Chip Fabrication

We are providing some indispensable wafer/chip manufacture material for achieving new process innovation and higher reliable device, for example, 3D TSV assembly and Fan-Out packaging.

Introducint the materila for Wafer/Chip level manufacutre.

Double-faced Tape for Fixing Polishing Pads for LCD Glass Substrate, CMP, and HDD Substrate

Double side adhesive tape optimized for polishing pads used in "planarization" processes such as CMP and wafer lapping in semiconductor manufacturing processes.

SELFA

SELFA is a easy removable UV tape with the function of gas generation. Single side type HS with great heat resistance, double side type HW used in temporary bonding, type MP with great chemical resistance can make impossible process in the past become possible.

Wafer/Chip Manufacture Process Related Material List

Material Category	Product	Feature
Microsphere	[Micropearl EZ] Low recovery rate and soft resin particles for gap control	It is an acrylic co-polymer particle that is very soft and it can absorb vibration and noise. Also it reduces the damage to the substrate. Due to the lower spring back (recovery rate) of the particle, it can be used for softer substrates.	Product Information
Removable UV Tape	High Heat Resistance, High Adhesion, Easy Removable UV Tape for Semiconductor Process [SELFA HS]	UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Protects device surfaces and suppresses warpage in various PKG manufacturing processes.	Product Information
Removable UV Tape	Double-Sided Heat-Resistant, High-adhesion, Easy-Release UV Tape for Wafer Support Systems [SELFA HW]	UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Glass support system maintains device flatness during the process and ensures safe handling.	Product Information
Removable UV Tape	Self-releasable Protective Tape in UBM Process [SELFA-MP]	UV release tape that combines strong chemical resistance and low residue; UV irradiation causes gas generation, which reduces device damage and allows easy peeling.	Product Information
Tape	Double-faced Tape for Fixing Polishing Pads for LCD Glass Substrate, CMP, and HDD Substrate	Highly chemical-resistant tape with no adhesive residue when peeled off. Used for fixing polishing pad in the polishing process for electronic devices. Max. width 2450mm, suitable for CMP process.	Product Information