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Material
Category		 Product Feature
1 Microsphere [Micropearl SP/GS]
Uniform resin particles		 Uniform particle size distribution, coefficient of variation (Cv) ≦ 7%, uniform gap control. Abundant particle size lineup from 2μm to 600μm. Product
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Microsphere [Micropearl AU]
Plastic core Metal coating Particles		 Available to coat evenly with diferent type of metals onto plastic particles. Our technology can control hardness of particles and repulsive force. Product
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Microsphere [Micropearl EX]
Particles with high size accuracy		 Uniform partical size distributions that are able to maintain tighter particle size control. Excellent voltage, heat and chemical resistance. Product
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Microsphere [Micropearl EZ]
Low recovery rate and soft resin particles for gap control		 It is an acrylic co-polymer particle that is very soft and it can absorb vibration and noise. Also it reduces the damage to the substrate. Due to the lower spring back (recovery rate) of the particle, it can be used for softer substrates. Product
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Microsphere [Micropearl SLC]
(under development): Silicone type particles		 Silicon polymer based particle. It absorbs vibrations and noise. Lower spring back (recovery rate) of the particles, it can be used for softer substrates. Product
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2 Microsphere/UV Curing Adhesive GAP control adhesive containing uniform particles Thermosetting adhesive containing ultra high precision spacer particles. The thickness of the adhesive can be precisely controlled. Product
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3 Assembly Material Solder Anisotropic Conductive Paste Metal joining is possible at low temperature and low pressure. Low profile connection (less than 0. 1mm thickness), fine pitch connection (150um). Product
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UV Curing Adhesive/Assembly Material Anisotropic Conductive Paste For RFID low temperture/short time curing for chip assembly in RFID inlay production. Product
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4 Tape Conductive Tape
[7800 series]		 Adhesive tape with excellent conductivity, heat dissipation, adhesive strength, bending resistance, and thinness. Suitable for grounding/shielding/heat dissipation of electronic devices. Product
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5 Removable UV Tape High Heat Resistance, High Adhesion, Easy Removable UV Tape for Semiconductor Process
[SELFA HS]		 UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Protects device surfaces and suppresses warpage in various PKG manufacturing processes. Product
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Removable UV Tape Double-Sided Heat-Resistant, High-adhesion, Easy-Release UV Tape for Wafer Support Systems
[SELFA HW]		 UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Glass support system maintains device flatness during the process and ensures safe handling. Product
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Removable UV Tape Self-releasable Protective Tape in UBM Process
[SELFA-MP]		 UV release tape that combines strong chemical resistance and low residue; UV irradiation causes gas generation, which reduces device damage and allows easy peeling. Product
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6 Tape Photo mask protection film
[TACKWELL]		 Highly durable, chemical-resistant tape with excellent optical properties produced in a clean environment, suitable as protective tape for photomasks used in PCB production. Product
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7 Heat Release Related Products 1-Part Heat-Curable Grease
[Adhesive thermal conductive grease]		 High heat conduction, good molding properties. Excellent flexibility and applicable to flexible substrates. Product
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Heat Release Related Products 1-Part Silicone-free Thermal Conductive Grease
[GA Series]		 Grease Type, Silicone Free. Product
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Heat Release Related Products 2-Part Thermal Conductive Gap Filler
[CGW®Series]		 Room temperature curing type two-liquid silicone grease, solventless type, high thixotropy. Product
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Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT Insulation Series]		 Low siloxane silicone sheet type. Temperature durability, electrical insulation, high heat conductivity. Product
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Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT Soft Series]		 Super flexible sheet type. High followability to irregular surface, high cushioning. Product
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Heat Release Related Products Super Thermal-Conductive Pads
[MANION Series]		 A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Product
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Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT High Thermal Conductive Series]		 A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Available in v arious hardness and thickness. Product
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Heat Release Related Products Heat Release Electromagnetic Wave Absorbing Sheet
[Heat Release & EEM Wave Absorbing Sheet Pμ]		 Provides excellent electromagnetic wave absorption while maintaining the flexibility and thermal conductivity of the heat release sheet. Product
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8 Inkjet Materials Ink for Coating/Adhesive Applications
[High Resolution 3D Printer (Inkjet) Material]		 Printing size control ability in drop-on-demand. Product
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9 Film Interlayer Insulating Film for Making Build-up Boards
[Heat-curing Build Up Film NX/NQ]		 Low transmission loss, high insulation reliability. Product
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10 Polyvinyl Acetal Resin Binder Resin
[S-LEC B, K]		 Tough, high flexibility, high adhesiveness, crosslinkability, compatibility. Easy to dissolve in various solvents including alcohol. Product
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Polyvinyl Acetal Resin Paste Resin
[S-LEC SV]		 Excellent rheological properties, high adhesion, high sheet strength, high flexibility. Product
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11 UV Curing Adhesive/Assembly Material Anisotropic Conductive Paste For RFID low temperture/short time curing for chip assembly in RFID inlay production. Product
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12 Molded Product Electrical Connection, Holder Integrated Connector
[Microphone Holder Connector]		 Holder and connector are integrated. Easy assembly and solderless connection. Product
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Molded Product Rubber Connector for Electrical Connection and Grounding (Adhesive Fixing)
[Adhesive (PSA) Dot Connector]		 Rubber connector with integrated insulating and conductive parts. Easy mounting due to adhesiveness (PSA: Pressure-Sensitive-Adhesive). Product
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Molded Product Rubber Connector for Electrical Connection and Grounding (Solder Mounting)
[Board Mount (SMT) Dot Connector]		 Rubber connector with integrated insulating and conductive parts, mounted by reflow. Easy mounting due to adhesiveness (SMT: Surface-Mount-Technology). Product
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Molded Product Electrical Connection, Flexible Rubber Connector
[Waterproof and Resin Integrated]		 Rubber connector that can integrate the insulating part and the conductive part. Flexibility that allows flexible design (complex shape, protruding conductive parts). Product
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13 Sheet For transportation materials such as semiconductors, various electronic boards, precision parts, etc.
[POLYELEC® EFTLON®SK]		 Low-foamed polyethylene has excellent cushioning properties. Excellent ion cleanliness does not adversely affect metal such as lead frame. Thickness from 0.5mm to 4mm is available for a variety of electronic components. Product
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Sheet For conveying materials such as precision parts, connectors, and small electronic materials
[POLYELEC® Carrier Tape]		 Because of the plastic material, there is no fear of paper dust and dust generation. Light, with moderate rigidity and workability. Product
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Sheet Special embossed polypropylene sheets for printed circuit board transportation materials and protective agents
[POLYELEC® Circuit Board]		 Because of the plastic material, there is no fear of paper dust and dust generation. Light, with moderate rigidity and workability. Cleanable and repeatable. Product
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14 Container Clean bottle SEKISUI's clean containers are available from R&D usage to mass production usage. All products are made from the same clean raw materials, and the dissolution of components into the contents is minimized. We also offer a wide range of sizes from small (100mL) to large (200L), and can provide UN standard compliant products. Product
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