Product List
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- Product List
Microsphere
| Product | Feature | |
|---|---|---|
| [Micropearl SP/GS] Uniform resin particles |
Uniform particle size distribution, coefficient of variation (Cv) ≦ 7%, uniform gap control. Abundant particle size lineup from 2μm to 600μm. | Product Information |
| [Micropearl AU] Plastic core Metal coating Particles |
Available to coat evenly with diferent type of metals onto plastic particles. Our technology can control hardness of particles and repulsive force. | Product Information |
| [Micropearl EX] Particles with high size accuracy |
Uniform partical size distributions that are able to maintain tighter particle size control. Excellent voltage, heat and chemical resistance. | Product Information |
| [Micropearl EXH] Hard plastic material uniformed resin particles for gap control |
Compared to silica particles, this particles are stable with sizes reduction and damage to the substrate. High hardness prevent settlement in the resin caused by heat. | Product Information |
| [Micropearl EZ] Low recovery rate and soft resin particles for gap control |
It is an acrylic co-polymer particle that is very soft and it can absorb vibration and noise. Also it reduces the damage to the substrate. Due to the lower spring back (recovery rate) of the particle, it can be used for softer substrates. | Product Information |
| [Micropearl SLC] (under development): Silicone type particles |
Silicon polymer based particle. It absorbs vibrations and noise. Lower spring back (recovery rate) of the particles, it can be used for softer substrates. | Product Information |
| [Micropearl KB] black uniform resin Particles for gap control |
Divinylbenzene co-polymer particles with black pigment dispersed. Excellent blackness and light shielding properties, and resistance to exudative. | Product Information |
| [Micropearl SOL] Polymer core solder ball |
Accurate gap control is possible with a flexible and uniform size resin core. Ensures high connection reliability, standoff and flatness. | Product Information |
| GAP control adhesive containing uniform particles | Thermosetting adhesive containing ultra high precision spacer particles. The thickness of the adhesive can be precisely controlled. | Product Information |
UV Curing Adhesive
| Product | Feature | Adherent body | Curing conditions | |
|---|---|---|---|---|
| Sealant for ODF [Photolec S] |
UV + heat curing adhesive with high adhesive strength and low moisture permeability. Black type with high light shielding is also available. | Glass, Polyimide | UV (3,000mJ / cm2) + Heat (120℃ × 60min) | Product Information |
| UV-curing adhesives [Photolec A] |
A highly transparent and excellent UV curing adhesive even under oxygen environment. Few impurities, halogen-free. | Glass | 1,500mJ / cm2 or more | Product Information |
| UV delayed curing Low moisture permeable adhesive [Photolec E] |
After UV irradiation, post-curing type and immediate curing type are available. Low outgas, low moisture permeability. | Alkali free glass | UV delay + heat (UV 1,500mJ / cm2 + 60～100℃ × 30min) | Product Information |
| UV (B stage) + Moisture Curing Adhesive [Photolec B] |
Easy workability (corresponding to curved surfaces and fine lines), curing light shielding parts, high adhesion of different materials, stress relaxation (flexibility after curing, thickness retention). | Glass, Plastic, AL, SUS | UV + Moisture | Product Information |
| LED encapsulation material & UTG protective resin [Photolec New] |
UV-curable μLED chip protection resin with inkjet applicability & Greatly improves pen drop resistance simply by coating. | Glass | UV, UV + Heat | Product Information |
| GAP control adhesive containing uniform particles | Thermosetting adhesive containing ultra high precision spacer particles. The thickness of the adhesive can be precisely controlled. | Ferrite core, Iron, SUS | 150℃ × 30min or more | Product Information |
| Anisotropic Conductive Paste For RFID | low temperture/short time curing for chip assembly in RFID inlay production. | PET | 140℃10sec. 170℃3sec. |
Product Information |
Assembly Material
| Product | Feature | Adherent body | Curing conditions | |
|---|---|---|---|---|
| Solder Anisotropic Conductive Paste | Metal joining is possible at low temperature and low pressure. Low profile connection (less than 0. 1mm thickness), fine pitch connection (150um). | PI, RF4 | 140℃ / 10s / Pressure 1 to 3 Mpa | Product Information |
