TOPICS List
- Top Page
- TOPICS List
We will exhibit at Advanced Packaging and Chiplet Summit
Tokyo Big Sight (East Exhibition Hall)
Dec 11 to 13, 2024 (10:00 am–5:00 pm JST)
For top players in semiconductor packaging and PCB mounting
Join APCS to partake in advancing the semiconductor packaging technology and uncovering growth opportunities
Exhibit Products：
- High Adhesion-easy Removable UV Tape SELFA™
- Clean Container series
- High-viscosity inkjet ink
- EPOXY FLUX (Under development)
- Adhesive (PSA) Dot Connector
Sekisui Chemical Exhibit Area East Exhibition Hall 3452
We provide advanced high-performance materials that help solve social issues.
Please stop by our booth.
Nov.12, 2024
Participation in International Conference 3DIC 2024 (Academic Presentation & Booth Exhibition)
(IEEE International 3D Systems Integration Conference 2024)
- Date
- September 25-27, 2024 (Wed-Fri)
- Venue
- September 25, 2024 at Hotel Metropolitan Sendai
September 26-27, 2024 at Sendai Kokusai Hotel
- Official Website
- https://3dic-conf.org/
Our Schedule
■ Session Presentation
- Title
- "A Temporary Bonding De-Bonding Tape with High Thermal Resistance, Easy Peeling and Excellent TTV for 3DIC"
- Presentation Date & Time
- September 26, 10:45 AM - 11:05 AM
※3DIC_Program_Schedule : For more details
- Exhibition Period
- September 26, 2024 - September 27, 2024
- Venue
- Sendai Kokusai Hotel
- Booth Number
- #12
Sep.2, 2024
TIM technology of Sekisui Chemical will not lose in the "battle against thermal conductivity“
We made a presentation at the EMKxNEPCON KOREA conferenceheld from April 24th to April 26th.
A pre-interview video is available on YouTube of the Korean media, THE ELEC.
Presentation title :
[TIM technology for thermal management of high-performance SoC packages]
YouTube : https://youtu.be/T4inPqeHGPE?si=goJ0A8s_KZ5HJQxv
Note) Video language : Korean (please use YouTube automatic translation function)
Performer information : DoKyoon Kim / Semiconductor Materials Sales Office Product Marketing Manager
Jun.7, 2024
Back number
May.20, 2024
- Date
- May 28 (Tue) - May 31 (Fri), 2024
Nov.17, 2023
An award ceremony for our developed product "Temporary Fixing Tape Heat-Resistant SELFA™" was held.
Paper Title :
A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity
- Award-winning authors
- Izumi Okamura, Ryoichi Watanabe, Toshio Takahashi, and four others.
(Members of the Research & Development Institute of the High Performance Plastics Company)
Nov. 2, 2023
Tokyo Big Sight (East Exhibition Hall) Dec 13 to 15, 2023
Aug.28, 2023
- Duration
- Sep. 6 (Wed) – Sep. 8 (Fri), 2023
Aug.2, 2023
High-Speed Electronic Design For Wireless Tech Conference & Exhibition (EDW Tech) & China International Conference & Exhibition on Electromagnetic Compatibility (EMC 2023)
- Duration
- August 9 (Wed) - August 11 (Fri), 2023
- Venue
- Shanghai World Expo Exhibition & Convention Center (Shanghai, China)
Our Exhibition Booth : #Bldg. 3, 2nd floor 1147
May.26, 2023
- Date
- May 30 (Tue) - June 2 (Fri), 2023
- Venue
- JW Marriott Orlando, Grande Lakes
in Orlando Florida, USA
Dec. 26, 2022
Best Paper Award of IMPACT 2022 !!
At the largest international PCB and packaging conference in Taiwan, Best Paper Award was given for our newly developed SELFA™ series product for hybrid bonding process that enables many thermal processes to fabricate high performance semiconductor packages (Super High Thermal Resistance SELFA™)
Author: Izumi Daido, Ryoichi Watanabe, Toshio Takahashi
Nov. 7, 2022
We will exhibit at Advanced Packaging and Chiplet Summit
Tokyo Big Sight (East Hall 1 to 3) Dec 14 to 16, 2022
Nov. 7, 2022
FILMTECH JAPAN –Highly-functional Film Expo-
Dec. 7(Wed.) – 9(Fri.), 2022 Venue: Makuhari Messe,Japan
Transparent & Flexible Radio Wave Reflection will be exhibited.
Oct 7, 2022
We will make a presentation at IMPACT2022
A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity
April 28, 2022
“Transparent & Flexible Radio Wave Reflection Film”
Sekisui Chemical Co., Ltd. and North Carolina State University will jointly make a presentation.
June 1, 2021
We attended and gave a speech at ECTC(2021 IEEE 71st Electronic Components and Technology Conference)
①Title:Development of a Temporary Bonding Tape Having over 300 degC Thermal Resistance for Cu-Cu Direct Bonding
②Development of Highly Reliable Crack Resistive Build-up Dielectric Material with Low Df Characteristic for Next-Gen 2.5D Packages