Search by Issue or NeedFor improved performanceDurability
We offer materials capable of realizing durability in next-generation technologies, including
- Protective materials that improve the final physical properties of cutting-edge foldable smartphones
- PVB capable of simultaneously achieving the three binder properties: toughness, adhesion, and dispersibility
- Low-Df and Low-Dk interlayer insulation materials adaptable to the evolution of semiconductor package substrates
- Heat dissipation materials that improve the durability of final products by achieving flexibility as well as adhesion
- Protective materials that improve the surface condition of solder resist (SR)
… Sustainability Products
| Material Category |
Product | Feature | |
|---|---|---|---|
| Polyvinyl Acetal Resin | Binder Resin [S-LEC B, K] |
This product is a butyral resin, which excels in not only toughness but also flexibility. This resin is a binder (bonding agent) with great adhesion and dispersibility, and its applications contribute to improved reliability and durability. | Product Information |
| UV Curing Adhesive | LED encapsulation material & UTG protective resin [Photolec New] |
A UV-curing coating material intended to prevent the shattering of ultra-thin cover glass (UTG) used for foldable smartphones and the scattering of glass shards. This material features high transparency, high durability, and impact resistance, and can make contributions in the application to next-generation display materials. | Product Information |
| UV Curing Adhesive | UV-curing adhesives [Photolec A] |
A UV fast-curing adhesive that maintains high transparency as well as long-term reliability and has excellent heat resistance. This adhesive cures quickly even in an oxygen environment with a proven track record of reflow resistance and a high curing rate, and can accommodate various needs due to its product lineup with a wide range of viscosities and colors. | Product Information |
| UV Curing Adhesive | UV delayed curing Low moisture permeable adhesive [Photolec E] |
A delayed UV-curing epoxy adhesive that is used for encapsulating OLED panels and fixing small parts, such as camera modules. This product improves product reliability with its excellent low-moisture permeability. | Product Information |
| Tape/Film | Masking tape for semiconductor package substrates | This product is used as a tape to protect solder resist during the multilayer board manufacturing process, mainly for FC-BGA boards. With its excellent masking properties, this tape prevents foreign matter contamination and oxygen inhibition of solder resist, and also contributes to increasing the adhesion strength of the underfill due to the fine rough surface formed after peeling. | Product Information |
| Film | Interlayer Insulating Film for Making Build-up Boards [Heat-curing Build Up Film NX/NQ] |
An insulating material that exhibits in thermal cycle tests high reliability and stable transmission performance under high-temperature and high-humidity conditions. | Product Information |
| Molded Product | Compression Type Conductive Connector [Dot Connector Series] |
A rubber connector that allows the connection of electronic components through the assembly process alone. Due to its impact resistance, this connector does not deform by shock during assembly and has excellent durability because the product is repairable. The connector can be made waterproof depending on the shape. | Product Information |
| Heat Release Related Products | 2-Part Thermal Conductive Gap Filler [CGW®Series] |
A two-component silicone-based thermal conductive grease that can cure at room temperature, which is a solvent-free, two-component product with excellent stability. This product is used in in-vehicle control parts and batteries due to its high durability. | Product Information |
| Heat Release Related Products | Super Thermal-Conductive Pads [MANION Series] |
A heat dissipation sheet capable of cooling parts that generate high heat (such as CPUs and GPUs), achieving high thermal conductivity and flexibility with magnetic-field orientation technology. | Product Information |
