UV delayed curing Low moisture permeable adhesive
Photolec E
- Top Page
- Adhesives Product lineup
- UV delayed curing Low moisture permeable adhesive Photolec E
A low-moisture UV-curing adhesive that adheres opaque substrates at low temperatures in a short time.
1. Characteristics
- Curing will start a few minutes after UV irradiation. By heating at low temperature for a short time, it cures quickly.
- Low Outgas, Moisture-proof
![Characteristics](./images/pic_u15_04.jpg)
2. Temporary curing procees
Dispense→UV Curing→Bonding→Heat Curing
![Dispense→UV Curing→Bonding→Heat Curing](./images/pic_u15_01.png)
3. Applications
1After-cure
This type is best for sealing materials which are subject to heat, for polarizing parts, and for plastic plates.
2Low moisture permeability
Moisture-proof sealant for OLED Display
![Structure of OLED display (top emission type)](./images/pic_u15_02.png)
- This product releases minimal gas generated during curing proccess (UV/heat)
- Semiconductor (MEMS, CCD) sealing
Low Outgas
![Low Outgas](./images/pic_u15_03.png)
Strong and highly accurate adhesion can be achieved
※ With Micropearl SP/GS
- Bonding for plastic substrates
- Bonding for optical components
- Hard disks, surrounding sealants (low moisture permeability), internal adhesive (low outgas)
- Semiconductor(MEMS,CCD camera module)