UV (B stage) + Moisture Curing Adhesive
Photolec B
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- UV (B stage) + Moisture Curing Adhesive Photolec B
A new type of adhesive that combines the advantages of tape and structural adhesives, and has both high initial strength and high reliability.
1. What is Photolec B?
Small device applications
(smartphone, Wearable device, Earphones etc.)
Medium and large device applications
(TV, Digital signage, monitor, NotebookPC, Tablet etc.)
2. Overview
![Overview01](./images/pic_u16_N_01.png)
![Overview02](./images/pic_u16_N_02.png)
3. Features
1High initial bonding strength
![High initial bonding strength](./images/pic_u16_3_01.png)
2Can correspond to narrow side dispensing below 0.5mm
![Can correspond to narrow side dispensing below 0.5mm](./images/pic_u16_3_02.png)
3Suitable for bonding of different materials
![Suitable for bonding of different materials](./images/pic_u16_02_02.png)
4Maintain softness after fully cured
![Maintain softness after fully cured](./images/pic_u16_3_04.jpg)
5Can maintain a certain glue height
![Can maintain a certain glue height](./images/pic_u16_10.gif)
4.Application
Smart phones
![](./images/pic_u16_4_01.jpg)
Optical components
![](./images/pic_u16_4_03.jpg)
Fine parts fixing
![](./images/pic_u16_4_02.jpg)
Large displays
![](./images/pic_u16_4_04.jpg)
Automotive display
![](./images/pic_u16_4_05.jpg)