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Material
Category
Product Feature
1 Microsphere [Micropearl SP/GS]
Uniform resin particles
Uniform particle size distribution, coefficient of variation (Cv) ≦ 7%, uniform gap control. Abundant particle size lineup from 2μm to 600μm. Product
Information
Microsphere [Micropearl AU]
Plastic core Metal coating Particles
Available to coat evenly with different type of metals onto plastic particles. Our technology can control hardness of particles and repulsive force. Product
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Microsphere [Micropearl EX]
Particles with high size accuracy
Uniform partical size distributions that are able to maintain tighter particle size control. Excellent voltage, heat and chemical resistance. Product
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Microsphere [Micropearl EXH]
Hard plastic material uniformed resin particles for gap control
Compared to silica particles, this particles are stable with sizes reduction and damage to the substrate. High hardness prevent settlement in the resin caused by heat. Product
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Microsphere [Micropearl EZ]
Low recovery rate and soft resin particles for gap control
It is an acrylic co-polymer particle that is very soft and it can absorb vibration and noise. Also it reduces the damage to the substrate. Due to the lower spring back (recovery rate) of the particle, it can be used for softer substrates. Product
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Microsphere [Micropearl KB]
black uniform resin Particles for gap control
Divinylbenzene co-polymer particles with black pigment dispersed. Excellent blackness and light shielding properties, and resistance to exudative. Product
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2 Microsphere/UV Curing Adhesive GAP control adhesive containing uniform particles Thermosetting adhesive containing ultra high precision spacer particles. The thickness of the adhesive can be precisely controlled. Product
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3 UV Curing Adhesive Sealant for ODF
[Photolec S]
UV + heat curing adhesive with high adhesive strength and low moisture permeability. Black type with high light shielding is also available. Product
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UV Curing Adhesive UV-curing adhesives
[Photolec A]
A highly transparent and excellent UV curing adhesive even under oxygen environment. Few impurities, halogen-free. Product
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UV Curing Adhesive UV delayed curing Low moisture permeable adhesive
[Photolec E]
After UV irradiation, post-curing type and immediate curing type are available. Low outgas, low moisture permeability. Product
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UV Curing Adhesive UV (B stage) + Moisture Curing Adhesive
[Photolec B]
Easy workability (corresponding to curved surfaces and fine lines), curing light shielding parts, high adhesion of different materials, stress relaxation (flexibility after curing, thickness retention). Product
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4 Foam Tape Functional Foam Tape
[5200 Series]
Combination of foam and adhesive with excellent stress relaxation. High impact resistance, high step followability (waterproof, dustproof), high adhesive reliability. Product
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5 Release Film Low Outgas Release Film Release film with low outgassing and excellent embedding property in high temperature heat press process at around 190℃. Suitable for manufacturing process of FPC, rigid flexible circuit board, etc. Product
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6 Heat Release Related Products Thermal conductive insulating sheet
[Insulated Metal Substrate 「NF-type」]
A heat release material with excellent heat dissipation and insulation properties. Excellent heat resistance, high adhesion, and high reliability. Product
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Heat Release Related Products 1-Part Heat-Curable Grease
[Adhesive thermal conductive grease]
High heat conduction, good molding properties. Excellent flexibility and applicable to flexible substrates. Product
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Heat Release Related Products 2-Part Thermal Conductive Gap Filler
[CGW®Series]
Room temperature curing type two-liquid silicone grease, solventless type, high thixotropy. Product
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Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT Insulation Series]
Low siloxane silicone sheet type. Temperature durability, electrical insulation, high heat conductivity. Product
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Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT Soft Series]
Super flexible sheet type. High followability to irregular surface, high cushioning. Product
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Heat Release Related Products Super Thermal-Conductive Pads
[MANION Series]
A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Product
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Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT High Thermal Conductive Series]
A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Available in various hardness and thickness. Product
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7 Foam Waterproof, Anti-vibration, Shock Absorbing Thin Foam
[XLIM]
Ultra-thin, high-performance foam that combines high sealing properties and high shock absorption. Product
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8 Molded Product Electrical Connection, Holder Integrated Connector
[Microphone Holder Connector]
Holder and connector are integrated. Easy assembly and solderless connection. Product
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Molded Product Rubber Connector for Electrical Connection and Grounding (Adhesive Fixing)
[Adhesive (PSA) Dot Connector]
Rubber connector with integrated insulating and conductive parts. Easy mounting due to adhesiveness (PSA: Pressure-Sensitive-Adhesive). Product
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Molded Product Rubber Connector for Electrical Connection and Grounding (Solder Mounting)
[Board Mount (SMT) Dot Connector]
Rubber connector with integrated insulating and conductive parts, mounted by reflow. Easy mounting due to adhesiveness (SMT: Surface-Mount-Technology). Product
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Molded Product Electrical Connection, Flexible Rubber Connector
[Waterproof and Resin Integrated]
Rubber connector that can integrate the insulating part and the conductive part. Flexibility that allows flexible design (complex shape, protruding conductive parts). Product
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9 Polyvinyl Acetal Resin Binder Resin
[S-LEC B, K]
Tough, high flexibility, high adhesiveness, crosslinkability, compatibility. Easy to dissolve in various solvents including alcohol. Product
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Polyvinyl Acetal Resin Paste Resin
[S-LEC SV]
Excellent rheological properties, high adhesion, high sheet strength, high flexibility. Product
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