LED encapsulation material & UTG protective resin
Photolec New
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UTG protective resin
Summary
UV curable coating material for ultra-thin cover glass (UTG) used in folderable displays to prevent cracking and shattering.
By coating protective resin to UTG, impact resistance and shatterproof function of glass can be greatly improved while maintaining transparency and bending characteristics.
By using UTG protective resin, no shange even after 200,000 times of bending tests, and highly reliable displays can be realized while maintaining the unique design characteristics of glass.Widely available for folderable models using UTG.
Characteristic
- Solventless and UV + heat curable
- High surface smoothness, high transparency, bending resistance, impact resistance, shatterproof
Application
folderable smartphone, tablet, laptop
μLED sealing resin
Summary
μLEDs are self-luminescent LED chips of less than 100µm. They are expected to be applied to next-generation displays such as TVs, signage, and AR/VR.
Chip encapsulation of μLED displays is expected to become more difficult with conventional processes as chips become smaller and narrower in pitch.Therefore, a resin is needed to seal between the chips using a process such as inkjet application.
Photorec for μLED is an ink-jet compatible, low viscosity, solvent-free UV curable encapsulating resin.Chip encapsulation and underfill can be done at the same time in a batch.
We also have a lineup of ultra-hard grades, which can provide the above-mentioned sealing performance and cover glass functions in a single process.Therefore, by replacing the conventional stacked structure with photorec, thinner and lighter devices can be realized.
Characteristic
- Solventless, UV-curable protective resin
- High surface smoothness, high transparency, chip protection, underfill
- Prevents color mixing by blackening, Anti-gloss
Application
TV, Sinage, AR/VR