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Material
Category		 Product Feature
1 Microsphere [Micropearl SP/GS]
Uniform resin particles		 Uniform particle size distribution, coefficient of variation (Cv) ≦ 7%, uniform gap control. Abundant particle size lineup from 2μm to 600μm. Product
Information
Microsphere [Micropearl AU]
Plastic core Metal coating Particles		 Available to coat evenly with diferent type of metals onto plastic particles. Our technology can control hardness of particles and repulsive force. Product
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Microsphere [Micropearl EX]
Particles with high size accuracy		 Uniform partical size distributions that are able to maintain tighter particle size control. Excellent voltage, heat and chemical resistance. Product
Information
Microsphere [Micropearl EZ]
Low recovery rate and soft resin particles for gap control		 It is an acrylic co-polymer particle that is very soft and it can absorb vibration and noise. Also it reduces the damage to the substrate. Due to the lower spring back (recovery rate) of the particle, it can be used for softer substrates. Product
Information
Microsphere [Micropearl SLC]
(under development): Silicone type particles		 Silicon polymer based particle. It absorbs vibrations and noise. Lower spring back (recovery rate) of the particles, it can be used for softer substrates. Product
Information
2 UV Curing Adhesive Sealant for ODF
[Photolec S]		 UV + heat curing adhesive with high adhesive strength and low moisture permeability. Black type with high light shielding is also available. Product
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UV Curing Adhesive UV-curing adhesives
[Photolec A]		 A highly transparent and excellent UV curing adhesive even under oxygen environment. Few impurities, halogen-free. Product
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UV Curing Adhesive UV delayed curing Low moisture permeable adhesive
[Photolec E]		 After UV irradiation, post-curing type and immediate curing type are available. Low outgas, low moisture permeability. Product
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UV Curing Adhesive UV (B stage) + Moisture Curing Adhesive
[Photolec B]		 Easy workability (corresponding to curved surfaces and fine lines), curing light shielding parts, high adhesion of different materials, stress relaxation (flexibility after curing, thickness retention). Product
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3 Inkjet Materials Pattern formation of exterior peripheries/Usage for package miniaturization
[High-viscosity inkjet ink]		 Proprietary high-functionality materials, designed uniquely from adhesives to barrier rid forming materials. Freely controllable ink application shapes. Optimizing printing processes with our one-stop development. Product
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4 Heat Release Related Products 1-Part Silicone-free Thermal Conductive Grease
[GA Series]		 Grease Type, Silicone Free. Product
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Heat Release Related Products 2-Part Thermal Conductive Gap Filler
[CGW®Series]		 Room temperature curing type two-liquid silicone grease, solventless type, high thixotropy. Product
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Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT Insulation Series]		 Low siloxane silicone sheet type. Temperature durability, electrical insulation, high heat conductivity. Product
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Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT Soft Series]		 Super flexible sheet type. High followability to irregular surface, high cushioning. Product
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Heat Release Related Products Super Thermal-Conductive Pads
[MANION Series]		 A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Product
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Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT High Thermal Conductive Series]		 A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Available in various hardness and thickness. Product
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5 Molded Product Waterproof and Moisture-proof Sealing Applications
[PantelGEL]		 Low-hardness, high-strength silicone GEL material with excellent waterproof, dustproof and cushioning properties. Insert molding with regular resin, metal, and film is possible. Product
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