Sekisui's heat release technology

Introduction of Sekisui's materials/processing/evaluation technologies

Application examples of our products

Downsizing/ faster processing speed/ higher power of electronic components requires thermal countermeasure for products in various fields, such as mobile instrument, automotive devices, and inverter component. Sekisui Chemical Co., Ltd. provides unique epoxy-based thermal conductive insulation materials in various forms according to specific needs, and we receive high evaluations for our products from the markets.

Special processing method / check / inspection

Ultra high precision punching process

Punching process, utilizing equipment with image recognition system, enables ultra-high-precision processing of materials.

Patterning process of thick copper

It is possible to apply pattern process on thick copper form with more than 1mm thickness.

Evaluation / Simulation technology

For developing better performance heat release materials and products, Sekisui Chemical has various kinds of evaluation instruments.
Sekisui Chemical has thermal characteristic evaluation / simulation insturuments of various kinds of devices,

By a combination of thermal characteristic evaluation and simulation of our actual products in production, we continue to make effort in order to offer more effective solutions for heat release technology.