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- Search by Issue or Need
- For improved processes
- Shorter processes
We have products capable of responding to your needs such as in the following situations:
- You want a material that has high adhesive strength and can cure even at low temperatures
- You want to increase production efficiency by shortening the curing time of a bonding process
- You want to peel products without damaging the wafers or resin substrates and leaving no adhesive residues
- You want to simplify the existing processes
… Sustainability Products
Material Category |
Product | Feature | |
---|---|---|---|
UV Curing Adhesive | UV-curing adhesives [Photolec A] |
An instant UV-curing adhesive that does not require a heat-curing process. This product has high drawability and contributes to shortening manufacturing takt time. The black type also excels in deep curing and hardens with UV and heat, providing excellent durability and chemical resistance. | Product Information |
UV Curing Adhesive | UV (B stage) + Moisture Curing Adhesive [Photolec B] |
A two-step (UV and moisture) curing hybrid adhesive that does not require a heat-curing process. The adhesive enables temporary fixing of supplies with tape-like adhesive strength after UV curing and eliminates a pressure-holding process, resulting in improved productivity and automation. In addition, the product is capable of curing on opaque substrates. | Product Information |
UV Curing Adhesive | UV delayed curing Low moisture permeable adhesive [Photolec E] |
A delayed UV-curing adhesive that can cure at low temperatures with a high degree of flexibility in terms of the time between UV irradiation and heat curing. Having low moisture permeability and outgas, the product has many applications, including the adhesion of light-shielding parts and plastic substrates, and the encapsulation of heat-sensitive elements. | Product Information |
UV Curing Adhesive/Assembly Material | Anisotropic Conductive Paste For RFID | A low-temperature, fast-curing anisotropic conductive paste (ACP) for RFID inlays that connects IC chips and antennas. By taking advantage of its rapid curing property, production efficiency can be expected to more than double. The paste can be applied with various printing methods, such as jet dispensing. | Product Information |
Tape | Double-sided tape for fluorine-containing resins adhesion(Developments) | A double-sided tape that can bond with strong adhesion PTFE resin and other fluororesins, which do not easily adhere. This product does not require any special work, such as the treatment of a primer used as a base material during bonding, and can stick to a wide range of adherends that do not easily adhere. | Product Information |
Removable UV Tape | UV Releasing Tape [SELFA™ Series] |
A removable UV tape for temporary fixing used in the downstream processes of semiconductors. This tape can be removed without damage from gas generation and leaves no residues even after a heating process, maintaining excellent holding power, heat resistance, and chemical resistance. Easy peeling makes work processes more efficient. | Product Information |
Inkjet Materials | Pattern formation of exterior peripheries/Usage for package miniaturization [High-viscosity inkjet ink] |
This ink enables highly accurate on-demand forming of 3D structures without exposure to light and image development. Benefits expected from this product are simplified processes as well as cost reduction, increased productivity, and reduced environmental impact by using fewer materials. We can offer multiple suggestions regarding materials, including partition wall materials, adhesives, and ink types. | Product Information |
Molded Product | Compression Type Conductive Connector [Dot Connector Series] |
An anisotropic conductive rubber connector that allows the connection of electronic components by an assembly process alone. This connector does not require soldering, which can eliminate the reflow process, and can simplify processes by reducing the number of parts through miniaturization, which results in fewer assembly man-hours. | Product Information |