Search by Issue or NeedFor improved performanceHeat resistance
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- Search by Issue or Need
- For improved performance
- Heat resistance
We offer materials that have the thermal durability required to achieve the following:
- Device protection during thermal processes, such as reflow during the production of various packages
- Absence of discoloration in high-heat environments for long periods of time
- Improvement of curing efficiency by making effective use of heat
- Thermal management of areas with high heat generation by using thermal conductivity
… Sustainability Products
| Material Category |
Product | Feature | |
|---|---|---|---|
| Polyvinyl Acetal Resin | Binder Resin [S-LEC B, K] |
This product is a butyral resin, which excels in not only toughness but also flexibility. This resin is a binder (bonding agent) with great adhesion and dispersibility, and contributes to improved reliability and durability. | Product Information |
| UV Curing Adhesive | UV-curing adhesives [Photolec A] |
A photocuring, highly transparent adhesive with no oxygen inhibition. This adhesive has few impurities and is resistant to reflow. This product allows coloring, has an advantage in glass bonding, and is used for applications, such as fixing semiconductor parts and optical parts. | Product Information |
| Heat Release Related Products | 2-Part Thermal Conductive Gap Filler [CGW®Series] |
A two-component silicone-based thermal conductive grease that can cure at room temperature. This grease can be used in high-temperature environments because it hardens after assembly. Compared to non-hardening types, this product has the characteristics of high reliability and no pump-out occurrence. | Product Information |
| Heat Release Related Products | Super Thermal-Conductive Pads [MANION Series] |
An ultra-high thermal conductivity heat dissipation sheet that achieves high thermal conductivity as well as flexibility with magnetic-field orientation technology. This product has a high heat cycle property with an operating temperature range from -40 to 150°C. | Product Information |
| Removable UV Tape | UV Releasing Tape [SELFA™ Series] |
A removable UV tape for temporary fixing used in the manufacturing process of semiconductor packages. This tape can be removed without damage from gas generation and leaves no residues even after a heating process, maintaining excellent holding power, heat resistance, and chemical resistance. Easy peeling enables more efficient work processes. Our heat-resistant products have a long-duration heat resistance of 220°C and can withstand SAC solder reflow. | Product Information |
| Microsphere/UV Curing Adhesive | GAP control adhesive containing uniform particles | A heat-curing adhesive containing our product Micropearl, which has high precision and high heat resistance. This product makes adhesion layers uniform and provides protrusion control, contributing to stabilizing the performance of inductors and transformers. | Product Information |
