No. Brief Material Category Series/
Product
Feature
Reflow Curing Solder Anisotropic Conductive Paste for Replacing Connector and ACF Assembly Material SAP Can be assembled only by heating. Solder particles self-aggregate on electrodes and form metal bonds. Product Information
White Solder Resist for LED Substrate Resist Ink White Solder Resist White Solder Resist for LED Substrate。 High reflectivity, high heat resistance yellowing, high reliability. Product Information
Heat Release Related Series Heat Release Related Products Heat Release Related Series Heat Release Fin P-fin/N-fin, Heat Conductive Paste NT / NP, Thermal Release & Insulation Sheet KNDJ / SH / LM, Silicone-free Thermal Conductive Grease GA, Thermal Conductive Grease CGW, Silicone Thermal Conductive Sheet PT, FEATHER, High Heat Conductive Sheet PT, Silicone-free Thermal Conductive Sheet SF Product Information