Glossary

A～E

ACF

A conductive film that is formed by mixing conductive particles into a thermosetting resin and molding it into a film. ACF is used by placing it between the printed circuit board and the electrode and applying heat and pressure to bond it with a heater or similar devices. After bonding, anisotropic electrical conductivity is formed, allowing electricity to pass in the vertical direction while maintaining insulation in the horizontal direction.
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ACP

A material with conductive particles uniformly dispersed in a highly insulating adhesive component. It is designed to electrically connect the electrodes of electronic components, maintain insulation between adjacent electrodes, and provide adhesive fixation, all of which can be achieved simultaneously only through thermocompression bonding.
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ADAS

Functions that support the driver’s driving. Many systems have been developed to assist the driver's "perception," "judgment," or "control" to minimize human error and reduce traffic accidents. In the six levels of autonomous driving, ranging from 0 to 5, ADAS corresponds to "Level 1: driver assistance" or "Level 2: partial driving automation. "Both of them are different from "Level 5: full driving automation" in that the driver him/herself conducts the driving control.
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AR

Technology that virtually extends the real environment by adding virtual visual information to real-world information. VR is a technology that provides experiences close to reality in a virtual world (virtual reality), while AR recognizes information from the real world and overlays it with new images or text information. Initially used on PCs, the technology has advanced and is now utilized in smartphones and AR smart glasses. Recently, AR technology has also been applied in the field of entertainment.
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BGA

A type of IC chip packaging method. The electrodes pins do not protrude around the package, making it ideal for product miniaturization. It uses a grid layout for the external connection terminals on the ball-shaped terminals, with solder balls used for the ball-shaped terminals. The pin-type version is called PGA (Pin Grid Array).
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B-stage

The B-stage of an adhesive refers to the state in which the adhesive is partially cured. At this stage, it is not yet fully cured and can be further cured (C-stage) by heating. On the other hand, the A-stage refers to the initial stage where the adhesive is in a liquid state and not yet cured. The B-stage is the partially cured state following the A-stage.
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BU film

BU film is used as an insulating material for semiconductor package substrates that connect semiconductor chips to motherboards and is used for forming fine wiring. As electronic devices require finer wiring and faster communication, this film needs to minimize transmission loss. Additionally, as devices become thinner, it also needs to prevent the warping of the thinned substrates.
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CMOS Image Sensor

A CMOS image sensor is a sensor that converts light into electrical signals to create images, serving as the "eye" of a camera. CMOS sensors integrate photodiodes for receiving light and circuits for signal processing. They are widely used in digital cameras, smartphone cameras, and image scanners. Compared to CCDs (Charge-Coupled Devices), CMOS sensors offer a simpler structure, lower manufacturing costs, and lower power consumption. Additionally, their faster readout speed enable high-speed continuous shooting.
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CMP

A technology for polishing and planarizing the wafer surface in semiconductor manufacturing processes. It achieves planarization by combining the chemical action of abrasives (Chemical), the mechanical action of grinding stones (Mechanical), and the removal of the surface irregularities of the wafer using polishing pads and specialized equipment (Polishing).
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Dam & Fill Method

An insulating material used to form sharp dams on substrate islands for chip mounting or around the periphery of mounted CSP/BGA packages. Its purpose is to control the flow of die attach paste during chip bonding and manage the filling area for underfill. This material has excellent moldability and is a high-reliability solution for reducing package warpage.
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F～J

FC-BGA

FC-BGA is a high-density semiconductor package substrate for high-speed LSI (Large Scale Integration) devices that uses ball-shaped terminals known as bumps to attach and encapsulate a chip on an ultra-thin substrate. It offers fast data processing capabilities and excellent heat dissipation, and is commonly used in computers, servers, and networking equipment.
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Filler

A filler is a material that is used to fill in space or cavity, referring to small particles or powders added to materials. By compounding fillers with various functions, such as thermal and electrical conductivity, into resins, the filler-composite materials surpasses the functionality of the resin alone. The materials are used in a wide range of applications, from smartphone to airplanes, for their heat resistance and high strength.
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Fluororesin

Fluoropolymer is a high-molecular-weight synthetic resin with fluorine atoms in its molecular chain. It has high thermal resistance, chemical resistance, and low friction properties. A typical example is PTFE (Polytetrafluoroethylene). It is also a promising material for substrates used in high-frequency circuits for 5G and future 6G applications.
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Foam

