테이프 대체 용도 UV(B 스테이지)+ 습기 경화성 접착제
포토렉 B
양면 테이프와 접착제의 강점을 융합하여 초기 접착력과 신뢰성을 겸비한 접착제입니다.
1. What is Photolec B?
소형 디바이스 애플리케이션
(스마트폰, 웨어러블 디바이스이어폰, 이어폰 등)
중대형디바이스 애플리케이션
(TV, 디지털 사이니지, 모니터, 노트북 PC, 태블릿 등)
2. Overview
![Polyurethane moisture curing](./images/pic_u16_N_01_03.png)
![30cc Syringe](./images/pic_u16_N_02.png)
3. Features
1High initial bonding strength
![High initial bonding strength](./images/pic_u16_3_01_02.png)
2Can correspond to narrow side dispensing below 0.5mm
![Can correspond to narrow side dispensing below 0.5mm](./images/pic_u16_3_02_02.png)
3Suitable for bonding of different materials
![Suitable for bonding of different materials](./images/pic_u16_02_02.png)
4Maintain softness after fully cured
![硬化後も柔軟性を持つ](./images/pic_u16_3_04.jpg)
5Can maintain a certain glue height
![形状維持ができる](./images/pic_u16_10.gif)
4.Application
Smart phones
![Smart phones](./images/pic_u16_4_01.jpg)
Optical components
![Optical components](./images/pic_u16_4_03.jpg)
Fine parts fixing
![Fine parts fixing](./images/pic_u16_4_02.jpg)
Large displays
![large displays](./images/pic_u16_4_04.jpg)
Automotive display
![Automotive display](./images/pic_u16_4_05.jpg)