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Material
Category		 Product Feature
1 Microsphere [Micropearl™ SP/GS]
Uniform resin particles		 Uniform particle size distribution, coefficient of variation (Cv) ≦ 7%, uniform gap control. Abundant particle size lineup from 2μm to 600μm. Product
Information
Microsphere [Micropearl™ AU]
Plastic core Metal coating Particles		 Available to coat evenly with different type of metals onto plastic particles. Our technology can control hardness of particles and repulsive force. Product
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Microsphere [Micropearl™ EX]
Particles with high size accuracy		 Uniform partical size distributions that are able to maintain tighter particle size control. Excellent voltage, heat and chemical resistance. Product
Information
Microsphere [Micropearl™ EXH]
Hard plastic material uniformed resin particles for gap control		 Compared to silica particles, this particles are stable with sizes reduction and damage to the substrate. High hardness prevent settlement in the resin caused by heat. Product
Information
Microsphere [Micropearl™ EZ]
Low recovery rate and soft resin particles for gap control		 It is an acrylic co-polymer particle that is very soft and it can absorb vibration and noise. Also it reduces the damage to the substrate. Due to the lower spring back (recovery rate) of the particle, it can be used for softer substrates. Product
Information
Microsphere [Micropearl™ KB]
black uniform resin Particles for gap control		 Divinylbenzene co-polymer particles with black pigment dispersed. Excellent blackness and light shielding properties, and resistance to exudative. Product
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2 UV Curing Adhesive Sealant for ODF
[Photolec™ S]		 UV + heat curing adhesive with high adhesive strength and low moisture permeability. Black type with high light shielding is also available. Product
Information
UV Curing Adhesive UV-curing adhesives
[Photolec™ A]		 A highly transparent and excellent UV curing adhesive even under oxygen environment. Few impurities, halogen-free. Product
Information
UV Curing Adhesive UV delayed curing Low moisture permeable adhesive
[Photolec™ E]		 After UV irradiation, post-curing type and immediate curing type are available. Low outgas, low moisture permeability. Product
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UV Curing Adhesive UV (B stage) + Moisture Curing Adhesive
[Photolec™ B]		 Easy workability (corresponding to curved surfaces and fine lines), curing light shielding parts, high adhesion of different materials, stress relaxation (flexibility after curing, thickness retention). Product
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3 UV Curing Adhesive LED encapsulation material & UTG protective resin
[Photolec™ New]		 UV-curable μLED chip protection resin with inkjet applicability & Greatly improves pen drop resistance simply by coating. Product
Information
4 Tape Double-faced Adhesive Tape for Fixing of LCD Components
[3800 Series]		 PET-based double-sided tape with high adhesion performance to various adherends. Product
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5 Tape Conductive Tape
[7800 series]		 Adhesive tape with excellent conductivity, heat dissipation, adhesive strength, bending resistance, and thinness. Suitable for grounding/shielding/heat dissipation of electronic devices. Product
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6 Tape Protective Tape for Optical Use
[6700/6800/6900Series]		 Strong adhesive protection tape that can adhere to various shaped surfaces including brightness enhancement film (BEF). Features minimal contamination of the adherend, such as tape residue. Product
Information
7 Release Film Release Film for Heat Press Process
[Low Outgas Release Film]		 Release film exhibiting excellent heat resistance, flexibility, and low-contamination properties. Suitable for surface protection and buffering in heat press processes for manufacturing FPCs, semiconductor molds, next-generation displays etc. Product
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8 Heat Release Related Products 1-Part Heat-Curable Grease
[Adhesive thermal conductive grease]		 High heat conduction, good molding properties. Excellent flexibility and applicable to flexible substrates. Product
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9 Molded Product Electrical Connection, Holder Integrated Connector
[Microphone Holder Connector]		 Holder and connector are integrated. Easy assembly and solderless connection. Product
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Molded Product Rubber Connector for Electrical Connection and Grounding (Adhesive Fixing)
[Adhesive (PSA) Dot Connector]		 Rubber connector with integrated insulating and conductive parts. Easy mounting due to adhesiveness (PSA: Pressure-Sensitive-Adhesive). Product
Information
Molded Product Rubber Connector for Electrical Connection and Grounding (Solder Mounting)
[Board Mount (SMT) Dot Connector]		 Rubber connector with integrated insulating and conductive parts, mounted by reflow. Easy mounting due to adhesiveness (SMT: Surface-Mount-Technology). Product
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Molded Product Electrical Connection, Flexible Rubber Connector
[Waterproof and Resin Integrated]		 Rubber connector that can integrate the insulating part and the conductive part. Flexibility that allows flexible design (complex shape, protruding conductive parts). Product
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