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Adhesive・Grease

… Sustainability Products

Material Category	Product	Feature	Adherent body	Curing conditions
Microsphere/ UV Curing Adhesive	GAP control adhesive containing uniform particles	Thermosetting adhesive containing ultra high precision spacer particles. The thickness of the adhesive can be precisely controlled.	Ferrite core, Iron, SUS	150℃ × 30min or more	Product Information
UV Curing Adhesive	Sealant for ODF [Photolec S]	UV + heat curing adhesive with high adhesive strength and low moisture permeability. Black type with high light shielding is also available.	Glass, Polyimide	UV (3,000mJ / cm2) + Heat (120℃ × 60min)	Product Information
UV Curing Adhesive	UV-curing adhesives [Photolec A]	A highly transparent and excellent UV curing adhesive even under oxygen environment. Few impurities, halogen-free.	Glass	1,500mJ / cm2 or more	Product Information
UV Curing Adhesive	UV delayed curing Low moisture permeable adhesive [Photolec E]	After UV irradiation, post-curing type and immediate curing type are available. Low outgas, low moisture permeability.	Alkali free glass	UV delay + heat (UV 1,500mJ / cm2 + 60～100℃ × 30min)	Product Information
UV Curing Adhesive	UV (B stage) + Moisture Curing Adhesive [Photolec B]	Easy workability (corresponding to curved surfaces and fine lines), curing light shielding parts, high adhesion of different materials, stress relaxation (flexibility after curing, thickness retention).	Glass, Plastic, AL, SUS	UV + Moisture	Product Information
UV Curing Adhesive	LED encapsulation material & UTG protective resin [Photolec New]	UV-curable μLED chip protection resin with inkjet applicability & Greatly improves pen drop resistance simply by coating.	Glass	UV, UV + Heat	Product Information
Assembly Material	Solder Anisotropic Conductive Paste	Metal joining is possible at low temperature and low pressure. Low profile connection (less than 0. 1mm thickness), fine pitch connection (150um).	PI, RF4	140℃ / 10s / Pressure 1 to 3 Mpa	Product Information
UV Curing Adhesive/ Assembly Material	Anisotropic Conductive Paste For RFID	low temperture/short time curing for chip assembly in RFID inlay production.	PET	140℃10sec. 170℃3sec.	Product Information
Heat Release Related Products	1-Part Heat-Curable Grease [Adhesive thermal conductive grease]	High heat conduction, good molding properties. Excellent flexibility and applicable to flexible substrates.	―	―	Product Information
Inkjet Materials	Pattern formation of exterior peripheries/Usage for package miniaturization [High-viscosity inkjet ink]	Proprietary high-functionality materials, designed uniquely from adhesives to barrier rid forming materials. Freely controllable ink application shapes. Optimizing printing processes with our one-stop development.	―	―	Product Information
Heat Release Related Products	1-Part Silicone-free Thermal Conductive Grease [GA Series]	Grease Type, Silicone Free.	―	―	Product Information
Heat Release Related Products	2-Part Thermal Conductive Gap Filler [CGW®Series]	Room temperature curing type two-liquid silicone grease, solventless type, high thixotropy.	―	―	Product Information

Tape

Material Category	Product	Feature
Foam Tape	Functional Foam Tape [5200 Series]	Combination of foam and adhesive with excellent stress relaxation. High impact resistance, high step followability (waterproof, dustproof), high adhesive reliability.	Product Information
Foam Tape	Flexible Foam Tape	Foam substrate double-coated adhesive tape for fixing components that enables device recycling through reworkability. Suitable for fixing display panel and chassis.	Product Information
Tape	Double-faced Adhesive Tape for Fixing of LCD Components [3800 Series]	PET-based double-sided tape with high adhesion performance to various adherends.	Product Information
Tape	Double-faced Tape for Fixing Polishing Pads for LCD Glass Substrate, CMP, and HDD Substrate	Highly chemical-resistant tape with no adhesive residue when peeled off. Used for fixing polishing pad in the polishing process for electronic devices. Max. width 2450mm, suitable for CMP process.	Product Information
Tape	Conductive Tape [7800 series]	Adhesive tape with excellent conductivity, heat dissipation, adhesive strength, bending resistance, and thinness. Suitable for grounding/shielding/heat dissipation of electronic devices.	Product Information
Tape	Protective Tape for Optical Use [6700/6800/6900Series]	Strong adhesive protection tape that can adhere to various shaped surfaces including brightness enhancement film (BEF). Features minimal contamination of the adherend, such as tape residue.	Product Information
Removable UV Tape	Single-sided Heat Resistance UV Tape [SELFA™ HS]	UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Protects device surfaces and suppresses warpage in various PKG manufacturing processes.	Product Information
Removable UV Tape	Double-sided Heat Resistance UV Tape [SELFA™ HW]	UV release tape that combines resistance to various semiconductor manufacturing processes with low residue. Glass support system maintains device flatness during the process and ensures safe handling.	Product Information
Removable UV Tape	Single-sided Chemical-resistant Self-releasable UV Tape [SELFA™ MP]	UV release tape that combines strong chemical resistance and low residue; UV irradiation causes gas generation, which reduces device damage and allows easy peeling.	Product Information
Tape	Photo mask protection film [TACKWELL]	Highly durable, chemical-resistant tape with excellent optical properties produced in a clean environment, suitable as protective tape for photomasks used in PCB production.	Product Information
Tape/Film	Masking tape for semiconductor package substrates	Tape with excellent adhesion, optical properties and easy peeling, produced in a clean environment. Suitable as a protective tape for solder resist on package substrates.	Product Information
Tape	Double-sided tape for fluorine-containing resins adhesion(Developments)	Double-coated adhesive tape with a proprietary compound developed based on secretions produced by mussels, which enables strong adhesion to fluorine and polyolefin resins and other hard-to-bond substrates.	Product Information

Sheet

Material Category	Product	Feature
Foam	Waterproof, Anti-vibration, Shock Absorbing Thin Foam [XLIM]	Ultra-thin, high-performance foam that combines high sealing properties and high shock absorption.	Product Information
Heat Release Related Products	Thermal conductive insulating sheet [Insulated Metal Substrate 「NF-type」]	A heat release material with excellent heat dissipation and insulation properties. Excellent heat resistance, high adhesion, and high reliability.	Product Information
Heat Release Related Products	Thermal-Conductive Pads [TIMLIGHT Insulation Series]	Low siloxane silicone sheet type. Temperature durability, electrical insulation, high heat conductivity.	Product Information
Heat Release Related Products	Thermal-Conductive Pads [TIMLIGHT Soft Series]	Super flexible sheet type. High followability to irregular surface, high cushioning.	Product Information
Heat Release Related Products	Super Thermal-Conductive Pads [MANION Series]	A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology.	Product Information
Heat Release Related Products	Thermal-Conductive Pads [TIMLIGHT High Thermal Conductive Series]	A heat conductive sheet achieves both flexibility and adhesion by the high thermal conductivity of carbon fiber which uses magnetic field orientation technology. Available in various hardness and thickness.	Product Information