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TIM technology of Sekisui Chemical will not lose in the "battle against thermal conductivity“
We made a presentation at the EMKxNEPCON KOREA conferenceheld from April 24th to April 26th.
A pre-interview video is available on YouTube of the Korean media, THE ELEC.
Presentation title :
[TIM technology for thermal management of high-performance SoC packages]
YouTube : https://youtu.be/T4inPqeHGPE?si=goJ0A8s_KZ5HJQxv
Note) Video language : Korean (please use YouTube automatic translation function)
Performer information : DoKyoon Kim / Semiconductor Materials Sales Office Product Marketing Manager
Jun.7, 2024
- Date
- May 28 (Tue) - May 31 (Fri), 2024
- Venue
- Gaylord Rockies Resort & Convention Center,（Denver, Colorado, USA）
Sekisui Chemical Exhibit Area ＃634
Exhibit Products :
- Build Up Film
- Temporary Bonding Film
- Thermal Interface Materials
- High-viscosity inkjet ink
- Sputtered Selfa
- Themal Build up Film
- Heat-curing resin for SAC solder connection Epoxy flux
- Clean Container
Program URL : https://bit.ly/4dIyeC6
May.20, 2024
【Photo】Award winners: Watanabe (Left), Okamura (Right)
An award ceremony for our developed product "Temporary Fixing Tape Heat-Resistant SELFA" was held.
The award ceremony for the "Temporary Fixing Tape Heat-Resistant SELFA," which won the Best Paper Award in 2022 at "IMPACT," Taiwan's largest international conference on semiconductor packaging and PCBs, took place during the following year's conference on October 24, 2023.
Paper Title :
A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity
- Award-winning authors
- Izumi Okamura, Ryoichi Watanabe, Toshio Takahashi, and four others.
(Members of the Research & Development Institute of the High Performance Plastics Company)
At the conference, which featured about 150 paper presentations and about 40 poster sessions, with participation from semiconductor-related companies and university faculties from all over the world, our company was the only recipient of the award from material manufacturers and Japanese companies. At the beginning of the conference, the vice-president of TSMC delivered a plenary lecture titled "Seamless Integration of Advanced Packaging Technology, Testing and Manufacturing," which highlighted the importance of borderless collaboration.
< About IMPACT >
International Microelectronics Packaging Assembly and Circuits Technology conference
International Microelectronics Packaging Assembly and Circuits Technology (IMPACT) conference.
The largest international semiconductor packaging and PCB conference in Taiwan, organized by TPCA.
Taiwan is the most important base for the world's top companies in the PCB and semiconductor industry, including semiconductor manufacturers, OSAT*, and substrate manufacturers. The conference brings together experts and researchers from companies, research institutes, and universities not only in Taiwan but also overseas.
https://www.impact.org.tw/site/page.aspx?sid=1283&lang=en&pid=901
※OSAT (Outsourced Semiconductor Assembly and Test)
Nov.17, 2023
Back number
Nov. 2, 2023
Tokyo Big Sight (East Exhibition Hall) Dec 13 to 15, 2023
Aug.28, 2023
- Duration
- Sep. 6 (Wed) – Sep. 8 (Fri), 2023
Aug.2, 2023
High-Speed Electronic Design For Wireless Tech Conference & Exhibition (EDW Tech) & China International Conference & Exhibition on Electromagnetic Compatibility (EMC 2023)
- Duration
- August 9 (Wed) - August 11 (Fri), 2023
- Venue
- Shanghai World Expo Exhibition & Convention Center (Shanghai, China)
Our Exhibition Booth : #Bldg. 3, 2nd floor 1147
May.26, 2023
- Date
- May 30 (Tue) - June 2 (Fri), 2023
- Venue
- JW Marriott Orlando, Grande Lakes
in Orlando Florida, USA
Dec. 26, 2022
Best Paper Award of IMPACT 2022 !!
At the largest international PCB and packaging conference in Taiwan, Best Paper Award was given for our newly developed SELFA series product for hybrid bonding process that enables many thermal processes to fabricate high performance semiconductor packages (Super High Thermal Resistance SELFA)
Author: Izumi Daido, Ryoichi Watanabe, Toshio Takahashi
Nov. 7, 2022
We will exhibit at Advanced Packaging and Chiplet Summit
Tokyo Big Sight (East Hall 1 to 3) Dec 14 to 16, 2022
Nov. 7, 2022
FILMTECH JAPAN –Highly-functional Film Expo-
Dec. 7(Wed.) – 9(Fri.), 2022 Venue: Makuhari Messe,Japan
Transparent & Flexible Radio Wave Reflection will be exhibited.
Oct 7, 2022
We will make a presentation at IMPACT2022
A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity
April 28, 2022
“Transparent & Flexible Radio Wave Reflection Film”
Sekisui Chemical Co., Ltd. and North Carolina State University will jointly make a presentation.
June 1, 2021
We attended and gave a speech at ECTC(2021 IEEE 71st Electronic Components and Technology Conference)
①Title:Development of a Temporary Bonding Tape Having over 300 degC Thermal Resistance for Cu-Cu Direct Bonding
②Development of Highly Reliable Crack Resistive Build-up Dielectric Material with Low Df Characteristic for Next-Gen 2.5D Packages