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[열과의 전쟁]에 지지않는 세키스이화학의 TIM기술
4월24일 ~ 4월26일에 개최된 EMKｘNEPCON KOREA컨퍼런스에서 발표를 했습니다.
기획자는 한국미디어인 THE ELEC의 유튜브에 사전인터뷰 영상이 공개되었습니다.
발표타이틀 : 【고성능SoC패키지의 열관리를 위한 TIM기술】
YouTube : https://youtu.be/T4inPqeHGPE?si=goJ0A8s_KZ5HJQxv
주) 동영상 언어 : 한국어(유튜브의 자동번역기능을 이용해주십시오.)
출연자정보 : DoKyoon Kim / 전자재료전략실 반도체재료영업소 Product Marketing Manager
Jun.7, 2024
- Date
- May 28 (Tue) - May 31 (Fri), 2024
- Venue
- Gaylord Rockies Resort & Convention Center,（Denver, Colorado, USA）
Sekisui Chemical Exhibit Area ＃634
Exhibit Products :
- Build Up Film
- Temporary Bonding Film
- Thermal Interface Materials
- High-viscosity inkjet ink
- Sputtered Selfa
- Themal Build up Film
- Heat-curing resin for SAC solder connection Epoxy flux
- Clean Container
Program URL : https://bit.ly/4dIyeC6
May.20, 2024
【Photo】Award winners: Watanabe (Left), Okamura (Right)
An award ceremony for our developed product "Temporary Fixing Tape Heat-Resistant SELFA" was held.
The award ceremony for the "Temporary Fixing Tape Heat-Resistant SELFA," which won the Best Paper Award in 2022 at "IMPACT," Taiwan's largest international conference on semiconductor packaging and PCBs, took place during the following year's conference on October 24, 2023.
Paper Title :
A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity
- Award-winning authors
- Izumi Okamura, Ryoichi Watanabe, Toshio Takahashi, and four others.
(Members of the Research & Development Institute of the High Performance Plastics Company)
At the conference, which featured about 150 paper presentations and about 40 poster sessions, with participation from semiconductor-related companies and university faculties from all over the world, our company was the only recipient of the award from material manufacturers and Japanese companies. At the beginning of the conference, the vice-president of TSMC delivered a plenary lecture titled "Seamless Integration of Advanced Packaging Technology, Testing and Manufacturing," which highlighted the importance of borderless collaboration.
< About IMPACT >
International Microelectronics Packaging Assembly and Circuits Technology conference
International Microelectronics Packaging Assembly and Circuits Technology (IMPACT) conference.
The largest international semiconductor packaging and PCB conference in Taiwan, organized by TPCA.
Taiwan is the most important base for the world's top companies in the PCB and semiconductor industry, including semiconductor manufacturers, OSAT*, and substrate manufacturers. The conference brings together experts and researchers from companies, research institutes, and universities not only in Taiwan but also overseas.
https://www.impact.org.tw/site/page.aspx?sid=1283&lang=en&pid=901
※OSAT (Outsourced Semiconductor Assembly and Test)
Nov.17, 2023
Back number
Nov. 2, 2023
Tokyo Big Sight (East Exhibition Hall) Dec 13 to 15, 2023
Aug.28, 2023
- Date
- Sep. 6 (Wed) – Sep. 8 (Fri), 2023
May.26, 2023
- Date
- May 30 (Tue) - June 2 (Fri), 2023
- Venue
- JW Marriott Orlando, Grande Lakes in Orlando Florida, USA