| Anisotropic Conductive Paste for reflow soldering | Can be assembled only by heating. Solder particles self-aggregate on electrodes and form metal bonds. | Glass, RF4, PI | Reflow SnBi 160～180℃ 3min SAC 240～260℃ 3min |
Product Information |
| [Micropearl SOL] Polymer core solder ball |
Accurate gap control is possible with a flexible and uniform size resin core. Ensures high connection reliability, standoff and flatness. | ― | ― | Product Information |
| Anisotropic Conductive Paste For RFID | low temperture/short time curing for chip assembly in RFID inlay production. | PET | 140℃10sec. 170℃3sec. |
Product Information |
Foam Tape
| Product | Feature | |
|---|---|---|
| Functional Foam Tape [5200 Series] |
Combination of foam and adhesive with excellent stress relaxation. High impact resistance, high step followability (waterproof, dustproof), high adhesive reliability. | Product Information |
| Flexible Foam Tape | Foam substrate double-coated adhesive tape for fixing components that enables device recycling through reworkability. Suitable for fixing display panel and chassis. | Product Information |
Tape
| Product | Feature | |
|---|---|---|
| Double-faced Adhesive Tape for Fixing of LCD Components [3800 Series] |
PET-based double-sided tape with high adhesion performance to various adherends. | Product Information |
| Double-faced Tape for Fixing Polishing Pads for LCD Glass Substrate, CMP, and HDD Substrate | Highly chemical-resistant tape with no adhesive residue when peeled off. Used for fixing polishing pad in the polishing process for electronic devices. Max. width 2450mm, suitable for CMP process. | Product Information |
| Conductive Tape [7800 series] |
Adhesive tape with excellent conductivity, heat dissipation, adhesive strength, bending resistance, and thinness. Suitable for grounding/shielding/heat dissipation of electronic devices. | Product Information |
| Protective Tape for Optical Use [6700/6800/6900Series] |
Strong adhesive protection tape that can adhere to various shaped surfaces including brightness enhancement film (BEF). Features minimal contamination of the adherend, such as tape residue. | Product Information |
| Photo mask protection film [TACKWELL] |
Highly durable, chemical-resistant tape with excellent optical properties produced in a clean environment, suitable as protective tape for photomasks used in PCB production. | Product Information |
| Masking tape for semiconductor package substrates | Tape with excellent adhesion, optical properties and easy peeling, produced in a clean environment. Suitable as a protective tape for solder resist on package substrates. | Product Information |
| Double-sided tape for fluorine-containing resins adhesion(Developments) | Double-coated adhesive tape with a proprietary compound developed based on secretions produced by mussels, which enables strong adhesion to fluorine and polyolefin resins and other hard-to-bond substrates. | Product Information |
Release Film
| Product | Feature | |
|---|---|---|
| Low Outgas Release Film | Release film with low outgassing and excellent embedding property in high temperature heat press process at around 190℃. Suitable for manufacturing process of FPC, rigid flexible circuit board, etc. | Product Information |
Removable UV Tape
| Product | Feature | |
|---|---|---|
| High Heat Resistance, High Adhesion, Easy Removable UV Tape for Semiconductor Process [SELFA HS] |
UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Protects device surfaces and suppresses warpage in various PKG manufacturing processes. | Product Information |
| Double-Sided Heat-Resistant, High-adhesion, Easy-Release UV Tape for Wafer Support Systems [SELFA HW] |
UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Glass support system maintains device flatness during the process and ensures safe handling. | Product Information |
| Self-releasable Protective Tape in UBM Process [SELFA-MP] |
UV release tape that combines strong chemical resistance and low residue; UV irradiation causes gas generation, which reduces device damage and allows easy peeling. | Product Information |
Film
| Product | Feature | |
|---|---|---|
| Masking tape for semiconductor package substrates | Tape with excellent adhesion, optical properties and easy peeling, produced in a clean environment. Suitable as a protective tape for solder resist on package substrates. | Product Information |
| Interlayer Insulating Film for Making Build-up Boards [Heat-curing Build Up Film NX/NQ] |
Low transmission loss, high insulation reliability. | Product Information |
| For 5G/6G [Transparent & Flexible Radio Wave Reflection Film] |
