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Feature (Micropearl SOL)
Uniformly-sized plastic core produced by Sekisui unique technology
- 1.becomes buffer for stress of solder ball
->enable
improvement of reliability without underfill
- 2.enable to control accurate gap.
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Solder ball
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Micropearl SOL
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Stress focused to edge
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Stress dispersed!
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Collapsed and Bridging
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Control height!
NO Bridging!
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Micropearl SOL
