TOPICS일람

[열과의 전쟁]에 지지않는 세키스이화학의 TIM기술

4월24일 ~ 4월26일에 개최된 EMKxNEPCON KOREA컨퍼런스에서 발표를 했습니다.
기획자는 한국미디어인 THE ELEC의 유튜브에 사전인터뷰 영상이 공개되었습니다.

발표타이틀 : 【고성능SoC패키지의 열관리를 위한 TIM기술】

YouTube : https://youtu.be/T4inPqeHGPE?si=goJ0A8s_KZ5HJQxv

주) 동영상 언어 : 한국어(유튜브의 자동번역기능을 이용해주십시오.)

출연자정보 : DoKyoon Kim / 전자재료전략실 반도체재료영업소 Product Marketing Manager

Jun.7, 2024

Sekisui Chemical to exhibit at The 2024 IEEE 74th Electronic Components and Technology Conference(ECTC)

Sekisui Chemical to exhibit at The 2024 IEEE 74th Electronic Components and Technology Conference(ECTC)

Date
May 28 (Tue) - May 31 (Fri), 2024
Venue
Gaylord Rockies Resort & Convention Center,(Denver, Colorado, USA)
Sekisui Chemical Exhibit Area #634

Exhibit Products :

Program URL : https://bit.ly/4dIyeC6

May.20, 2024

투명 플렉서블 전파 반사 필름(개발품)

도쿄 도립대학의 로컬 5G 환경을 활용한 전파 반사 실증 실험 
제2탄

일본 최대급 규모의 로컬 5G를 정비한 도쿄 도립대학의 미나미 오사와 캠퍼스 옥외 구역에서 반사 필름의 형상을 변화시킨 전파 환경 변화의 측정을 실시했습니다.

형상 변화에 의한 전파 환경 개선 효과에 더해, 평판에서 필요한 정반사의 섬세한 위치 조정이 불필요 하게되어, 설치 장소를 가리지 않고, 쉬운 작업성을 기대할 수 있습니다.

상세는 이쪽으로

Feb.1, 2024

【Photo】Award winners: Watanabe (Left), Okamura (Right)

An award ceremony for our developed product "Temporary Fixing Tape Heat-Resistant SELFA" was held.

The award ceremony for the "Temporary Fixing Tape Heat-Resistant SELFA," which won the Best Paper Award in 2022 at "IMPACT," Taiwan's largest international conference on semiconductor packaging and PCBs, took place during the following year's conference on October 24, 2023.

Paper Title :
A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity

Award-winning authors
Izumi Okamura, Ryoichi Watanabe, Toshio Takahashi, and four others.
(Members of the Research & Development Institute of the High Performance Plastics Company)

At the conference, which featured about 150 paper presentations and about 40 poster sessions, with participation from semiconductor-related companies and university faculties from all over the world, our company was the only recipient of the award from material manufacturers and Japanese companies. At the beginning of the conference, the vice-president of TSMC delivered a plenary lecture titled "Seamless Integration of Advanced Packaging Technology, Testing and Manufacturing," which highlighted the importance of borderless collaboration.

< About IMPACT >
International Microelectronics Packaging Assembly and Circuits Technology conference
International Microelectronics Packaging Assembly and Circuits Technology (IMPACT) conference.
The largest international semiconductor packaging and PCB conference in Taiwan, organized by TPCA.
Taiwan is the most important base for the world's top companies in the PCB and semiconductor industry, including semiconductor manufacturers, OSAT*, and substrate manufacturers. The conference brings together experts and researchers from companies, research institutes, and universities not only in Taiwan but also overseas.
https://www.impact.org.tw/site/page.aspx?sid=1283&lang=en&pid=901

※OSAT (Outsourced Semiconductor Assembly and Test)

Nov.17, 2023

Back number

Nov. 2, 2023

SEMICON JAPAN

Tokyo Big Sight (East Exhibition Hall) Dec 13 to 15, 2023

Aug.28, 2023

SEMICON TAIWAN 2023

Date
Sep. 6 (Wed) – Sep. 8 (Fri), 2023

May.26, 2023

Sekisui Chemical to exhibit at The 2023 IEEE 73rd Electronic Components and Technology conference (ECTC)

Date
May 30 (Tue) - June 2 (Fri), 2023
Venue
JW Marriott Orlando, Grande Lakes in Orlando Florida, USA