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Material
Category
Product Feature
Tape/Film Masking tape for semiconductor package substrates Tape with excellent adhesion, optical properties and easy peeling, produced in a clean environment. Suitable as a protective tape for solder resist on package substrates. Product
Information
Release Film Release Film for Heat Press Process
[Low Outgas Release Film]
Release film exhibiting excellent heat resistance, flexibility, and low-contamination properties. Suitable for surface protection and buffering in heat press processes for manufacturing FPCs, semiconductor molds, next-generation displays etc. Product
Information
Film Interlayer Insulating Film for Making Build-up Boards
[Heat-curing Build Up Film NX/NQ]
Low transmission loss, high insulation reliability. Product
Information
Film For 5G/6G
[Transparent & Flexible Radio Wave Reflection Film]
Innovative thin transparent and flexible film that can be attached to the any surface and can reflect radio waves in the 2GHz-sub6 - mm wave - 150GHz range. Product
Information