Printed Circuit Manufacture Process Related Material
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- Printed Circuit Manufacture Process Related Material
The introduction of Sekisui's printed circuit manufacture material realized by our histroical and excellent adhesive coating technology and extrusion(membrane) technology.
The stable manufacture material can
make the printed circuit manufacture better.
The release film for flexible printed circuit(FPC) has a great dimensional stability under high temperture. Furthermore, the outgas during heat compression is very little, and the excellent followability to patterns can control the resin flow which always causes conductivity failure. Both this two features contribute a lot to a higher yield ratio.
The photomask protection film for PCB manufacture process is famous with its accurate thickness from ultra-thin coating technology, as well as the high transparency of the special adhesive. The adhesion after lamination is properly modified, which makes re-lamination much easier. Furthermore, the release material coating(hard to stick with solder resist material) has been done on the surface of film, which can minimize the exchange time of protection film.
Flexible Printed Circuits
Release Film Setting
Release Film for FPC Manufacutre
Heat Press
Outline Shaping
Printed Circuit
Board
Laminate
Photomask Protection Film for PCB Manufacture
Exposure
Development
Etching
Printed Circuit Manufacture Process Related Material List
| Material Category |
Product | Feature | |
|---|---|---|---|
| Release Film | Low Outgas Release Film | Release film with low outgassing and excellent embedding property in high temperature heat press process at around 190℃. Suitable for manufacturing process of FPC, rigid flexible circuit board, etc. | Product Information |
| Tape | Photo mask protection film [TACKWELL] |
Highly durable, chemical-resistant tape with excellent optical properties produced in a clean environment, suitable as protective tape for photomasks used in PCB production. | Product Information |
| Heat Release Related Products | 1-Part Heat-Curable Grease [Adhesive thermal conductive grease] |
High heat conduction, good molding properties. Excellent flexibility and applicable to flexible substrates. | Product Information |