No. Brief Material Category Series/
Product
Feature
Reflow Curing Solder Anisotropic Conductive Paste for Replacing Connector and ACF Assembly Material SAP Can be assembled only by heating. Solder particles self-aggregate on electrodes and form metal bonds. Product Information
②③ Ink for Coating / Adhesive Applications Inkjet Materials High Resolution 3D Printer (Inkjet) Material Printing size control ability in drop-on-demand. Product Information
UV (B Stage) + Moisture Curing Adhesive for Replacing Tape UV Curing Adhesive Photolec B Easy workability (corresponding to curved surfaces and fine lines), curing light shielding parts, high adhesion of different materials, stress relaxation (flexibility after curing, thickness retention). Product Information
Sealing Material with Waterproof and Moisture-proof Waterproof / Moisture Proof / Vibration Proof UV Curable Moisture Proof Sealant ACG High flexibility, high elasticity, easy peeling. Product Information
Waterproof and Moisture-proof Sealing Applications Waterproof / Moisture Proof / Vibration Proof Waterproof GEL PantelGEL Low-hardness, high-strength silicone GEL material with excellent waterproof, dustproof and cushioning properties. Insert molding with regular resin, metal, and film is possible. Product Information
Rubber Connector for Electrical Connection and Grounding (Adhesive Fixing) Rubber Connector Adhesive (PSA) Dot Connector Rubber connector with integrated insulating and conductive parts. Easy mounting due to adhesiveness (PSA: Pressure-Sensitive-Adhesive). Product Information
Rubber Connector for Electrical Connection and Grounding (Solder Mounting) Rubber Connector Board Mount (SMT) Dot Connector Rubber connector with integrated insulating and conductive parts, mounted by reflow. Easy mounting due to adhesiveness (SMT: Surface-Mount-Technology). Product Information
Waterproof, Anti-vibration, Shock Absorbing Thin Foam Foam XLIM Ultra-thin, high-performance foam that combines high sealing properties and high shock absorption. Product Information
⑨⑩ Low Moisture-permeable Adhesive for OLED Sealing UV Curing Adhesive Photolec E Post-UV Delayed Cured Property, which is available for the lamination of untransparent componennts and UV-Sensitive components. Low moisture permeability and low outgas. Product Information