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Recommended Use (Micropearl SOL)
Reduction in size and weight and High Density of your package
and module are enable.?
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Mounting both sides, POP
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- Keeping Stand-off Height
- High Connection Reliability
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Wafer Level CSP , Ceramic PKG
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- Dissolving mismatch of materials
- Improvement of reliability without underfill
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Flip Chip Bump
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 ?
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- Control bump height
- High Connection Reliability(For thin chip)
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Chip Stack package
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- Good coplanarity by accurate stand-off ability
- For small diameter particle
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Micropearl SOL
