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Adhesive・Grease

… Sustainability Products

Material
Category
Product Feature Adherent body Curing conditions
Microsphere/
UV Curing Adhesive
GAP control adhesive containing uniform particles Thermosetting adhesive containing ultra high precision spacer particles. The thickness of the adhesive can be precisely controlled. Ferrite core, Iron, SUS 150℃ × 30min or more Product
Information
UV Curing Adhesive Sealant for ODF
[Photolec S]
UV + heat curing adhesive with high adhesive strength and low moisture permeability. Black type with high light shielding is also available. Glass, Polyimide UV (3,000mJ / cm2) + Heat (120℃ × 60min) Product
Information
UV Curing Adhesive UV-curing adhesives
[Photolec A]
A highly transparent and excellent UV curing adhesive even under oxygen environment. Few impurities, halogen-free. Glass 1,500mJ / cm2 or more Product
Information
UV Curing Adhesive UV delayed curing Low moisture permeable adhesive
[Photolec E]
After UV irradiation, post-curing type and immediate curing type are available. Low outgas, low moisture permeability. Alkali free glass UV delay + heat (UV 1,500mJ / cm2 + 60~100℃ × 30min) Product
Information
UV Curing Adhesive UV (B stage) + Moisture Curing Adhesive
[Photolec B]
Easy workability (corresponding to curved surfaces and fine lines), curing light shielding parts, high adhesion of different materials, stress relaxation (flexibility after curing, thickness retention). Glass, Plastic, AL, SUS UV + Moisture Product
Information
UV Curing Adhesive LED encapsulation material & UTG protective resin
[Photolec New]
UV-curable μLED chip protection resin with inkjet applicability & Greatly improves pen drop resistance simply by coating. Glass UV, UV + Heat Product
Information
Assembly Material Solder Anisotropic Conductive Paste Metal joining is possible at low temperature and low pressure. Low profile connection (less than 0. 1mm thickness), fine pitch connection (150um). PI, RF4 140℃ / 10s / Pressure 1 to 3 Mpa Product
Information
UV Curing Adhesive/
Assembly Material
Anisotropic Conductive Paste For RFID low temperture/short time curing for chip assembly in RFID inlay production. PET 140℃10sec.
170℃3sec.
Product
Information
Heat Release Related Products 1-Part Heat-Curable Grease
[Adhesive thermal conductive grease]
High heat conduction, good molding properties. Excellent flexibility and applicable to flexible substrates. Product
Information
Inkjet Materials Ink for Coating/Adhesive Applications
[High Resolution 3D Printer (Inkjet) Material]
Printing size control ability in drop-on-demand. Product
Information
Heat Release Related Products 1-Part Silicone-free Thermal Conductive Grease
[GA Series]
Grease Type, Silicone Free. Product
Information
Heat Release Related Products 2-Part Thermal Conductive Gap Filler
[CGW®Series]
Room temperature curing type two-liquid silicone grease, solventless type, high thixotropy. Product
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Tape

Material
Category
Product Feature
Foam Tape Functional Foam Tape
[5200 Series]
Combination of foam and adhesive with excellent stress relaxation. High impact resistance, high step followability (waterproof, dustproof), high adhesive reliability. Product
Information
Foam Tape Flexible Foam Tape Foam substrate double-coated adhesive tape for fixing components that enables device recycling through reworkability. Suitable for fixing display panel and chassis. Product
Information
Tape Double-faced Adhesive Tape for Fixing of LCD Components
[3800 Series]
PET-based double-sided tape with high adhesion performance to various adherends. Product
Information
Tape Double-faced Tape for Fixing Polishing Pads for LCD Glass Substrate, CMP, and HDD Substrate Highly chemical-resistant tape with no adhesive residue when peeled off. Used for fixing polishing pad in the polishing process for electronic devices. Max. width 2450mm, suitable for CMP process. Product
Information
Tape Conductive Tape
[7800 series]
Adhesive tape with excellent conductivity, heat dissipation, adhesive strength, bending resistance, and thinness. Suitable for grounding/shielding/heat dissipation of electronic devices. Product
Information
Tape Protective Tape for Optical Use
[6700/6800/6900Series]
Strong adhesive protection tape that can adhere to various shaped surfaces including brightness enhancement film (BEF). Features minimal contamination of the adherend, such as tape residue. Product
Information
Removable UV Tape High Heat Resistance, High Adhesion, Easy Removable UV Tape for Semiconductor Process
[SELFA HS]
UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Protects device surfaces and suppresses warpage in various PKG manufacturing processes. Product
Information
Removable UV Tape Double-Sided Heat-Resistant, High-adhesion, Easy-Release UV Tape for Wafer Support Systems
[SELFA HW]
UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Glass support system maintains device flatness during the process and ensures safe handling. Product
Information
Removable UV Tape Self-releasable Protective Tape in UBM Process
[SELFA-MP]
UV release tape that combines strong chemical resistance and low residue; UV irradiation causes gas generation, which reduces device damage and allows easy peeling. Product
Information
Tape Photo mask protection film
[TACKWELL]
Highly durable, chemical-resistant tape with excellent optical properties produced in a clean environment, suitable as protective tape for photomasks used in PCB production. Product
Information
Tape/Film Masking tape for semiconductor package substrates Tape with excellent adhesion, optical properties and easy peeling, produced in a clean environment. Suitable as a protective tape for solder resist on package substrates. Product
Information
Tape Double-sided tape for fluorine-containing resins adhesion(Developments) Double-coated adhesive tape with a proprietary compound developed based on secretions produced by mussels, which enables strong adhesion to fluorine and polyolefin resins and other hard-to-bond substrates. Product
Information

Sheet

Material
Category
Product Feature
Foam Waterproof, Anti-vibration, Shock Absorbing Thin Foam
[XLIM]
Ultra-thin, high-performance foam that combines high sealing properties and high shock absorption. Product
Information
Heat Release Related Products Thermal conductive insulating sheet
[Insulated Metal Substrate 「NF-type」]
A heat release material with excellent heat dissipation and insulation properties. Excellent heat resistance, high adhesion, and high reliability. Product
Information
Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT Insulation Series]
Low siloxane silicone sheet type. Temperature durability, electrical insulation, high heat conductivity. Product
Information
Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT Soft Series]
Super flexible sheet type. High followability to irregular surface, high cushioning. Product
Information
Heat Release Related Products Super Thermal-Conductive Pads
[MANION Series]
A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Product
Information
Heat Release Related Products Thermal-Conductive Pads
[TIMLIGHT High Thermal Conductive Series]
A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Available in various hardness and thickness. Product
Information