Foam is a porous material with air bubbles dispersed in plastic. The term "foam" signifies "bubbles." Plastic tends to conjure up images of something hard, but foam is soft because it contains more air, and it absorbs shocks greatly. Additionally, it has many properties such as water resistance, soundproofing, thermal insulation, high strength and durability, chemical resistance, and oil resistance. With these properties, it is suitable for use in insulation materials, packaging materials, and protective gears.
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Foam Tape

Foam tape is a type of flexible and impact-resistant adhesive tape, which, as the name suggests, is a single-sided or double-sided tape with foam as the base material. In the electronics field, it is used for securing components and serving as a cushioning material to protect devices from impacts. In addition, due to its adhesion and flexibility, it can firmly adhere to irregular shapes and rough surfaces. These characteristics make foam tape highly reliable for various applications in the manufacturing of electronic devices.
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FPC

A substrate in which conductive metals such as copper foil are laminated to a base film like polyimide to form electrical circuits. It is also called as a "Flexible Printed Circuit (FPC) board," it is extremely thin and lightweight. Unlike rigid substrates, it is also highly flexible and bendable, making it suitable for use in bending parts, three-dimensional configurations, and slight gaps in electronic equipment. With an increasing demand for smaller, lighter, and thinner devices, FPCs are used in a wide range of electronic devices such as smartphones and LCD televisions.
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HBM

High Bandwidth Memory (HBM) is a memory standard defined by JEDEC that uses Through-Silicon Via (TSV) technology for die stacking. HBM is a type of DRAM (Dynamic Random Access Memory) designed to transfer large amounts of data at once, offering 10 to 100 times the data transfer speed compared to traditional DRAM used in PCs. It is utilized in applications such as GPUs (Graphics Processing Units), HPC (High-Performance Computing), and AI (Artificial Intelligence) for tasks like image processing and machine learning due to its high data transfer rates.
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Interlayer Insulation

An interlayer dielectric material is a specialized material used in electronic devices and semiconductors to prevent electrical interference between different layers. This material serves to prevent interference between various parts within an electronic circuit from interfering with each other, thus ensuring the device's performance. Additionally, it can conduct heat efficiently, contributing to the cooling of the device. For example, in semiconductor manufacturing, The material is used to separate multiple conductive layers and semiconductor layers, thereby preventing electrical shorts (short circuits).
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Polarized Reflection

Polarized reflection is a phenomenon where only light with a specific polarization state is reflected from a surface when it hits the surface at a particular angle. This is observed when light hits non-metallic surfaces such as glass or water at a particular angle called the Brewster angle. Polarized reflection is used in applications such as polarized sunglasses and camera polarizing filters to reduce glare and improve visual clarity.
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Specular Reflection

Specular reflection is the phenomenon where the angle of incidence and the angle of reflection are equal when light strikes a smooth surface. This is often observed when light hit shiny surfaces such as mirrors or glass. It is also known as mirror reflection. In specular reflection, light is reflected in a specific direction, and the reflected light is concentrated in one clear direction.
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TIM

TIM (Thermal Interface Material) is a type of thermal conductive material designed to efficiently transfer heat from electronic devices to cooling systems. By providing effective thermal management, TIM ensures that semiconductor devices operate reliably and perform optimally.
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U～Z

Underfill

A liquid thermoset resin used for encapsulating integrated circuits. It acts as an adhesive to protect solder joints,
which connect electronic components to printed circuit boards, from cracking due to impacts or heat. Underfill is required to have properties such as impact resistance and reworkability.
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UTG Glass

Ultra-Thin Glass (UTG) refers to glass with an exceptionally thin thickness of less than 0.1 mm. Its extreme thinness makes it very lightweight and flexible, allowing it to be used in flexible designs such as foldable smartphone screens and wearable device displays. Despite its advantageous properties, UTG glass is relatively fragile and can easily crack under repeated bending. To address this issue, various methods, including surface coating techniques, are being investigated to enhance its durability.
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Wafer

A wafer is a material used in semiconductor device manufacturing. It is a disk-shaped substrate made by thinly slicing a cylindrical ingot made of a material such as highly controlled, single-crystal silicon.
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Other

5G、6G

5G is an evolution of 4G technology, offering advanced features such as ultra-fast speeds, low latency, high capacity, support for a massive number of connected devices, and high reliability. With speeds that are about 100 times faster than 4G, 5G can achieve up to 10 gigabits per second (Gbps).
5G operates in the millimeter-wave spectrum, specifically the 26-28 GHz and 38-42 GHz frequency bands. These millimeter waves are highly directional and have difficulty penetrating obstacles like high-rise buildings, leading to potential communication issues. To address this problem, film antennas that reflect signals to deliver them indoors are being explored as a solution.
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