Heat Release Related Products
（Heat Release Related Series）
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- Heat Release Related Products（Heat Release Related Series）
Heat Conductive Paste/Heat Release Grease
Heat Conductive Paste／Adhesive
Sekisui Chemical's NT / TP is a flexible & silicone-free heat conductive paste that can be molded on heat-generated device without voids only by coating and oven curing. Also, because it is a type that radiates into the air, it can easily diffuse the heat of devices.
Solvent-free type that can be applied to flexible printed circuits, minimum 20um BLT can achieve ultra-low heat resistance, which makes design more flexible. It can also be used as heat conductive adhesive because of its nature adhesion.
Themal conductive grease(1 & 2 component) / Non adhesive
Sekisui Chemical's grease is available in 1-component and 2-component types, and it has excellent reworkability because of the lack of adhesion. Since 1-component grease does not use silicone oil, it will not cause conduction failure due to low molecular siloxane. It is also easy to handle and can achieve automation by dispenser.
The two-component type of the CGW® series is a solvent-free material that can be cured at room temperature. Particularly, it can be effectively used for power devices and battery systems by its excellent heat resistance. It has a pump-outless design and high chixo, which supports automation. In particular, it is a material with excellent storage stability.
Usage Example
Can be coated by both dispense and screen printing.
Dispensing
Printing
Comparison Chart
To confirm the heat release effect of directly coating on IC.
The photo is for NT / TP products
| Product | Feature | |
|---|---|---|
| 1-Part Heat-Curable Grease [Adhesive thermal conductive grease] |
High heat conduction, good molding properties. Excellent flexibility and applicable to flexible substrates. | Product Information |
| 1-Part Silicone-free Thermal Conductive Grease [GA Series] |
Grease Type, Silicone Free. | Product Information |
| 2-Part Thermal Conductive Gap Filler [CGW®Series] |
Room temperature curing type two-liquid silicone grease, solventless type, high thixotropy. | Product Information |
Heat Release Sheet
If there is a space in the heat dissipation area, it is common to use a sheet-type heat conductive material (TIM material) which achieves higher thermal conductivity. Sekisui Chemical has developed a heat conductive sheet that simultaneously achieve high thermal conductivity and flexibility by its unique filler orientation technology. Sekisui’s heat conductive sheet has a wide variety of properties such as silicone-free and insulation, and are used in various devices.
Recently, we have achieved an ultra-low thermal resistance value by developing a thin heat conductive sheet.
Example
| Product | Feature | |
|---|---|---|
| Thermal-Conductive Pads [TIMLIGHT High Thermal Conductive Series] |
A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Available in various hardness and thickness. | Product Information |
| Thermal-Conductive Pads [TIMLIGHT Soft Series] |
Super flexible sheet type. High followability to irregular surface, high cushioning. | Product Information |
| Super Thermal-Conductive Pads [MANION Series] |
A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. | Product Information |
| Thermal-Conductive Pads [TIMLIGHT Insulation Series] |
Low siloxane silicone sheet type. Temperature durability, electrical insulation, high heat conductivity. | Product Information |
| Heat Release Electromagnetic Wave Absorbing Sheet [Heat Release & EEM Wave Absorbing Sheet Pμ] |
Provides excellent electromagnetic wave absorption while maintaining the flexibility and thermal conductivity of the heat release sheet. | Product Information |
Thermal conductive insulating sheet (Insulated Metal Substrate)
The heat release material which is widely used in power device. By highly filled with high thermal conductivity filler into epoxy resin, the material show great insulation and high thermal conductivity simultaneously.
Futhermore, it can also replace ceramic substrate by its high reliability.
Resin Substrate(P-Fin): Achieving thin coating, high insulation, high thermal conductivity simultaneously. It can be widely used in power module by its moisture resistance, voltage resistance, durability.
Insulation Heat Release Sheet with Copper(N-Fin): A copper coating adhesive sheet with high reliability. Can be used in IPM module.
Brief Introduction
| Product | Resin Substrate with B-stage layer | Thermal conductive insulating sheet |
|---|---|---|
| NF-type | Insulating sheet for IMS (Insulated Metal Substrate) | |
| Brief |  |
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| Product Composition |  |
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| Example | IPM Module 
|
IGBT Module 
|
Application and Example
| Product | Feature | |
|---|---|---|
| Thermal conductive insulating sheet [Insulated Metal Substrate 「NF-type」] |
A heat release material with excellent heat dissipation and insulation properties. Excellent heat resistance, high adhesion, and high reliability. | Product Information |