테이프 대체 용도 UV（B 스테이지）+ 습기 경화성 접착제
포토렉 B

양면 테이프와 접착제의 강점을 융합하여 초기 접착력과 신뢰성을 겸비한 접착제입니다.

1. What is Photolec™ B?

소형 디바이스 애플리케이션
（스마트폰, 웨어러블 디바이스이어폰, 이어폰　등）

중대형디바이스 애플리케이션
（TV, 디지털 사이니지, 모니터, 노트북 PC, 태블릿　등）

2. Overview

Polyurethane moisture curing
30cc Syringe

3. Features

1High initial bonding strength

High initial bonding strength
No fixture required, pressure keeping→improve production efficiency

2Can correspond to narrow side dispensing below 0.5mm

Can correspond to narrow side dispensing below 0.5mm
No glue overflow + high degree of freedom in dispensing→suitable for bonding at narrow borders

3Suitable for bonding of different materials

Suitable for bonding of different materials
Can improve the freedom of material selection

4Maintain softness after fully cured

硬化後も柔軟性を持つ
Can absorb the stress caused by the deformation of the adherend

5Can maintain a certain glue height

形状維持ができる
Improve the freedom of product design

4.Application

Smart phones

Smart phones

Optical components

Optical components

Fine parts fixing

Fine parts fixing

Large displays

large displays

Automotive display

Automotive display
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