Search by Issue or NeedFor improved processesLow contamination
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- Search by Issue or Need
- For improved processes
- Low contamination
We have products that enable you to solve such problems as the following:
- Increase in defect rates due to the effect of outgas generated during the heating process
- Particles entering during the semiconductor manufacturing process
- Organic contamination during the panel manufacturing process
- Maintaining quality during the storage of high-purity chemical solutions
- Foreign matter, adhesive residues, etc. during the manufacture of FPCs and PCBs
… Sustainability Products
| Material Category |
Product | Feature | |
|---|---|---|---|
| Release Film | Low Outgas Release Film | A release film that produces fewer outgas components during the heat press process. This film is mainly used for surface protection during pressure bonding of printed circuit board materials. The product adheres well to the substrate during pressing, and is pressure-bonded evenly and without wrinkles. In addition, the film can be removed cleanly. | Product Information |
| Container | Clean bottle | A clean bottle made from resin raw materials that have extremely low metal ion elution. The bottle is manufactured in a clean, particle-controlled environment and contributes to the stable quality of final products. The product has been used for transporting various types of high-purity chemical solutions in semiconductor and other fields. | Product Information |
| Tape/Film | Masking tape for semiconductor package substrates | This product is used as a tape to protect solder resist during the multilayer board manufacturing process, mainly for FC-BGA boards. With its excellent masking properties, the tape prevents foreign matter contamination and oxygen inhibition of solder resist, and also contributes to flattening the resist surface and improving underfill wettability (improving manufacturing efficiency). | Product Information |
| Tape | Photo mask protection film [TACKWELL] |
A protective tape that prevents photomasks from being scratched during storage and transportation or during contact exposure. The tape has excellent optical properties and is ideal for the process of forming PCB outer layer circuits. Highly durable release treatment prevents contamination from solvents contained in the resist. | Product Information |
| UV Curing Adhesive | UV delayed curing Low moisture permeable adhesive [Photolec E] |
A UV+heat curing adhesive that can cure at low temperatures and does not contaminate the adherend due to its low outgas generation. This adhesive is used for materials, such as moisture-proof encapsulation materials for organic EL displays and encapsulation materials for semiconductors (MEMS and CCD). | Product Information |
