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Themal Conductive Bonding sheet (prepreg)
KNDJ
series
Good Flexibility and easy to handle the film before and after curing.
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Before curing
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After curing
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Basic Properties *1
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Properties |
KNDJ001 |
KNDJ002 |
KNDJ003 |
remarks |
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Thickness |
50-300 um |
50-300 um |
50-300 um |
IPC 4101 |
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Thermal
conductivity |
High
(2.8W/m*K)
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Middle
(1.7W/m*K)
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Standard
(1.0W/m*K)
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ASTM E1461 |
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Breakdown
voltage (AC) *2 |
>4 kV |
>6 kV |
>6 kV |
ASTM D149 |
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Peel strength *2 |
1.6 kgf/cm |
1.8 kgf/cm |
1.5 kgf/cm |
JIS C6481 |
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Solder float
(288'C) *2 |
> 10min |
> 10min |
> 10min |
High power
program hot plate |
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Solder float
(300'C) *2
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> 5min |
> 5min |
> 5min |
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Flammability |
UL-V0
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UL-V0
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UL-V0
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file No. E326277
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*1 These are representative values, and not guaranteed values
*2 Test specimen: Al: 1.0mm, Insulation layer:80um , Cu: 35um (1 oz)
Sample type
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1.Heat curable
adhesive sheet (PP)
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2.Resin coated copper
(RCC)
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3.Metal base copper clad
Laminate (MCCL)
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Low elastic modulus type is availiable. Please contact us.
Thermal Conductive Bonding Sheet(PREPREG)
Features
- High Thermal Conductivity (SHG-005)
- High Insulation Performance
- High Machining Property (STC Series)
- High PCT Reliability
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Properties
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Properties
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STC002
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STC00H
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SHG-005
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remarks
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Thermal conductivity
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1.5 W/m.K
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0.5 W/m.K
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4.9 W/m.K
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Nano Flash
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Insulation layer (mm)
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80
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50
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60, 80
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IPC-4101
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Breakdown Voltage /kV
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Initial
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>8
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>4
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>4
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ASTM D149
(Test condition A)
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After PCT 168h
(121?C 100%RH 2atm)
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>8
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>4
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>4
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Peel strength /?kgf/cm
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Initial
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>1.8
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>1.8
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>1.8
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JIS C6481
(Test condition A)
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After PCT 168h
(121?C 100%RH 2atm)
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>1.8
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>1.8
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>1.8
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Function
