Search by ApplicationsSmartphone・Tablet
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Microsphere product
[Micropearl Series]Microsphere product
- [Micropearl Series]
- Uniform particle size distribution, coefficient of variation (Cv) ≦ 7%, uniform gap control. Abundant particle size lineup from 2μm to 600μm.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Camera Module Exterior Products Battery
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Adhesive Products
[Photolec Series]Adhesive Products
- [Photolec Series]
- Sealant for ODF | UV-curing adhesives | UV delayed curing Low moisture permeable adhesive | UV (B stage) + Moisture Curing Adhesive | LED encapsulation material & UTG protective resin | GAP control adhesive containing uniform particles
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Camera Module Exterior Products Battery
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Functional Foam Tape
[5200 Series]Functional Foam Tape
- [5200 Series]
- Combination of foam and adhesive with excellent stress relaxation. High impact resistance, high step followability (waterproof, dustproof), high adhesive reliability.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Camera Module Exterior Products Battery
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Conductive Tape
[7800 series]Conductive Tape
- [7800 series]
- Adhesive tape with excellent conductivity, heat dissipation, adhesive strength, bending resistance, and thinness. Suitable for grounding/shielding/heat dissipation of electronic devices.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Camera Module Exterior Products Battery
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Low Outgas Release Film for Heat Press Process
【Low Outgas Release Film】Low Outgas Release Film for Heat Press Process
- [Low Outgas Release Film]
- Release film with low outgassing and excellent embedding property in high temperature heat press process at around 190℃. Suitable for manufacturing process of FPC, rigid flexible circuit board, etc.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Camera Module Exterior Products Battery
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Waterproof, Anti-vibration, Shock Absorbing Thin Foam [XLIM]
Waterproof, Anti-vibration, Shock Absorbing Thin Foam
- [XLIM]
- Ultra-thin, high-performance foam that combines high sealing properties and high shock absorption.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Camera Module Exterior Products Battery
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Heat Release Related Series
Heat Release Related Series
- Heat Release Related Products
- Silicone - Non silicone, Sheet / Pods / Paste / Grease, etc. unique line up for TIMs
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Camera Module Exterior Products Battery
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Thermocuring Rubber for Vibration and Shock Absorption [G-Polstar]
Thermocuring Rubber for Vibration and Shock Absorption
- [G-Polstar]
- Wide hardness and damping variation is avaiable. Flame-retardant UL94.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Camera Module Exterior Products Battery
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Compression Type Conductive Connector
[Dot Connector Series]Compression Type Conductive Connector
- [Dot Connector Series]
- Electrical Connection, Holder Integrated Connector | Rubber Connector for Electrical Connection and Grounding (Adhesive Fixing) | Rubber Connector for Electrical Connection and Grounding (Solder Mounting) | Electrical Connection, Flexible Rubber Connector
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Camera Module Exterior Products Battery
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Clean containers for semiconductor chemicals
Clean containers for semiconductor chemicals
- SEKISUI's clean containers are available from R&D usage to mass production usage. All products are made from the same clean raw materials, and the dissolution of components into the contents is minimized. We also offer a wide range of sizes from small (100mL) to large (200L), and can provide UN standard compliant products.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Camera Module Exterior Products Battery
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Semiconductor-
relatedSemiconductor-related
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Electronic
components・
SubstrateElectronic components・Substrate
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LCD・
Touch PanelLCD・Touch Panel
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OLED・
mini/μLEDOLED・mini/μLED
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Camera
ModuleCamera Module
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Exterior Products
Exterior Products
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Battery
Battery
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Semiconductor-
- Top Page
- Search by Applications
- Smartphone・Tablet
… Sustainability Products
Material Category |
Product | Feature | ||
---|---|---|---|---|
1 | Microsphere | [Micropearl SP/GS] Uniform resin particles |
Uniform particle size distribution, coefficient of variation (Cv) ≦ 7%, uniform gap control. Abundant particle size lineup from 2μm to 600μm. | Product Information |
Microsphere | [Micropearl AU] Plastic core Metal coating Particles |
Available to coat evenly with different type of metals onto plastic particles. Our technology can control hardness of particles and repulsive force. | Product Information |
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Microsphere | [Micropearl EX] Particles with high size accuracy |
Uniform partical size distributions that are able to maintain tighter particle size control. Excellent voltage, heat and chemical resistance. | Product Information |
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Microsphere | [Micropearl EXH] Hard plastic material uniformed resin particles for gap control |
