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DEVICE
Material
Category		 Product Feature
1 UV Curing Adhesive/Assembly Material Anisotropic Conductive Paste For RFID low temperture/short time curing for chip assembly in RFID inlay production. Product
Information
2 Microsphere/UV Curing Adhesive GAP control adhesive containing uniform particles Thermosetting adhesive containing ultra high precision spacer particles. The thickness of the adhesive can be precisely controlled. Product
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3 Film For 5G/6G
[Transparent & Flexible Radio Wave Reflection Film]		 Innovative thin transparent and flexible film that can be attached to the any surface and can reflect radio waves in the 2GHz-sub6 - mm wave - 150GHz range. Product
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4 Heat Release Related Products 1-Part Silicone-free Thermal Conductive Grease
[GA Series]		 Grease Type, Silicone Free. Product
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Heat Release Related Products 2-Part Thermal Conductive Gap Filler
[CGW®Series]		 Room temperature curing type two-liquid silicone grease, solventless type, high thixotropy. Product
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Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT Soft Series]		 Super flexible sheet type. High followability to irregular surface, high cushioning. Product
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Heat Release Related Products Super Thermal-Conductive Pads
[MANION Series]		 A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Product
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Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT High Thermal Conductive Series]		 A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Available in various hardness and thickness. Product
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5 Molded Product Electrical Connection, Flexible Rubber Connector
[Waterproof and Resin Integrated]		 Rubber connector that can integrate the insulating part and the conductive part. Flexibility that allows flexible design (complex shape, protruding conductive parts). Product
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6 Sheet Insulating sheet
[POLYELEC® functional scroll sheet]		 A wide range of variations are available to suit your application. Excellent electrically insulating properties and can be used for LiB insulating layers, etc. Product
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Sheet For transportation materials such as semiconductors, various electronic boards, precision parts, etc.
[POLYELEC® EFTLON®SK]		 Low-foamed polyethylene has excellent cushioning properties. Excellent ion cleanliness does not adversely affect metal such as lead frame. Thickness from 0.5mm to 4mm is available for a variety of electronic components. Product
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Sheet For conveying materials such as precision parts, connectors, and small electronic materials
[POLYELEC® Carrier Tape]		 Because of the plastic material, there is no fear of paper dust and dust generation. Light, with moderate rigidity and workability. Product
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Sheet Special embossed polypropylene sheets for printed circuit board transportation materials and protective agents
[POLYELEC® Circuit Board]		 Because of the plastic material, there is no fear of paper dust and dust generation. Light, with moderate rigidity and workability. Cleanable and repeatable. Product
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Sheet Persistent antistatic sheet
[POLYELEC® CPO]		 The temperature dependence is small, and the characteristics persist even in low temperature environments. Our unique technological strengths have enabled us to combine eco-friendly products. Product
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Sheet For various insulation materials, flame retardant
[POLYELEC® PN / PNN flame retardant sheet]		 A lineup of flame retardant grades.(UL94-VTM-0, V-0, HB depending on thickness) Excellent electrical insulation. Excellent secondary workability, especially hinge characteristics. 10 substances subject to RoHS2 Directive are not used. Product
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