Innovative thin transparent and flexible film that can be attached to the any surface and can reflect radio waves in the Sub6 - mm wave - THz range. | Product Information |
Foam
| Product | Feature | |
|---|---|---|
| Waterproof, Anti-vibration, Shock Absorbing Thin Foam [XLIM] |
Ultra-thin, high-performance foam that combines high sealing properties and high shock absorption. | Product Information |
Heat Release Related Products
| Product | Feature | |
|---|---|---|
| Thermal conductive insulating sheet [Insulated Metal Substrate 「NF-type」] |
A heat release material with excellent heat dissipation and insulation properties. Excellent heat resistance, high adhesion, and high reliability. | Product Information |
| 1-Part Heat-Curable Grease [Adhesive thermal conductive grease] |
High heat conduction, good molding properties. Excellent flexibility and applicable to flexible substrates. | Product Information |
| 1-Part Silicone-free Thermal Conductive Grease [GA Series] |
Grease Type, Silicone Free. | Product Information |
| 2-Part Thermal Conductive Gap Filler [CGW®Series] |
Room temperature curing type two-liquid silicone grease, solventless type, high thixotropy. | Product Information |
| Thermal-Conductive Pads [TIMLIGHT Insulation Series] |
Low siloxane silicone sheet type. Temperature durability, electrical insulation, high heat conductivity. | Product Information |
| Thermal-Conductive Pads [TIMLIGHT Soft Series] |
Super flexible sheet type. High followability to irregular surface, high cushioning. | Product Information |
| Super Thermal-Conductive Pads [MANION Series] |
A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. | Product Information |
| Thermal-Conductive Pads [TIMLIGHT High Thermal Conductive Series] |
A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Available in v arious hardness and thickness. | Product Information |
| Heat Release Electromagnetic Wave Absorbing Sheet [Heat Release & EEM Wave Absorbing Sheet Pμ] |
Provides excellent electromagnetic wave absorption while maintaining the flexibility and thermal conductivity of the heat release sheet. | Product Information |
Inkjet Materials
| Product | Feature | |
|---|---|---|
| Ink for Coating/Adhesive Applications [High Resolution 3D Printer (Inkjet) Material] |
Printing size control ability in drop-on-demand. | Product Information |
Polyvinyl Acetal Resin
| Product | Feature | |
|---|---|---|
| Binder Resin [S-LEC B, K] |
Tough, high flexibility, high adhesiveness, crosslinkability, compatibility. Easy to dissolve in various solvents including alcohol. | Product Information |
| Paste Resin [S-LEC SV] |
Excellent rheological properties, high adhesion, high sheet strength, high flexibility. | Product Information |
Molded Product
| Product | Feature | |
|---|---|---|
| Electrical Connection, Holder Integrated Connector [Microphone Holder Connector] |
Holder and connector are integrated. Easy assembly and solderless connection. | Product Information |
| Rubber Connector for Electrical Connection and Grounding (Adhesive Fixing) [Adhesive (PSA) Dot Connector] |
Rubber connector with integrated insulating and conductive parts. Easy mounting due to adhesiveness (PSA: Pressure-Sensitive-Adhesive). | Product Information |
| Rubber Connector for Electrical Connection and Grounding (Solder Mounting) [Board Mount (SMT) Dot Connector] |
Rubber connector with integrated insulating and conductive parts, mounted by reflow. Easy mounting due to adhesiveness (SMT: Surface-Mount-Technology). | Product Information |
| Electrical Connection, Flexible Rubber Connector [Waterproof and Resin Integrated] |
Rubber connector that can integrate the insulating part and the conductive part. Flexibility that allows flexible design (complex shape, protruding conductive parts). | Product Information |
| Waterproof and Moisture-proof Sealing Applications [Pantel GEL] |
Low-hardness, high-strength silicone GEL material with excellent waterproof, dustproof and cushioning properties. Insert molding with regular resin, metal, and film is possible. | Product Information |
| Thermoplastic Elastomer for High Vibration and Shock Absorption [EXAGEL] |
Highly flexible, flame-retardant UL94 certified. | Product Information |
| Thermocuring Rubber for Vibration and Shock Absorption [G-Polstar] |
Wide hardness and damping variation is avaiable. Flame-retardant UL94. | Product Information |
| Rubber Band for Wearable Device [High-Performance Rubber Band] |
Rubber/elastomer formula with emphasis on touch and reliability. Compression molding of rubber and insert molding with resin and metal are possible. | Product Information |