Transparent & Flexible Radio Wave Reflection Film(Under development)

2nd Demonstration Experiment of on Radio Wave Reflection Utilizing Local 5G Environment of Tokyo Metropolitan University

We measured how our radio wave reflection films of various shapes affected radio waves in the outdoor areas of Tokyo Metropolitan University's Minami-Osawa Campus, which has one of the largest local 5G environments in Japan.

Regardless of the film shape, the film improves the radio wave environment and eliminates the need for position adjustment for proper radio wave reflection when used on a flat plate as well as careful selection of installation location, enabling easy work.

For more details

Feb.1, 2024

【Photo】Award winners: Watanabe (Left), Okamura (Right)

An award ceremony for our developed product "Temporary Fixing Tape Heat-Resistant SELFA" was held.

The award ceremony for the "Temporary Fixing Tape Heat-Resistant SELFA," which won the Best Paper Award in 2022 at "IMPACT," Taiwan's largest international conference on semiconductor packaging and PCBs, took place during the following year's conference on October 24, 2023.

Paper Title :
A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity

Award-winning authors
Izumi Okamura, Ryoichi Watanabe, Toshio Takahashi, and four others.
(Members of the Research & Development Institute of the High Performance Plastics Company)

At the conference, which featured about 150 paper presentations and about 40 poster sessions, with participation from semiconductor-related companies and university faculties from all over the world, our company was the only recipient of the award from material manufacturers and Japanese companies. At the beginning of the conference, the vice-president of TSMC delivered a plenary lecture titled "Seamless Integration of Advanced Packaging Technology, Testing and Manufacturing," which highlighted the importance of borderless collaboration.

< About IMPACT >
International Microelectronics Packaging Assembly and Circuits Technology conference
International Microelectronics Packaging Assembly and Circuits Technology (IMPACT) conference.
The largest international semiconductor packaging and PCB conference in Taiwan, organized by TPCA.
Taiwan is the most important base for the world's top companies in the PCB and semiconductor industry, including semiconductor manufacturers, OSAT*, and substrate manufacturers. The conference brings together experts and researchers from companies, research institutes, and universities not only in Taiwan but also overseas.

※OSAT (Outsourced Semiconductor Assembly and Test)

Nov.17, 2023

We will exhibit at Advanced Packaging and Chiplet Summit

Tokyo Big Sight (East Exhibition Hall) Dec 13 to 15, 2023 (10:00 am–5:00 pm JST)

For top players in semiconductor packaging and PCB mounting
Join APCS to partake in advancing the semiconductor packaging technology and uncovering growth opportunities

1.Heat-curing resin for SAC solder connection<EPOXY FLUX (Under development) >
2.Transport container<Clean Container series>
3.Super Thermal-Conductive Pads<MANION Series>
4.High Adhesion-easy Removable UV Tape<SELFA series>
Sekisui Chemical Exhibit Area East Exhibition Hall 1333

Nov. 2, 2023

Transparent & Flexible Radio Wave Reflection Film(Under development)

Demonstration of radio wave reflection by using the local 5G system at Tokyo Metropolitan University (July/2023)

Confirmed improvement connectivity and eliminating blind spots by using radio wave reflection film at Tokyo Metropolitan University Minami-Osawa Campus outdoor area which has Japan's one of the largest local 5G system

For more details

Oct.15, 2023

Back number

Aug.28, 2023


Sep. 6 (Wed) – Sep. 8 (Fri), 2023

Aug.2, 2023

High-Speed Electronic Design For Wireless Tech Conference & Exhibition (EDW Tech) & China International Conference & Exhibition on Electromagnetic Compatibility (EMC 2023)

August 9 (Wed) - August 11 (Fri), 2023
Shanghai World Expo Exhibition & Convention Center (Shanghai, China)
Our Exhibition Booth : #Bldg. 3, 2nd floor 1147

May.26, 2023

Sekisui Chemical to exhibit at The 2023 IEEE 73rd Electronic Components and Technology conference(ECTC)

May 30 (Tue) - June 2 (Fri), 2023
JW Marriott Orlando, Grande Lakes
in Orlando Florida, USA

Dec. 26, 2022

Best Paper Award of IMPACT 2022 !!

At the largest international PCB and packaging conference in Taiwan, Best Paper Award was given for our newly developed SELFA series product for hybrid bonding process that enables many thermal processes to fabricate high performance semiconductor packages (Super High Thermal Resistance SELFA)

Author: Izumi Daido, Ryoichi Watanabe, Toshio Takahashi

Nov. 7, 2022

We will exhibit at Advanced Packaging and Chiplet Summit

Tokyo Big Sight (East Hall 1 to 3) Dec 14 to 16, 2022

Nov. 7, 2022

FILMTECH JAPAN –Highly-functional Film Expo-

Dec. 7(Wed.) – 9(Fri.), 2022 Venue: Makuhari Messe,Japan
Transparent & Flexible Radio Wave Reflection will be exhibited.

Oct 7, 2022

We will make a presentation at IMPACT2022

A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity

April 28, 2022

IEEE International Conference on Communications 2022
May 16-20, 2022 in Seoul, South Korea
Hybrid: In-Person and Virtual conference

“Transparent & Flexible Radio Wave Reflection Film”
Sekisui Chemical Co., Ltd. and North Carolina State University will jointly make a presentation.

June 1, 2021

We attended and gave a speech at ECTC(2021 IEEE 71st Electronic Components and Technology Conference)

①Title:Development of a Temporary Bonding Tape Having over 300 degC Thermal Resistance for Cu-Cu Direct Bonding
②Development of Highly Reliable Crack Resistive Build-up Dielectric Material with Low Df Characteristic for Next-Gen 2.5D Packages