Compared to silica particles, this particles are stable with sizes reduction and damage to the substrate. High hardness prevent settlement in the resin caused by heat. | Product Information |
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Microsphere | [Micropearl EZ] Low recovery rate and soft resin particles for gap control |
It is an acrylic co-polymer particle that is very soft and it can absorb vibration and noise. Also it reduces the damage to the substrate. Due to the lower spring back (recovery rate) of the particle, it can be used for softer substrates. | Product Information |
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Microsphere | [Micropearl KB] black uniform resin Particles for gap control |
Divinylbenzene co-polymer particles with black pigment dispersed. Excellent blackness and light shielding properties, and resistance to exudative. | Product Information |
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2 | UV Curing Adhesive | Sealant for ODF [Photolec S] |
UV + heat curing adhesive with high adhesive strength and low moisture permeability. Black type with high light shielding is also available. | Product Information |
UV Curing Adhesive | UV-curing adhesives [Photolec A] |
A highly transparent and excellent UV curing adhesive even under oxygen environment. Few impurities, halogen-free. | Product Information |
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UV Curing Adhesive | UV delayed curing Low moisture permeable adhesive [Photolec E] |
After UV irradiation, post-curing type and immediate curing type are available. Low outgas, low moisture permeability. | Product Information |
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UV Curing Adhesive | UV (B stage) + Moisture Curing Adhesive [Photolec B] |
Easy workability (corresponding to curved surfaces and fine lines), curing light shielding parts, high adhesion of different materials, stress relaxation (flexibility after curing, thickness retention). | Product Information |
|
3 | Foam Tape | Functional Foam Tape [5200 Series] |
Combination of foam and adhesive with excellent stress relaxation. High impact resistance, high step followability (waterproof, dustproof), high adhesive reliability. | Product Information |
4 | Tape | Conductive Tape [7800 series] |
Adhesive tape with excellent conductivity, heat dissipation, adhesive strength, bending resistance, and thinness. Suitable for grounding/shielding/heat dissipation of electronic devices. | Product Information |
5 | Release Film | Low Outgas Release Film | Release film with low outgassing and excellent embedding property in high temperature heat press process at around 190℃. Suitable for manufacturing process of FPC, rigid flexible circuit board, etc. | Product Information |
6 | Foam | Waterproof, Anti-vibration, Shock Absorbing Thin Foam [XLIM] |
Ultra-thin, high-performance foam that combines high sealing properties and high shock absorption. | Product Information |
7 | Heat Release Related Products | 1-Part Silicone-free Thermal Conductive Grease [GA Series] |
Grease Type, Silicone Free. | Product Information |
Heat Release Related Products | 2-Part Thermal Conductive Gap Filler [CGW®Series] |
Room temperature curing type two-liquid silicone grease, solventless type, high thixotropy. | Product Information |
|
Heat Release Related Products | Thermal-Conductive Pads [TIMLIGHT Soft Series] |
Super flexible sheet type. High followability to irregular surface, high cushioning. | Product Information |
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Heat Release Related Products | Super Thermal-Conductive Pads [MANION Series] |
A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. | Product Information |
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Heat Release Related Products | Thermal-Conductive Pads [TIMLIGHT High Thermal Conductive Series] |
A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Available in various hardness and thickness. | Product Information |
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8 | Molded Product | Thermocuring Rubber for Vibration and Shock Absorption [G-Polstar] |
Wide hardness and damping variation is avaiable. Flame-retardant UL94. | Product Information |
9 | Molded Product | Electrical Connection, Holder Integrated Connector [Microphone Holder Connector] |
Holder and connector are integrated. Easy assembly and solderless connection. | Product Information |
Molded Product | Rubber Connector for Electrical Connection and Grounding (Adhesive Fixing) [Adhesive (PSA) Dot Connector] |
Rubber connector with integrated insulating and conductive parts. Easy mounting due to adhesiveness (PSA: Pressure-Sensitive-Adhesive). | Product Information |
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Molded Product | Rubber Connector for Electrical Connection and Grounding (Solder Mounting) [Board Mount (SMT) Dot Connector] |
Rubber connector with integrated insulating and conductive parts, mounted by reflow. Easy mounting due to adhesiveness (SMT: Surface-Mount-Technology). | Product Information |
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Molded Product | Electrical Connection, Flexible Rubber Connector [Waterproof and Resin Integrated] |
Rubber connector that can integrate the insulating part and the conductive part. Flexibility that allows flexible design (complex shape, protruding conductive parts). | Product Information |
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10 | Container | Clean bottle | SEKISUI's clean containers are available from R&D usage to mass production usage. All products are made from the same clean raw materials, and the dissolution of components into the contents is minimized. We also offer a wide range of sizes from small (100mL) to large (200L), and can provide UN standard compliant products. | Product Information |