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Material
Category		 Product Feature
1 Microsphere [Micropearl SP/GS]
Uniform resin particles		 Uniform particle size distribution, coefficient of variation (Cv) ≦ 7%, uniform gap control. Abundant particle size lineup from 2μm to 600μm. Product
Information
Microsphere [Micropearl AU]
Plastic core Metal coating Particles		 Available to coat evenly with diferent type of metals onto plastic particles. Our technology can control hardness of particles and repulsive force. Product
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Microsphere [Micropearl EX]
Particles with high size accuracy		 Uniform partical size distributions that are able to maintain tighter particle size control. Excellent voltage, heat and chemical resistance. Product
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Microsphere [Micropearl EXH]
Hard plastic material uniformed resin particles for gap control		 Compared to silica particles, this particles are stable with sizes reduction and damage to the substrate. High hardness prevent settlement in the resin caused by heat. Product
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Microsphere [Micropearl EZ]
Low recovery rate and soft resin particles for gap control		 It is an acrylic co-polymer particle that is very soft and it can absorb vibration and noise. Also it reduces the damage to the substrate. Due to the lower spring back (recovery rate) of the particle, it can be used for softer substrates. Product
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Microsphere [Micropearl KB]
black uniform resin Particles for gap control		 Divinylbenzene co-polymer particles with black pigment dispersed. Excellent blackness and light shielding properties, and resistance to exudative. Product
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2 UV Curing Adhesive Sealant for ODF
[Photolec S]		 UV + heat curing adhesive with high adhesive strength and low moisture permeability. Black type with high light shielding is also available. Product
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UV Curing Adhesive UV-curing adhesives
[Photolec A]		 A highly transparent and excellent UV curing adhesive even under oxygen environment. Few impurities, halogen-free. Product
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UV Curing Adhesive UV delayed curing Low moisture permeable adhesive
[Photolec E]		 After UV irradiation, post-curing type and immediate curing type are available. Low outgas, low moisture permeability. Product
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UV Curing Adhesive UV (B stage) + Moisture Curing Adhesive
[Photolec B]		 Easy workability (corresponding to curved surfaces and fine lines), curing light shielding parts, high adhesion of different materials, stress relaxation (flexibility after curing, thickness retention). Product
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3 Foam Tape Functional Foam Tape
[5200 Series]		 Combination of foam and adhesive with excellent stress relaxation. High impact resistance, high step followability (waterproof, dustproof), high adhesive reliability. Product
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4 Tape Conductive Tape
[7800 series]		 Adhesive tape with excellent conductivity, heat dissipation, adhesive strength, bending resistance, and thinness. Suitable for grounding/shielding/heat dissipation of electronic devices. Product
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5 Release Film Low Outgas Release Film Release film with low outgassing and excellent embedding property in high temperature heat press process at around 190℃. Suitable for manufacturing process of FPC, rigid flexible circuit board, etc. Product
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6 Foam Waterproof, Anti-vibration, Shock Absorbing Thin Foam
[XLIM]		 Ultra-thin, high-performance foam that combines high sealing properties and high shock absorption. Product
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7 Heat Release Related Products 1-Part Silicone-free Thermal Conductive Grease
[GA Series]		 Grease Type, Silicone Free. Product
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Heat Release Related Products 2-Part Thermal Conductive Gap Filler
[CGW®Series]		 Room temperature curing type two-liquid silicone grease, solventless type, high thixotropy. Product
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Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT Soft Series]		 Super flexible sheet type. High followability to irregular surface, high cushioning. Product
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Heat Release Related Products Super Thermal-Conductive Pads
[MANION Series]		 A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Product
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Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT High Thermal Conductive Series]		 A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Available in v arious hardness and thickness. Product
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8 Molded Product Thermocuring Rubber for Vibration and Shock Absorption
[G-Polstar]		 Wide hardness and damping variation is avaiable. Flame-retardant UL94. Product
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9 Molded Product Electrical Connection, Holder Integrated Connector
[Microphone Holder Connector]		 Holder and connector are integrated. Easy assembly and solderless connection. Product
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Molded Product Rubber Connector for Electrical Connection and Grounding (Adhesive Fixing)
[Adhesive (PSA) Dot Connector]		 Rubber connector with integrated insulating and conductive parts. Easy mounting due to adhesiveness (PSA: Pressure-Sensitive-Adhesive). Product
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Molded Product Rubber Connector for Electrical Connection and Grounding (Solder Mounting)
[Board Mount (SMT) Dot Connector]		 Rubber connector with integrated insulating and conductive parts, mounted by reflow. Easy mounting due to adhesiveness (SMT: Surface-Mount-Technology). Product
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Molded Product Electrical Connection, Flexible Rubber Connector
[Waterproof and Resin Integrated]		 Rubber connector that can integrate the insulating part and the conductive part. Flexibility that allows flexible design (complex shape, protruding conductive parts). Product
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10 Container Clean bottle SEKISUI's clean containers are available from R&D usage to mass production usage. All products are made from the same clean raw materials, and the dissolution of components into the contents is minimized. We also offer a wide range of sizes from small (100mL) to large (200L), and can provide UN standard compliant products. Product
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