easy peeling. Product
Information

Film

Product Feature
Masking tape for semiconductor package substrates Tape with excellent adhesion, optical properties and easy peeling, produced in a clean environment. Suitable as a protective tape for solder resist on package substrates. Product
Information
Interlayer Insulating Film for Making Build-up Boards
[Heat-curing Build Up Film NX/NQ]
Low transmission loss, high insulation reliability. Product
Information
For 5G/6G
[Transparent & Flexible Radio Wave Reflection Film]
Innovative thin transparent and flexible film that can be attached to the any surface and can reflect radio waves in the sub6 - mm wave - THz range. Product
Information

Foam

Product Feature
Waterproof, Anti-vibration, Shock Absorbing Thin Foam
[XLIM]
Ultra-thin, high-performance foam that combines high sealing properties and high shock absorption. Product
Information

Heat Release Related Products

Product Feature
Thermal conductive insulating sheet
[Insulated Metal Substrate 「NF-type」]
A heat release material with excellent heat dissipation and insulation properties. Excellent heat resistance, high adhesion, and high reliability. Product
Information
1-Part Heat-Curable Grease
[Adhesive thermal conductive grease]
High heat conduction, good molding properties. Excellent flexibility and applicable to flexible substrates. Product
Information
1-Part Silicone-free Thermal Conductive Grease
[GA Series]
Grease Type, Silicone Free. Product
Information
2-Part Thermal Conductive Gap Filler
[CGW®Series]
Room temperature curing type two-liquid silicone grease, solventless type, high thixotropy. Product
Information
Thermal-Conductive Pads
[TIMLIGHT Insulation Series]
Low siloxane silicone sheet type. Temperature durability, electrical insulation, high heat conductivity. Product
Information
Thermal-Conductive Pads
[TIMLIGHT Soft Series]
Super flexible sheet type. High followability to irregular surface, high cushioning. Product
Information
Super Thermal-Conductive Pads
[MANION Series]
A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Product
Information
Thermal-Conductive Pads
[TIMLIGHT High Thermal Conductive Series]
A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Available in v arious hardness and thickness. Product
Information
Heat Release Electromagnetic Wave Absorbing Sheet
[Heat Release & EEM Wave Absorbing Sheet Pμ]
Provides excellent electromagnetic wave absorption while maintaining the flexibility and thermal conductivity of the heat release sheet. Product
Information

Inkjet Materials

… Sustainability Products

Product Feature
Ink for Coating/Adhesive Applications
[High Resolution 3D Printer (Inkjet) Material]
Printing size control ability in drop-on-demand. Product
Information

Polyvinyl Acetal Resin

Product Feature
Binder Resin
[S-LEC B, K]
Tough, high flexibility, high adhesiveness, crosslinkability, compatibility. Easy to dissolve in various solvents including alcohol. Product
Information
Paste Resin
[S-LEC SV]
Excellent rheological properties, high adhesion, high sheet strength, high flexibility. Product
Information

Molded Product

Product Feature
Electrical Connection, Holder Integrated Connector
[Microphone Holder Connector]
Holder and connector are integrated. Easy assembly and solderless connection. Product
Information
Rubber Connector for Electrical Connection and Grounding (Adhesive Fixing)
[Adhesive (PSA) Dot Connector]
Rubber connector with integrated insulating and conductive parts. Easy mounting due to adhesiveness (PSA: Pressure-Sensitive-Adhesive). Product
Information
Rubber Connector for Electrical Connection and Grounding (Solder Mounting)
[Board Mount (SMT) Dot Connector]
Rubber connector with integrated insulating and conductive parts, mounted by reflow. Easy mounting due to adhesiveness (SMT: Surface-Mount-Technology). Product
Information
Electrical Connection, Flexible Rubber Connector
[Waterproof and Resin Integrated]
Rubber connector that can integrate the insulating part and the conductive part. Flexibility that allows flexible design (complex shape, protruding conductive parts). Product
Information
Waterproof and Moisture-proof Sealing Applications
[PantelGEL]
Low-hardness, high-strength silicone GEL material with excellent waterproof, dustproof and cushioning properties. Insert molding with regular resin, metal, and film is possible. Product
Information
Thermoplastic Elastomer for High Vibration and Shock Absorption
[EXAGEL]
Highly flexible, flame-retardant UL94 certified. Product
Information
Thermocuring Rubber for Vibration and Shock Absorption
[G-Polstar]
Wide hardness and damping variation is avaiable. Flame-retardant UL94. Product
Information
Rubber Band for Wearable Device
[High-Performance Rubber Band]
Rubber/elastomer formula with emphasis on touch and reliability. Compression molding of rubber and insert molding with resin and metal are possible. Product
Information

Sheet

Product Feature
Insulating sheet
[POLYELEC® functional scroll sheet]
A wide range of variations are available to suit your application. Excellent electrically insulating properties and can be used for LiB insulating layers, etc. Product
Information
For transportation materials such as semiconductors, various electronic boards, precision parts, etc.
[POLYELEC® EFTLON®SK]
Low-foamed polyethylene has excellent cushioning properties. Excellent ion cleanliness does not adversely affect metal such as lead frame. Thickness from 0.5mm to 4mm is available for a variety of electronic components. Product
Information
For conveying materials such as precision parts, connectors, and small electronic materials
[POLYELEC® Carrier Tape]
Because of the plastic material, there is no fear of paper dust and dust generation. Light, with moderate rigidity and workability. Product
Information
Special embossed polypropylene sheets for printed circuit board transportation materials and protective agents
[POLYELEC® Circuit Board]
Because of the plastic material, there is no fear of paper dust and dust generation. Light, with moderate rigidity and workability. Cleanable and repeatable. Product
Information
Persistent antistatic sheet
[POLYELEC® CPO]
The temperature dependence is small, and the characteristics persist even in low temperature environments. Our unique technological strengths have enabled us to combine eco-friendly products. Product
Information
For various insulation materials, flame retardant
[POLYELEC® PN / PNN flame retardant sheet]
A lineup of flame retardant grades.(UL94-VTM-0, V-0, HB depending on thickness) Excellent electrical insulation. Excellent secondary workability, especially hinge characteristics. 10 substances subject to RoHS2 Directive are not used. Product
Information

Container

Product Feature
Clean bottle SEKISUI's clean containers are available from R&D usage to mass production usage. All products are made from the same clean raw materials, and the dissolution of components into the contents is minimized. We also offer a wide range of sizes from small (100mL) to large (200L), and can provide UN standard compliant products. Product
Information