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… Sustainability Products
| Material Category |
Product | Feature | Adherent body (Adhesive) |
Curing conditions | |
|---|---|---|---|---|---|
| Microsphere/ UV Curing Adhesive |
GAP control adhesive containing uniform particles | Thermosetting adhesive containing ultra high precision spacer particles. The thickness of the adhesive can be precisely controlled. | Ferrite core, Iron, SUS | 150℃ × 30min or more | Product Information |
| UV Curing Adhesive | Sealant for ODF [Photolec S] |
UV + heat curing adhesive with high adhesive strength and low moisture permeability. Black type with high light shielding is also available. | Glass, Polyimide | UV (3,000mJ / cm2) + Heat (120℃ × 60min) | Product Information |
| UV Curing Adhesive | UV-curing adhesives [Photolec A] |
A highly transparent and excellent UV curing adhesive even under oxygen environment. Few impurities, halogen-free. | Glass | 1,500mJ / cm2 or more | Product Information |
| UV Curing Adhesive | UV delayed curing Low moisture permeable adhesive [Photolec E] |
After UV irradiation, post-curing type and immediate curing type are available. Low outgas, low moisture permeability. | Alkali free glass | UV delay + heat (UV 1,500mJ / cm2 + 60～100℃ × 30min) | Product Information |
| UV Curing Adhesive | UV (B stage) + Moisture Curing Adhesive [Photolec B] |
Easy workability (corresponding to curved surfaces and fine lines), curing light shielding parts, high adhesion of different materials, stress relaxation (flexibility after curing, thickness retention). | Glass, Plastic, AL, SUS | UV + Moisture | Product Information |
| UV Curing Adhesive | LED encapsulation material & UTG protective resin [Photolec New] |
UV-curable μLED chip protection resin with inkjet applicability & Greatly improves pen drop resistance simply by coating. | Glass | UV, UV + Heat | Product Information |
| Assembly Material | Solder Anisotropic Conductive Paste | Metal joining is possible at low temperature and low pressure. Low profile connection (less than 0. 1mm thickness), fine pitch connection (150um). | PI, RF4 | 140℃ / 10s / Pressure 1 to 3 Mpa | Product Information |
| UV Curing Adhesive/ Assembly Material |
Anisotropic Conductive Paste For RFID | low temperture/short time curing for chip assembly in RFID inlay production. | PET | 140℃10sec. 170℃3sec. |
Product Information |
| Inkjet Materials | Ink for Coating/Adhesive Applications [High Resolution 3D Printer (Inkjet) Material] |
Printing size control ability in drop-on-demand. | ― | ― | Product Information |