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Material
Category		 Product Feature
1 Microsphere・Filler Plastic-based Micropearl™ Plastic particles with uniform particle size distribution. High-performance filler combines properties such as stability, flexibility, and resilience. Can be used as in-plane spacers, stress relaxation materials, and unevenness-forming materials. Product
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Microsphere・Filler Metal-plated Micropearl™ By adding different metal coatings to plastic particles that are the same size, they can work as strong conductive fillers. Our unique manufacturing technology also allows for hardness control. They also act as unique, high-performance lightweight fillers. They have low specific gravity, high dispersion, low resistance, and high flexibility. Product
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2 UV Curing Adhesive Sealant for ODF
[Photolec™ S]		 UV + heat curing adhesive with high adhesive strength and low moisture permeability. Black type with high light shielding is also available. Product
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UV Curing Adhesive UV-curing adhesives
[Photolec™ A]		 A highly transparent and excellent UV curing adhesive even under oxygen environment. Few impurities, halogen-free. Product
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UV Curing Adhesive UV delayed curing Low moisture permeable adhesive
[Photolec™ E]		 After UV irradiation, post-curing type and immediate curing type are available. Low outgas, low moisture permeability. Product
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UV Curing Adhesive UV (B stage) + Moisture Curing Adhesive
[Photolec™ B]		 Easy workability (corresponding to curved surfaces and fine lines), curing light shielding parts, high adhesion of different materials, stress relaxation (flexibility after curing, thickness retention). Product
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3 Inkjet Materials Pattern formation of exterior peripheries/Usage for package miniaturization
[High-viscosity inkjet ink]		 Proprietary high-functionality materials, designed uniquely from adhesives to barrier rid forming materials. Freely controllable ink application shapes. Optimizing printing processes with our one-stop development. Product
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4 Heat Release Related Products 1-Part Silicone-free Thermal Conductive Grease
[GA Series]		 Grease Type, Silicone Free. Product
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Heat Release Related Products 2-Part Thermal Conductive Gap Filler
[CGW™Series]		 Room temperature curing type two-liquid silicone grease, solventless type, high thixotropy. Product
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Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT™ Series]		 Low siloxane silicone sheet type. Temperature durability, electrical insulation, high heat conductivity. Product
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Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT™ Soft Series]		 Super flexible sheet type. High followability to irregular surface, high cushioning. Product
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Heat Release Related Products Super Thermal-Conductive Pads
[MANION™ Series]		 A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Product
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5 Molded Product Waterproof and Moisture-proof Sealing Applications
[PantelGEL]		 Low-hardness, high-strength silicone GEL material with excellent waterproof, dustproof and cushioning properties. Insert molding with regular resin, metal, and film is possible. Product
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