Search by Product CategoryAdhesive

No. Brief Material Category Series/
Photolec Series UV Curing Adhesive Photolec Series Photolec S, Photolec A, Photolec E, Photolec B Product Information
Assembly Material Series Assembly Material Assembly Material Series SACP, SAP, Micropearl SOL Product Information
White Solder Resist for LED Substrate Resist Ink White Solder Resist White Solder Resist。 High reflectivity, high heat resistance yellowing, high reliability. Product Information
Heat Release Related Series Heat Release Related Products Heat Release Related Series Heat Release Fin P-fin/N-fin, Heat Conductive Paste NT / NP, Thermal Release & Insulation Sheet KNDJ / SH / LM, Silicone-free Thermal Conductive Grease GA, Thermal Conductive Grease CGW, Silicone Thermal Conductive Sheet PT, FEATHER, High Heat Conductive Sheet PT, Silicone-free Thermal Conductive Sheet SF Product Information
Ink for Coating / Adhesive Applications Inkjet Materials High Resolution 3D Printer (Inkjet) Material Low transmission loss, high insulation reliability. Product Information
Sealing Material with Waterproof and Moisture-proof Waterproof / Moisture Proof / Vibration Proof UV Curable Moisture Proof Sealant ACG high flexibility, high elasticity, easy peeling. Product Information