UV-curing adhesives
Photolec™ A

UV-curing high transparency adhesives without oxygen inhibition

1. Characteristics

  • Low pollution, Halogen free
  • Quick UV curing
  • High transparency and refraction
  • Suitable for situational manufacturing processes
  • Low moisture permeation
  • Reflow heat resistance (maintains transparency even after reflow)
  • We have a black version of the resin that is also cured instantly with UV

2. Applications

1For optical uses

Fixing Optical Lens, CMOS Sensors
Excluding light at the edge

Fixing Optical Lens, CMOS Sensors Excluding light at the edge
Strong and highly accurate bonding can be achieved

2For protecting glass substrates

Protecting base materials when etching them

3For LCD use

LCD sealing,Moisture proof around the narrow bezel panel,light shielding

  • Wipe-off the liquid crystal
    • After injecting the liquid crystal, wipe off extra liquid crystal that is stuck onto the cross section of the panel
  • Dispense Photolec™ A
  • Permeation of sealant
    • The encapsulant penetrates due to the negative pressure in the panel
    • Penetration level (from cross section), Usually about 0.5 to 1.0 mm
  • Hardening of sealant
    • UV irradiation from cross section（UV irradiation from the side may damage the liquid crystal）
    • The amount of light which can reach the liquid crystal interface is insufficient due to over-penetration
    • When the interface is insufficiently cured, it may cause a detecting failure of the liquid crystal display screen

Sealant reacts (cures) with heat, the reaction with heat will increase the adhesion strength to the surface of the glass. We recommend applying heat during the annealing process (recommended conditions: 100℃ for at least 30 minutes)

4Additional merits

This product can protect the electrode of FPC substrates

3. Process

UV curing (heating is unnecessary)
After applying our Photolec™ A on transparent substrates, the curing process begins
Mechanical Properties
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